A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.

An electronic circuit may include an elastomeric substrate with an electronic die attached to the elastomer substrate at a first substrate area and one or more meander traces electrically coupled to the electronic die and encapsulated in the elastomer substrate at a second substrate area that is adjacent to the first substrate area. An inelastic, non-electronic, structural brace may be attached to the elastomeric substrate in the first substrate area.

An electronic device assembly includes a backplane having a glass composition substantially free of alkali ions, an elastic modulus of about 40 GPa to about 100 GPa, and a final thickness from about 20 μm to about 100 μm. The primary surfaces of the backplane are characterized by a prior material removal to the final thickness from an initial thickness that is at least 20 μm greater than the final thickness. The assembly also includes a protect layer on the first primary surface of the backplane; and a plurality of electronic components on the second primary surface of the backplane. In addition, the backplane is configured with at least one static bend having a bend radius between about 25 mm and about 5 mm. The electronic components of the electronic device assembly can include at least one thin film transistor (TFT) element or organic light emitting diode (OLED) element.

A circuit board is described which includes a layer composite with at least one dielectric layer which includes a planar extension in parallel with respect to an xy-plane which is spanned by an x-axis and a y-axis perpendicular thereto, and which includes a layer thickness along a z-axis which is perpendicular with respect to the x-axis and to the y-axis; and at least one metallic layer which is attached to the dielectric layer in a planar manner. The layer composite along the z-axis is free from a symmetry plane which is oriented in parallel with respect to the xy-plane, and the dielectric layer includes a dielectric material which has an elastic modulus E in a range between 1 and 20 GPa and along the x-axis and along the y-axis a coefficient of thermal expansion in a range between 0 and 17 ppm/K. A method of manufacturing such a circuit board is also described. Further, a method of manufacturing a circuit board structure comprising two asymmetric circuit boards and a method of manufacturing two processed asymmetric circuit boards from a larger circuit board structure is described.

A circuit board and a method of manufacturing a circuit board or two circuit boards are illustrated and described. The circuit board includes (a) a dielectric layer with a planar extension in parallel with respect to an xy-plane which is spanned by an x-axis and a y-axis perpendicular thereto and a layer thickness along a z-direction which is perpendicular with respect to the x-axis and to the y-axis; (b) a metallic layer which is attached to the dielectric layer in a planar manner; and (c) a component which is embedded in the dielectric layer and/or in a dielectric core-layer of the circuit board. The dielectric layer includes a dielectric material which has (i) an elastic modulus E in a range between 1 and 20 GPa and (ii) a coefficient of thermal expansion in a range between 0 and 17 ppm/K along the x-axis and along the y-axis.

The invention is directed to an electronic device comprising a first functional body, a second functional body, and at least one serpentine interconnect connecting the first functional body to the second functional body, wherein the serpentine interconnect is suspended in air to allow for stretching, flexing or compression.

An electronic device stretchable from a first state to a second state includes a substrate, a plurality of light emitting groups, and a plurality of signal pads. The substrate has a first region and a second region. The light emitting groups are disposed on the first region. The signal pads are disposed on the second region. When the electronic device is stretched from the first state to the second state, the first region has a first stretching ratio (R1) and the second region has a second stretching ratio (R2), and R1 is greater than R2.

A processing method of a flexible hybrid electronic system is provided and includes the following steps: etching out embedded grooves on a front surface of a silicon-based substrate embedding a plurality of heterogeneous chips into corresponding embedded grooves, wherein front surfaces of the embedded chips are flush with the front surface of the silicon-based substrate; then gradually realize the polymer flexible connection, electrical interconnection, insulation protection, and polymer flexible coverage between chips. The processing method processes the flexible hybrid electronic system based on the method of embedding chips, which can reduce material loss and processing steps, and is beneficial to realizing large-scale manufacturing.

The electronic module has a three-dimensional frame, a printed circuit board and a plurality of electronic devices. The printed circuit board is fixed to the three-dimensional frame and has a plurality of support portions which extend transversely to each other in space. The electronic devices are fixed to the printed circuit board and are operatively coupled to each other. The electronic devices are arranged on at least one support portion of the printed circuit board.

A flexible sensor unit is embedded in a tire. The flexible sensor unit includes a plurality of individual circuit boards. Each circuit board includes at least one electronic component. The at least one electronic component includes a radio frequency identification integrated circuit, a microcontroller unit, at least one sensor, a power source and a boost converter. Each one of a plurality of electrically conductive flexible connecting ribbons extends between the circuit boards. An end ribbon is electrically connected to at least one of the circuit boards. An antenna is disposed on the end ribbon. The antenna transmits data from the at least one sensor, as processed by the microcontroller unit, and identification data from the radio frequency identification integrated circuit, to an external reader.