Provided is packages and method of fabricating the same. The package includes a first die, a second die, and an inductor. The second die is bonded to the first die through a bonding structure thereof. The inductor is located in the bonding structure. The inductor includes a spiral pattern parallel to top surfaces of the first die and the second die, and the spiral pattern includes at least a turn.

A substrate has an upper main surface and a lower main surface arranged in an up-down direction. A metal member includes a plate-shaped portion provided on an upper main surface of a substrate, the plate-shaped portion having a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. The sealing resin layer is provided on the upper main surface of the substrate, covers the metal member, the first electronic component, and the second electronic component, and has an upper surface. The shield is provided on the upper surface of the sealing resin layer so as to be connected to the upper end of the plate-shaped portion. The plate-shaped portion is inclined with respect to the up-down direction such that an upper end of the plate-shaped portion is located in front of a lower end of the plate-shaped portion.

The present invention provides a packaging structure and a manufacturing method thereof. The packaging structure includes: a lower package, an upper package disposed above the lower package, and a first redistribution stack layer that is disposed between the lower package and the upper package and is electrically connected to the lower package and the upper package. The lower package includes a first prefabricated redistribution stack layer and a first plastic packaging layer surrounding the first prefabricated redistribution stack layer. A minimum line width and line spacing of at least one first prefabricated conductive layer in the first prefabricated redistribution stack layer is less than a minimum line width and line spacing of at least one first conductive layer in the first redistribution stack layer.

An electronic device includes a substrate, an upper conductive layer, and a lower conductive layer. The substrate has a plurality of inner vias and has an upper surface and a lower surface. The upper conductive layer includes an upper ground trace and an upper signal pad disposed on the upper surface. The upper ground trace is electrically connected to the ground vias and has an upper hollow portion exposing a part of the upper surface. The upper signal pad is disposed on the part of the upper surface exposed by the upper hollow portion and electrically connected to the signal via. The lower conductive layer includes a lower ground trace and a lower signal pad disposed on the lower surface. The lower conductive trace is electrically connected to the ground vias and has a lower hollow portion exposing a part of the lower surface. The lower signal pad is disposed on the part of the lower surface exposed by the lower hollow portion and electrically connected to the signal via.

Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a substrate having a first surface and an opposing second surface, the second surface having a cavity; a first die at least partially nested in the cavity; an insulating material on the second surface of the substrate, the insulating material having a first surface and an opposing second surface, wherein the first surface of the insulating material is at the second surface of the substrate; a planar inductor embedded in the insulating material, the planar inductor including a thin film at least partially surrounding a conductive trace; and a second die, at the second surface of the insulating material, electrically coupled to the first die.

A power module may include a first bus bar having a first plurality of tabs, wherein each of the first plurality of tabs is electrically coupled to a respective conductive trace of a plurality of conductive traces disposed on a first side; a second bus bar having a second plurality of tabs, wherein each of the second plurality of tabs is electrically coupled to a respective conductive trace of a plurality of conductive traces disposed on a second side; and a third bus bar having a third plurality of tabs, wherein at least one tab of the third plurality of tabs is electrically coupled to a respective conductive trace of the plurality of conductive traces disposed on the first side and at least one tab of the third plurality of tabs is electrically coupled to a respective conductive trace of the plurality of conductive traces disposed on the second side.

An apparatus is provided which comprises: a plurality of plated through holes; a material with magnetic properties adjacent to the plurality of plated through holes; and one or more conductors orthogonal to a length of the plurality of plated through holes, the one or more conductors to couple one plated through hole of the plurality with another plated through hole of the plurality such that an inductor is formed.

A three-dimensional (3D) inductor structure comprising: a first semiconductor die including: a first conductive pattern; and a second conductive pattern spaced apart from the first conductive pattern; a second semiconductor die stacked on the first semiconductor die, the second semiconductor die including: a third conductive pattern; a fourth conductive pattern spaced apart from the third conductive pattern; a first through-substrate via (TSV) penetrating the second semiconductor die and electrically connecting the first conductive pattern with the third conductive pattern; and a second TSV penetrating the second semiconductor die and electrically connecting the second conductive pattern with the fourth conductive pattern, and a first conductive connection pattern included in the first semiconductor die and electrically connecting a first end of the first conductive pattern with a first end of the second conductive pattern, or included in the second semiconductor die and electrically connecting a first end of the third conductive pattern with a first end of the fourth conductive pattern.

A power module and a power device having the power module are disclosed. The power device includes a main board. The power module is inserted in the main board and includes a PCB, a magnetic element, a primary winding circuit and at least one secondary winding circuit. The magnetic element is provided on the PCB and includes a core structure, a primary winding and at least one secondary winding. The core structure has a first side and a second side opposite to each other, and a third side and a fourth side opposite to each other. The primary winding circuit is provided on the PCB and positioned in the vicinity of the first or second side of the core structure. The secondary winding circuit is provided on the PCB and positioned in the vicinity of the third or fourth side of the core structure.

A magnetic device comprising a magnetic body, a coil disposed in the magnetic body and at least one thermal conductive layer, wherein a first portion of the at least one thermal conductive layer encapsulates at least one portion of the coil and a second portion of the at least one thermal conductive layer is exposed from the magnetic body, wherein the at least one thermal conductive layer forms a continuous thermal conductive path from the coil to the outside of the magnetic body for dissipating heat generated from the coil.