The present invention relates to a thermal interface material layer and use thereof. The thermal interface material layer comprises an indium layer and a heat dissipation cover located on one side of the indium layer; the surface of the heat dissipation cover contains a nickel layer, and the nickel layer is connected to the indium layer. In the thermal interface material layer of the present invention, the nickel layer on the surface of the heat dissipation cover is connected to the indium layer, so as to form a NiIn compound layer having high structure stability, thereby solving the problem that the AuIn.sub.2 compound layer formed by welding the indium layer and Au used as a wetting layer in the traditional thermal interface layer is easily fractured, improving the reliability of the assembly obtained by assembling same.

A thermal management device is described. The thermal management device includes a housing having an upper wall, a lower wall, and a side wall. The upper wall has an outer surface and an inner surface. The lower wall has an outer surface, an inner surface and an inner height between the inner surface of the upper wall and the inner surface of the lower wall. The thermal management device includes a working fluid within the housing. The inner height of the housing is sized to form a continuous meniscus of the working fluid from the inner surface of the upper wall to the inner surface of the lower wall.

A wicking structure and/or support structure for thermal management is described. The wicking structure and/or structural support may include a plurality of additively manufactured wick unit cells. Each unit cell may include a plurality of struts that have a shell. A thermal management system that includes a wicking structure and/or a support structure is also described.

The fabrication of an electronic document includes the following steps: obtaining of a flat body in which is made a cavity of globally rectangular shape including a deep portion surrounded by a countersink and which contains an electronic component having connection terminals situated on this countersink while having the shape of meanders 5A, 5B, obtaining of a module including a support furnished on a so-called external face with a plurality of external contact zones and on a so-called internal face with a printed circuit including connection pads 4A, 4B of hefty form while being connected to certain at least of the external contact zones, the support being furthermore furnished, on this internal face, with a microcircuit connected to this printed circuit, this module being encased in the cavity by an anisotropic conducting adhesive whose overlap coefficient lies between 5 and 8%.

An integrated fan-out package including a die attach film, an integrated circuit component, an insulating encapsulation, and a redistribution circuit structure is provided. The integrated circuit component is disposed on the die attach film and includes a plurality of conductive terminals. The die attach film includes an uplifted edge which raises toward sidewalls of the integrated circuit component. The insulating encapsulation encapsulates the uplifted edge and the integrated circuit component. The redistribution circuit structure is disposed on the integrated circuit component and the insulating encapsulation, and the redistribution circuit structure is electrically connected to the conductive terminals of the integrated circuit component. A method of fabricating the integrated fan-out package are also provided.

An electronic device is provided. The electronic device includes a substrate and another substrate disposed opposite to the substrate. The electronic device includes a first light-emitting element disposed on the substrate and configured to emit blue light under a first current density when the substrate provides a first current to the first light-emitting element. The electronic device includes a second light-emitting element disposed on the substrate and configured to emit green light or red light under a second current density when the substrate provides a second current to the second light-emitting element. The electronic device includes a protective layer disposed between the substrate and the another substrate and covering the first light-emitting element and the second light-emitting element. The electronic device includes an adhesive layer disposed between the protective layer and the another substrate.

A high-frequency module includes a wiring substrate, a high-frequency circuit including circuit components disposed on the upper surface of the wiring substrate, a post made of metal and disposed on the upper surface of the wiring substrate, a sealing resin covering the circuit components, and an antenna substrate disposed on the upper surface of the sealing resin and having an antenna formed by a metal pattern. A groove is provided on the sealing resin, at least a part of the post is exposed from the groove, a central surface and two opposing side wall surfaces located higher than the central surface are formed at the upper side of the post, and a conductive adhesive is bonded to the central surface, the two side wall surfaces, and the antenna.

The fabrication of an electronic document includes the following steps: obtaining of a flat body in which is made a cavity of globally rectangular shape including a deep portion surrounded by a countersink and which contains an electronic component having connection terminals situated on this countersink while having the shape of meanders 5A, 5B, obtaining of a module including a support furnished on a so-called external face with a plurality of external contact zones and on a so-called internal face with a printed circuit including connection pads 4A, 4B of hefty form while being connected to certain at least of the external contact zones, the support being furthermore furnished, on this internal face, with a microcircuit connected to this printed circuit, this module being encased in the cavity by an anisotropic conducting adhesive whose overlap coefficient lies between 5 and 8%.

A high-frequency module includes a wiring substrate, a high-frequency circuit including circuit components disposed on the upper surface of the wiring substrate, a post made of metal and disposed on the upper surface of the wiring substrate, a sealing resin covering the circuit components, and an antenna substrate disposed on the upper surface of the sealing resin and having an antenna formed by a metal pattern. A groove is provided on the sealing resin, at least a part of the post is exposed from the groove, a central surface and two opposing side wall surfaces located higher than the central surface are formed at the upper side of the post, and a conductive adhesive is bonded to the central surface, the two side wall surfaces, and the antenna.

An electronic component includes a base insulative layer having first and second surfaces; an electronic device having first and second surfaces; at least one I/O contact located on the first surface of the electronic device; an adhesive layer disposed between the first surface of the electronic device and the second surface of the base insulative layer; a first metal layer disposed on the I/O contact; and a removable layer disposed between the first surface of the electronic device and the second surface of the base insulative layer, and located adjacent to the first metal layer. The base insulative layer secures to the electronic device through the first metal layer and removable layer. The first metal layer and removable layer can release the base insulative layer from the electronic device when the first metal layer and removable layer are exposed to a temperature higher than their softening points or melting points.