A method of manufacturing a display device, includes: providing an adhesive tape including: an adhesive conductive layer on a base film, a cutting width corresponding to a width of an adhesive tape attaching area of a substrate and provided in plurality including cutting widths adjacent to each other along the base film, and an interval between the cutting widths adjacent to each other; within the interval, providing a plurality of half-cuts in the adhesive tape, to provide a multi-cut adhesive tape; and pressing the multi-cut adhesive tape to the substrate, at a first portion of the multi-cut adhesive tape which corresponds to the cutting width, to separate the first portion of the multi-cut adhesive tape from the base film and attach the first portion of the multi-cut adhesive tape to the substrate at the adhesive tape attaching area thereof.

An apparatus includes a first substrate including a first adhesive layer, a second substrate including a second adhesive layer, a first drum that is rotatable, and a third adhesive layer located on the first drum. The first drum moves to a first location to separate device chips from the first adhesive layer of the first substrate and adheres the device chips to the third adhesive layer by rotating the first drum, and moves to a second location to separate the device chips from the third adhesive layer by rotating the first drum. The adhesive force of the first adhesive layer is less than the adhesive force of the third adhesive layer, and the adhesive force of the third adhesive layer is less than the adhesive force of the second adhesive layer.

A dispensing apparatus for the dispensation of a fluid onto a surface, the dispensing apparatus has a nozzle including a main body and a tube holder made of a deformable material installed on the main body. A dispensing tube having a first end from which the fluid is discharged onto the surface and a second end that is immersed in the fluid in use extends through the tube holder, such that the first and second ends are arranged to protrude from opposite ends of the tube holder. The nozzle is configured to be detachably coupled to a syringe-nozzle adaptor having a tubular body by interference fit between the tube holder and the tubular body of the syringe-nozzle adaptor. The syringe-nozzle adaptor is further attachable to a syringe for storing the fluid.

To provide a heat-dissipating resin composition, and cured product thereof, which can effectively transmit heat generated from a heat-generating part such as a semiconductor element or the like with a high heating value to an object such as a substrate, heat sink, shield can lid, housing, or the like, and reduce defects such as contact failure of a relay or connector, or the like. A heat-dissipating resin composition of an embodiment of the present disclosure includes: component (A): epoxy resin; component (B): curing agent for epoxy resin; component (C): (meth)acrylic oligomer with weight average molecular weight of 10,000 or less; and component (D): heat conductive particles.

In described examples, a microelectronic device includes a microelectronic die with a die attach surface. The microelectronic device further includes a nanoparticle layer coupled to the die attach surface. The nanoparticle layer may be in direct contact with the die attach surface, or may be coupled to the die attach surface through an intermediate layer, such as an adhesion layer or a contact metal layer. The nanoparticle layer includes nanoparticles having adjacent nanoparticles adhered to each other. The microelectronic die is attached to a package substrate by a die attach material. The die attach material extends into the nanoparticle layer and contacts at least a portion of the nanoparticles.

A semiconductor device includes a single lead frame, a semiconductor element, and a mold material. The semiconductor element is joined onto one main surface of the lead frame. The lead frame includes a die-attach portion, a signal terminal portion, and a ground terminal portion. The die-attach portion, the signal terminal portion, and the ground terminal portion are disposed directly below the mold material so as to be arranged in a direction along one main surface. A groove portion is provided by partially removing the lead frame so as to allow the groove portion to pass therethrough, the groove portion being provided between the die-attach portion and the ground terminal portion adjacent to each other in the lead frame and between the signal terminal portion and the ground terminal portion adjacent to each other in the lead frame.

A powder carrier, to which a powder layer containing a metal powder is applied, is provided by an automatic powder carrier feed. A first joining partner is pressed onto the powder layer located on the powder carrier so as to bond a powder layer portion to the first joining partner. The first joining partner is raised from the powder carrier together with the powder layer portion bonded to the first joining partner, and the powder layer portion bonded to the first joining partner is arranged between the first and second joining partners. A sintered join is produced between the first and second joining partners by pressing the first and second joining partners against one another such that the powder layer portion makes contact with both the first and second joining partners. The powder layer portion is sintered as the joining partners are being pressed against one another.

A semiconductor device includes a substrate having a plurality of pads on a surface of the substrate, a semiconductor chip that includes a plurality of metal bumps connected to corresponding pads on the substrate, a first resin layer between the surface of the substrate and the semiconductor chip, a second resin layer between the substrate and the semiconductor chip and between the first resin layer and at least one of the metal bumps, and a third resin layer on the substrate and above the semiconductor chip.

An applying method includes the following steps. Firstly, a conductive adhesive including a plurality of conductive particles and an insulating binder is provided. Then, a carrier plate is provided. Then, a patterned adhesive is formed on the carrier plate by the conductive adhesive, wherein the patterned adhesive includes a first transferring portion. Then, a manufacturing device including a needle is provided. Then, the needle of the manufacturing device is moved to contact the first transferring portion. Then, the transferring portion is transferred to a board by the manufacturing device.

A method for fabricating semiconductor die with die-attach preforms is disclosed. In embodiments, the method includes: applying an uncured die-attach paste material to a surface of a forming substrate to form one or more die-attach preforms, the surface of the forming substrate formed from a hydrophobic material; curing the one or more die-attach preforms; performing one or more planarization processes on the one or more die-attach preforms; coupling a first surface of a semiconductor die to a handling tool; and bonding a second surface of the semiconductor die to at least one die-attach preform of the one or more die-attach preforms.