A package structure is provided. The package structure has a light-emitting region and a non-light-emitting region that is adjacent to the light-emitting region, and includes a substrate, a first light-emitting layer, a second light-emitting layer and a third light-emitting layer. The first light-emitting layer, the second light-emitting layer and the third light-emitting layer are sequentially stacked on the substrate. Each of the first light-emitting layer, the second light-emitting layer and the third light-emitting layer includes a transparent adhesive layer disposed in the light-emitting region, a light-emitting diode (LED) chip disposed on the transparent adhesive layer, a redistribution layer formed on the LED chip and extending from the light-emitting region to the non-light-emitting region, and a planarization layer disposed on the LED chip and the redistribution layer.

The disclosure provides an electronic device and a method of manufacturing an electronic device. The electronic device includes a first substrate, a plurality of light-emitting diodes, a second substrate, a transparent material layer, and a sealing material. The first substrate comprises a first substrate body. The plurality of light-emitting diodes are disposed on the first substrate body. The second substrate is disposed opposite to the first substrate, and comprises a second substrate body. The transparent material layer is disposed between the first substrate and the second substrate. The sealing material is disposed between the first substrate and the second substrate and surrounds the transparent material layer. A distance between a bottom surface of the sealing material and a top surface of the first substrate body is less than a distance between a top surface of the sealing material and a bottom surface of the second substrate body.

The disclosure provides an electronic device and a method of manufacturing an electronic device. The electronic device includes a first substrate, a plurality of light-emitting diodes, a second substrate, a transparent material layer, and a sealing material. The first substrate comprises a first substrate body. The plurality of light-emitting diodes are disposed on the first substrate body. The second substrate is disposed opposite to the first substrate, and comprises a second substrate body. The transparent material layer is disposed between the first substrate and the second substrate. The sealing material is disposed between the first substrate and the second substrate and surrounds the transparent material layer. A distance between a bottom surface of the sealing material and a top surface of the first substrate body is less than a distance between a top surface of the sealing material and a bottom surface of the second substrate body.

A device transfer substrate includes a plurality of recesses, wherein each of the plurality of recesses includes a first region having a shape of a first figure, a second region having a shape of a second figure, and an overlapping region formed as a portion of the first region partially overlaps a portion of the second region, wherein a maximum width of the overlapping region in a direction intersecting with a straight line passing through a center of the first figure and a center of the second figure is less than a diameter or a diagonal length of the first figure and less than a diameter or a diagonal length of the second figure.

A device transfer substrate includes a plurality of recesses, wherein each of the plurality of recesses includes a first region having a shape of a first figure, a second region having a shape of a second figure, and an overlapping region formed as a portion of the first region partially overlaps a portion of the second region, wherein a maximum width of the overlapping region in a direction intersecting with a straight line passing through a center of the first figure and a center of the second figure is less than a diameter or a diagonal length of the first figure and less than a diameter or a diagonal length of the second figure.

The present invention relates generally to an anodic oxide film for electric contact, to an optoelectronic display, and to a method of manufacturing the optoelectronic display. More particularly, the present invention relates to an anodic oxide film for electric contact to electrically connect an optical element and a substrate in a position therebetween, to an optoelectronic display, and to a method of manufacturing the optoelectronic display.

The present invention relates generally to an anodic oxide film for electric contact, to an optoelectronic display, and to a method of manufacturing the optoelectronic display. More particularly, the present invention relates to an anodic oxide film for electric contact to electrically connect an optical element and a substrate in a position therebetween, to an optoelectronic display, and to a method of manufacturing the optoelectronic display.

A liquid crystal display apparatus is provided. The liquid crystal display apparatus includes a graphene LED backlight source, a first polarizing film, a first substrate, a liquid crystal layer, a second substrate and a second polarizing film. The graphene LED backlight source is used for providing light output, the first polarizing film is used for converting the light output from the backlight source into a polarized light. The liquid crystal layer includes liquid crystal molecules used for deflecting the polarized light from the backlight source to form a polarized output light, and the second polarizing film is used for emitting the polarized output light.

A liquid crystal display apparatus is provided. The liquid crystal display apparatus includes a graphene LED backlight source, a first polarizing film, a first substrate, a liquid crystal layer, a second substrate and a second polarizing film. The graphene LED backlight source is used for providing light output, the first polarizing film is used for converting the light output from the backlight source into a polarized light. The liquid crystal layer includes liquid crystal molecules used for deflecting the polarized light from the backlight source to form a polarized output light, and the second polarizing film is used for emitting the polarized output light.

A light-emitting device includes a circuit carrier board having a short side and a long side, a plurality of light-emitting units on the circuit carrier board for emitting three or more color lights, and a light-transmitting glue layer on the circuit carrier board and covering the plurality of light-emitting units. The short side is shorter than the long side. The plurality of light-emitting units include a first light-emitting unit. The first light-emitting unit has a light exit surface, a first sidewall, and a second sidewall. The first sidewall faces the short side and has a first included angle with the light exit surface, and the second sidewall faces the long side and has a second included angle with the light exit surface. The first included angle is between 85 to 95 degrees, and the second included angle is less than 85 degrees or greater than 105 degrees.