An integrated circuit includes a first-voltage power rail and a second-voltage power rail in a first connection layer, and includes a first-voltage underlayer power rail and a second-voltage underlayer power rail below the first connection layer. Each of the first-voltage and second-voltage power rails extends in a second direction that is perpendicular to a first direction. Each of the first-voltage and second-voltage underlayer power rails extends in the first direction. The integrated circuit includes a first via-connector connecting the first-voltage power rail with the first-voltage underlayer power rail, and a second via-connector connecting the second-voltage power rail with the second-voltage underlayer power rail.

A method for producing a 3D semiconductor device: providing a first level with a first single crystal layer; forming control circuitry of first transistors in and/or on the first level with a first metal layer above; forming a second metal layer above the first metal layer; forming a third metal layer above the second metal layer; forming at least one second level on top of or above the third metal layer; performing additional processing steps to form a plurality of second transistors within the second level; forming a fourth and fifth metal layers above second level; a global power distribution grid includes fifth metal, and local power distribution grid includes the second metal layer, where the fifth metal layer thickness is at least 50% greater than the second metal layer thickness.

Provided is an integrated circuit including standard cells arranged over a plurality of rows. The standard cells may include: a plurality of functional cells each implemented as a logic circuit; and a plurality of filler cells including at least one first filler cell and at least one second filler cell that each include at least one pattern from among a back end of line (BEOL) pattern, a middle of line (MOL) pattern, and a front end of line (FEOL) pattern, and wherein the at least one first filler cell and the at least one second filler cell have a same size as each other, and a density of one of the at least one pattern of the at least one first filler cell is different from a density of one of the at least one pattern of the at least one second filler cell.

An integrated circuit (IC) includes: a first cell including an input pin and an output pin extending in a first direction; a second cell adjacent to the first cell in the first direction and including an input pin and an output pin extending in the first direction; a first cell isolation layer extending between the first cell and the second cell in a second direction crossing the first direction; and a first wire extending in the first direction, overlapping the first cell isolation layer, and being connected to the output pin of the first cell and the input pin of the second cell, wherein the output pin of the first cell, the input pin of the second cell, and the first wire are formed in a first conductive layer as a first pattern extending in the first direction.

A method includes positioning a first active region adjacent to a pair of second active regions in an initial integrated circuit (IC) layout diagram of an initial cell, to align side edges of the first active region and corresponding side edges of each second active region of the pair of second active regions along a cell height direction. The first active region forms, together with the initial cell, a modified cell having a modified IC layout diagram. The side edges of the first active region and the corresponding side edges of each second active region extend along the cell height direction. A height dimension of the first active region in the cell height direction is less than half of a height dimension of each second active region of the pair of second active regions in the cell height direction. The positioning the first active region is executed by a processor.

A semiconductor integrated circuit device including a plurality of rows of IO cells has a configuration capable of avoiding a latchup error without causing an increase in area. The device includes a first IO cell row placed closest to an edge of a chip and a second IO cell row placed adjacent to a core region side of the first IO cell row. Each of the IO cells of the first and second IO cell rows has a high power supply voltage region and a low power supply voltage region provided separately in a direction perpendicular to a direction in which the IO cells are lined up. The IO cell rows are placed so that the high power supply voltage regions of these rows are mutually opposed.

A device includes standard cells in a layout of an integrated circuit, the standard cells includes first and second standard cells sharing a first active region and a second active region. The first standard cell includes first and second gates. The first gate includes a first gate finger and a second gate finger that are arranged over the first active region, for forming the first transistor and the second transistor. The second gate is separate from the first gate, the second gate includes a third gate finger and a fourth gate finger that are arranged over the second active region, for forming the third transistor and the fourth transistor. The second standard cell includes a third gate arranged over the first active region and the second active region, for forming the fifth transistor and the sixth transistor. The first to fourth transistors operate as an electrostatic discharge protection circuit.

Various implementations described herein refer to a device having logic circuitry with transistors and gate lines. The device may include a backside power network having buried supply rails with at least one buried supply rail having a continuity break. The transistors may be arranged in a cell architecture having an N-well break with the gate lines passing through the N-well break and the continuity break.

The present disclosure relates to a method of forming a sense amplifier and a layout structure of a sense amplifier. The method includes: providing a first active region pattern layer, the first active region pattern layer includes a bridge pattern, and a first active region pattern region and a second active region pattern region; the first active region pattern region includes a first active region pattern for defining a first pull-down transistor of a first memory cell structure; the second active region pattern region includes a first symmetrical active region pattern for defining a second pull-down transistor of a second memory cell structure; and the first active region pattern and the first symmetrical active region pattern are adjacent to each other and connected through the bridge pattern, a source of the first pull-down transistor and a source of the second pull-down transistor are electrically connected through the bridge pattern.

A method for identifying a latch-up structure includes the following operations. In a chip layout, a first P-type heavily doped region connected to a ground pad and located in a P-type substrate is found, and a first N-type heavily doped region connected to a power pad and located in an N-well is found. A second N-type heavily doped region adjacent to the first P-type heavily doped region and located in the P-type substrate is found. A second P-type heavily doped region adjacent to the first N-type heavily doped region and located in the N-well is found, the N-well is located on the P-type substrate. An area that is formed by the first P-type heavily doped region, the first N-type heavily doped region, the second P-type heavily doped region, the second N-type heavily doped region, the N-well, and the P-type substrate is identified as the latch-up structure.