The present disclosure relates to a display substrate and a display device thereof. The display substrate comprises: a substrate; a first wiring extending in a first direction on the substrate; a first dielectric layer on the substrate and the first wiring; a second wiring extending in the first direction on the first dielectric layer, wherein an orthographic projection of the second wiring on the substrate at least partially overlaps with an orthographic projection of the first wiring on the substrate; a conformal dielectric layer on the first dielectric layer and the second wiring; a third wiring and a fourth wiring disposed at spacings in the first direction on the conformal dielectric layer, wherein orthographic projections of the third wiring and the fourth wiring on the substrate at least partially overlap with the orthographic projections of the first wiring and the second wiring on the substrate.

An organic electroluminescence device includes: an anode; a cathode; and an emitting layer provided between the anode and the cathode, in which the emitting layer contains a delayed fluorescent compound M2 and a compound M3 represented by a formula (3) and a singlet energy S.sub.1(M2) of the compound M2 and a singlet energy S.sub.1(M3) of the compound M3 satisfy a relationship of a numerical formula (Numerical Formula 1) below, S.sub.1(M3)>S.sub.1(M2) . . . (Numerical Formula 1). In the formula (3), A3 is a group represented by a formula (3a) or the like.

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A method for manufacturing a light-emitting device a first solution including a first solvent, quantum dots, a ligand, and a first inorganic precursor, the quantum dots each including a core and a first shell performing first heating of raising to a first temperature or higher, the first temperature being a higher temperature of a melting point of the ligand and a boiling point of the first solvent, and performing second heating of raising to a second temperature, the second temperature being higher than the first temperature and being a temperature at which the first inorganic precursor epitaxially grows and a second shell coating the first shell is formed to form a plurality of first quantum dots, and wherein a plurality of second quantum dots each including, in a core, the same material as a material of the second shells are also formed.

A semiconductor device 1 includes a base body 3 that includes a p type substrate 4 and an n type semiconductor layer 5 formed on the p type substrate 4 and includes an element region 2 having a transistor 40 with the n type semiconductor layer as a drain, a p type element isolation region 7 that is formed in a surface layer portion of the base body such as to demarcate the element region, and a conductive wiring 25 that is disposed on a peripheral edge portion of the element region and is electrically connected to the n type semiconductor layer. The transistor includes an n.sup.+ type drain contact region 14 that is formed in a surface layer portion of the n type semiconductor layer in the peripheral edge portion of the element region. The conductive wiring is disposed such as to cover at least a portion of an element termination region 30 between the n.sup.+ type drain contact region and the p type element isolation region.

A display device includes: a display panel including: a base substrate; a thin film transistor layer provided on the base substrate and including a semiconductor layer, a gate insulation film, a plurality of first wiring lines, an interlayer insulation film, and a plurality of second wiring lines, all of which are stacked in a stated order; a light-emitting element layer provided on the thin film transistor layer; and a sealing film provided on the light-emitting element layer; and an image capturing unit provided on a base substrate side of the display area of the display panel, wherein in a plan view, the plurality of second wiring lines, in an area overlapping the image capturing unit, have portions respectively overlapping the plurality of first wiring lines.

A display substrate and a display device are provided. The display substrate includes a display region. The first connection line is electrically connected to the first pixel sub-circuit and an anode of the first light-emitting sub-element. The anode of the first light-emitting sub-element is electrically connected to the first connection line through a first hole penetrating the first insulation layer and the second insulation layer. A shape of a cross section of the first hole in a plane perpendicular to the display substrate is an inverted convex shape, and in the first hole, a diameter of an opening of the second insulation layer is larger than a diameter of an opening of the first insulation layer. The anode of the first light-emitting sub-element includes a first groove structure located in the first hole, and a bottom of the first groove structure is in contact with the first connection line.

Display substrate, manufacturing method therefor and display apparatus are provided. The display substrate includes a display area, the display area including a pixel region, a light transmissive region, and an isolation region between the pixel region and the light transmissive region and at least partially surrounding the light transmissive region; the isolation region includes an isolation component, a barrier wall structure, and a groove structure located therebetween; the pixel region includes a light-emitting functional layer and an organic encapsulation layer; a portion of the light-emitting functional layer extending to the isolation region is disconnected at a side face of the isolation component; and the organic encapsulation layer extends from the pixel region to the isolation region, and the groove structure and the barrier wall structure is configured for limiting an extension of the organic encapsulation layer to the light transmissive region.

A display panel may include a bank pattern having an opening through which an electrode pattern of a light-emitting element layer is exposed. The bank pattern may include a tapered part having a width from an end of an electrode pattern to the opening. At least one of a width and a slope angle of the tapered part may be partially differently set.

A display apparatus includes a substrate, a first electrode, a second electrode to be adjacent to the first electrode, a first emission layer on the first electrode, a second emission layer on the second electrode, a first low adhesive pattern between a center of the first emission layer and a center of the second emission layer in a plan view, a first negative charge generation layer continuously disposed to cover the first emission layer, the second emission layer, and the first low adhesive pattern, a first positive charge generation layer on the first negative charge generation layer, a first upper emission layer on the first positive charge generation layer and overlapping the first emission layer, a second upper emission layer on the first positive charge generation layer and overlapping the second emission layer, and a common electrode on the first upper emission layer and the second upper emission layer.

An array substrate and a manufacturing method thereof, a display device and a manufacturing method thereof are provided, which belong to the technical field of display. The array substrate includes: an interposer substrate, a fan-out region and a thin-film transistor disposed on one side of the interposer substrate, and a bonding connection line disposed on the other side of the interposer substrate. The bonding connection line includes a first lead and a second lead that are insulated from each other. The interposer substrate is provided with a first interposer via hole and a second interposer via hole. The first lead is electrically connected to the thin-film transistor by a conductive structure in the first interposer via hole and the fan-out region, and the second lead is electrically connected to the thin-film transistor by a conductive structure in the second interposer via hole and the fan-out region.