An organic EL display panel including: a substrate; banks linearly extending along one direction above the substrate; pixel electrodes spaced away from one another along the one direction, in each of first and second spaces among spaces defined by the banks; a light-emitting layer covering each pixel electrode in each of the first and second spaces; and a sub-bank crossing the one direction at least in the first space, and when defining each light-emitting layer portion covering a pixel electrode as a light-emitting portion and defining each area between light-emitting portions adjacent in the one direction as a non-light-emitting portion, a positive integer N exists for which the following holds true: among Nth non-light-emitting portions counting from one side along the one direction, the Nth non-light-emitting portion in the first space has the sub-bank and the Nth non-light-emitting portion in the second space does not have the sub-bank.

An organic light-emitting diode (OLED) display is disclosed. In one aspect, the display includes an OLED layer including a plurality of OLEDs that respectively form a plurality of sub-pixels and an encapsulation layer disposed over the OLED layer. The OLED display also includes an optical film disposed over the encapsulation layer and comprising a reflection control layer, a first lens disposed below the reflection control layer, and a second lens disposed over the reflection control layer, wherein the reflection control layer comprises i) a plurality of color filters respectively corresponding to the sub-pixels, and ii) a light shielding portion disposed between the color filters. The OLED display further includes an intermediate layer disposed between the encapsulation layer and the optical film, wherein the first lens is disposed over sides of at least one sub-pixels and wherein the second lens is disposed over center portions of selected sub-pixels.

An inorganic-light-emitter display includes a display substrate and a plurality of spatially separated inorganic light emitters distributed on the display substrate in a light-emitter layer. A light-absorbing layer located on the display substrate in the light-emitter layer is in contact with the inorganic light emitters. Among other things, the disclosed technology provides improved angular image quality by avoiding parallax between the light emitters and the light-absorbing material, increased light-output efficiency by removing the light-absorbing material from the optical path, improved contrast by increasing the light-absorbing area of the display substrate, and a reduced manufacturing cost in a mechanically and environmentally robust structure using micro transfer printing.

The present application relates to a method of producing an optoelectronic component. An optoelectronic is produced by this method. An optoelectronic semiconductor chip has a first surface. A sacrificial layer is deposited on the first surface. The optoelectronic semiconductor chip is at least partially embedded in a mold body and the sacrificial layer is removed.

A light emitting device includes a flexible substrate, at least one light emitting element, a sealing resin and an adhesion layer. The flexible substrate includes a flexible base member and a plurality of wiring portions disposed on one surface of the base member. At least one light emitting element is arranged on a first surface of the flexible substrate and electrically connected to the wiring portions. The sealing resin seals the light emitting element. The adhesion layer is arranged on a second surface of the flexible substrate different from the first surface of the flexible substrate. The adhesion layer has a non-adhesive region corresponding at least to a region on the first surface where the at least one light emitting element is arranged. The non-adhesive region is covered with a non-adhesive layer.

An organic light emitting display and a method of manufacturing the same. The organic light-emitting display is a transparent display where one can see through the display to view an image on the other side of the display. Each pixel of the display has a first region that includes an organic light emitting diode and a thin film transistor, and a larger second region that is transparent. The second region is made of either transparent layers or ultra-thin layers so that light is not blocked. A second electrode of the display may include magnesium and may be produced by a selective deposition process, so that use of a fine metal mask may be avoided.

A display device includes a protective film attached to a display surface as a surface of at least one of a first insulating substrate and a second insulating substrate, and an adhesive material attaching the protective film to the display surface. The display surface includes a display area in which an image is displayed, and a peripheral area surrounding the display area. The adhesive material includes a first adhesive portion and a second adhesive portion. The first adhesive portion is in the peripheral area, and discontinuously surrounds the display area with a disconnected portion. The second adhesive portion is provided in the peripheral area inside or outside the first adhesive portion and the disconnected portion with a gap between the second adhesive portion, and the first adhesive portion and the disconnected portion, so as to be next to the disconnected portion over the entire length thereof.

A display device according to an embodiment of the present invention includes: a substrate having a display region for displaying an image; a plurality of pixels located in the display region of the substrate; and a sealing layer covering the plurality of pixels, wherein the sealing layer includes a first inorganic material film, a second inorganic material film, a resin material layer, and a third inorganic material film in this order from the side where the pixels are arranged, and the second inorganic material film is in contact with the resin material layer, has a composition different from that of the first inorganic material film, and has a higher oxygen content than the first inorganic material film.

An image light generation device of the present disclosure includes first to third display elements configured to emit first to third color light, respectively, and a color synthesis element configured to synthesize the first to third color light. The color synthesis element includes first to third prisms, a first dichroic film configured to reflect the first color light and transmit the second and third color light, and a second dichroic film configured to reflect the second color light and transmit the third color light. The first and second prisms are joined together through a first dichroic film with no air layer therebetween, the second and third prisms are joined together through a second dichroic film with no air layer therebetween, and the main light beam incidence angle of the third color light to the second dichroic film is 40 degrees or greater.

A semiconductor device including a two-dimensional material and a method of manufacturing the same are provided. The semiconductor device may include a first two-dimensional material layer including a first two-dimensional semiconductor material; a plurality of second two-dimensional material layers connected to the first two-dimensional material layer, each having a thickness greater than that of the first two-dimensional material layer, and including a doped two-dimensional semiconductor material; and a plurality of electrodes on the plurality of second two-dimensional material layers.