A finFET device includes an n-doped source and/or drain extension that is disposed between a gate spacer of the finFET and a bulk semiconductor portion of the semiconductor substrate on which the n-doped source or drain extension is disposed. The n-doped source or drain extension is formed by a selective epitaxial growth (SEG) process in a cavity formed proximate the gate spacer.

A semiconductor device includes a metal layer, an insulating layer disposed above the metal layer, and a multi-layer diffusion barrier disposed on the metal layer between the metal layer and the insulating layer. The multi-layer diffusion barrier includes a first material layer including a metallic nitride and a second material layer including a metallic oxide.

A semiconductor device includes a metal layer, an insulating layer disposed above the metal layer, and a multi-layer diffusion barrier disposed on the metal layer between the metal layer and the insulating layer. The multi-layer diffusion barrier includes a first material layer including a metallic nitride and a second material layer including a metallic oxide.

Techniques are disclosed for forming a non-planar germanium quantum well structure. In particular, the quantum well structure can be implemented with group IV or III-V semiconductor materials and includes a germanium fin structure. In one example case, a non-planar quantum well device is provided, which includes a quantum well structure having a substrate (e.g. SiGe or GaAs buffer on silicon), a IV or III-V material barrier layer (e.g., SiGe or GaAs or AlGaAs), a doping layer (e.g., delta/modulation doped), and an undoped germanium quantum well layer. An undoped germanium fin structure is formed in the quantum well structure, and a top barrier layer deposited over the fin structure. A gate metal can be deposited across the fin structure. Drain/source regions can be formed at respective ends of the fin structure.

A potential is held stably. A negative potential is generated with high accuracy. A semiconductor device with a high output voltage is provided. The semiconductor device includes a first transistor, a second transistor, a capacitor, and a comparator. The comparator includes a non-inverting input terminal, an inverting input terminal, and an output terminal. A gate and one of a source and a drain of the first transistor are electrically connected to each other. One of a source and a drain of the second transistor is electrically connected to the non-inverting input terminal of the comparator, one electrode of the capacitor, and a gate of the second transistor. The other of the source and the drain of the second transistor is electrically connected to the one of the source and the drain of the first transistor. The first transistor and the second transistor each contain an oxide semiconductor.

A potential is held stably. A negative potential is generated with high accuracy. A semiconductor device with a high output voltage is provided. The semiconductor device includes a first transistor, a second transistor, a capacitor, and a comparator. The comparator includes a non-inverting input terminal, an inverting input terminal, and an output terminal. A gate and one of a source and a drain of the first transistor are electrically connected to each other. One of a source and a drain of the second transistor is electrically connected to the non-inverting input terminal of the comparator, one electrode of the capacitor, and a gate of the second transistor. The other of the source and the drain of the second transistor is electrically connected to the one of the source and the drain of the first transistor. The first transistor and the second transistor each contain an oxide semiconductor.

To provide a method by which a semiconductor device including a thin film transistor with excellent electric characteristics and high reliability is manufactured with a small number of steps. After a channel protective layer is formed over an oxide semiconductor film containing In, Ga, and Zn, a film having n-type conductivity and a conductive film are formed, and a resist mask is formed over the conductive film. The conductive film, the film having n-type conductivity, and the oxide semiconductor film containing In, Ga, and Zn are etched using the channel protective layer and gate insulating films as etching stoppers with the resist mask, so that source and drain electrode layers, a buffer layer, and a semiconductor layer are formed.

Some embodiments include an integrated assembly having a conductive structure, an annular structure extending through the conductive structure, and an active-material-structure lining an interior periphery of the annular structure. The annular structure includes dielectric material. The active-material-structure includes two-dimensional-material. Some embodiments include methods of forming integrated assemblies.

Some embodiments include an integrated assembly having a conductive structure, an annular structure extending through the conductive structure, and an active-material-structure lining an interior periphery of the annular structure. The annular structure includes dielectric material. The active-material-structure includes two-dimensional-material. Some embodiments include methods of forming integrated assemblies.

A TFT is provided. The TFT includes an active layer, and the active layer includes a first active layer and a second active layer. The second active layer is made of the oxide semiconductor material, and the first active layer has conductivity greater than conductivity of the second active layer.