The invention provides a solution based process based on high molecular weight block copolymer (BCP) nanolithography for fabrication of periodic structures on large areas of optical surfaces. In one embodiment there is provided method of fabricating a nano-patterned surface for application in a photonic, optical or other related device, said method comprising the steps of: providing a substrate material; depositing a block copolymer (BCP) material on the substrate material; and phase separating the BCPs using at least one solvent selected to facilitate polymer chain mobilisation and lead to phase separation to fabricate said nano-patterned surface; wherein the nano-patterned surface comprises an ordered array of structures and having a domain or diameter of 100 nm or greater. A new photonic device and optical device is also described.

A waveguide photodetector includes a first contact layer of a first conductivity type, a waveguide layer, and a second contact layer of a second conductivity type that are sequentially formed on the semiconductor substrate. The waveguide layer includes a first cladding layer of the first conductivity type disposed on a side of the first contact layer, a second cladding layer of the second conductivity type disposed on a side of the second contact layer, and the core layer disposed between the first cladding layer and the second cladding layer. The core layer includes a light absorption layer and an impurity-doped light absorption layer that has a higher concentration of a p-type impurity than that of the light absorption layer and is disposed on a side of a light incident face.

An electrical device includes a substrate with a compressive layer, a neutral stress buffer layer and a tensile stress compensation layer. The stress buffer layer and the stress compensation layer may each be formed with aluminum nitride using different processing parameters to provide a different intrinsic stress value for each layer. The aluminum nitride tensile layer is configured to counteract stresses from the compressive layer in the device to thereby control an amount of substrate bow in the device. This is useful for protecting fragile materials in the device, such as mercury cadmium telluride. The aluminum nitride stress compensation layer also can compensate for forces, such as due to CTE mismatches, to protect the fragile layer. The device may include temperature-sensitive materials, and the aluminum nitride stress compensation layer or stress buffer layer may be formed at a temperature below the thermal degradation temperature of the temperature-sensitive material.

This invention provides a light-concentrating structure with photosensitivity enhancing effect, including the substrate, buried layer, first electrode layer, second electrode layer, dielectric layer and interconnection structure. The substrate is equipped with a housing space; the buried layer is arranged above the substrate with the housing space; the first electrode layer is arranged above the buried layer; the second electrode layer is arranged in the middle of the first electrode layer; the dielectric layer is arranged above the second electrode layer; the interconnection structure is arranged above the substrate and the first electrode layer surrounding the dielectric layer, which forms an opening and a light-concentrating recess groove.

A radiation detector includes a halide semiconductor sandwiched a cathode and an anode and a buffer layer between the halide semiconductor and the anode. The anode comprises a composition selected from: (a) an electrically conducting inorganic-oxide composition, (b) an electrically conducting organic composition, and (c) an organic-inorganic hybrid composition. The buffer layer comprises a composition selected from: (a) a composition distinct from the composition of the anode and including at least one other electrically conducting inorganic-oxide composition, electrically conducting organic composition, or organic-inorganic hybrid composition; (b) a semi-insulating layer selected from: (i) a polymer-based composition; (ii) a perovskite-based composition; (iii) an oxide-semiconductor composition; (iv) a polycrystalline halide semiconductor; (v) a carbide, nitride, phosphide, or sulfide semiconductor; and (vi) a group II-VI or III-V semiconductor; and (c) a component metal of the halide-semiconductor.

A photodetection film includes at least one lower photodiode and upper photodiode layered members. The at least one lower photodiode layered member includes lower first-type, intrinsic and second-type semiconductor layers. The at least one upper photodiode layered member is disposed on the at least one lower photodiode layered member and includes upper first-type, intrinsic and second-type semiconductor layers. The upper intrinsic semiconductor layer has an amorphous silicon structure. The lower intrinsic semiconductor layer has a structure selected from one of a microcrystalline silicon structure, a microcrystalline silicon-germanium structure, and a non-crystalline silicon-germanium structure.

An assembly for optical to electrical power conversion including a photodiode assembly having a substrate layer and an internal side, an antireflective layer, a heterojunction buffer layer adjacent the internal side; an active area positioned adjacent the heterojunction buffer layer, a plurality of n+ electrode regions and p+ electrode regions positioned adjacent the active area, and back-contacts configured to align with the n+ and p+ electrode regions. The active area converts photons from incoming light into liberated electron hole pairs. The heterojunction buffer layer prevents electrons and holes of the liberated electron hole pairs from moving toward the substrate layer. The plurality of electrode regions are configured in an alternating pattern with gaps between each n+ and p+ electrode region. The electrode regions receive and generate electrical current from migration of the electrons and the holes, provide electrical pathways for the electrical current, and provide thermal pathways to dissipate heat.

Photo-detection device (100) including a semiconductor substrate (110) made of Cd.sub.xHg.sub.1-xTe, with an N-doped region (120), a P-doped region (130), and a concentrated casing (150) only located in the P-doped region and having an average cadmium concentration greater than the average cadmium concentration in the N-doped region. According to the invention, the concentrated casing (150) has a cadmium concentration gradient, defining therein at least one intermediate gap zone (151) and at least one high gap zone (152), and the intermediate gap zone (151) is in direct physical contact with an electrical contact block (170). A significant reduction in the dark current and an optimal charge carrier collection are thus combined.

An optical semiconductor element includes: a substrate; a semiconductor stacked body including an optical layer, a first semiconductor layer, and a second semiconductor layer, the optical layer and the first semiconductor layer forming a mesa portion and the second semiconductor layer including an outer portion; a first electrode formed on the mesa portion and connected to the first semiconductor layer; a first insulating layer formed on the first electrode; a second electrode including a first portion connected to the second semiconductor layer at the outer portion and a second portion arranged on the first insulating layer so as to overlap the first electrode; and a second insulating layer formed on the second electrode. An opening for exposing the first electrode is formed in the first insulating layer. An opening for exposing the second portion of the second electrode is formed in the second insulating layer.

Embodiments of the present application provide an array substrate, a fabrication method for an array substrate, and a display panel. The array substrate includes a substrate, a gate, a gate insulating layer, a seed layer, and a semiconductor layer that are sequentially stacked. A surface of the semiconductor layer away from the seed layer has a concave-convex structure formed by growth of nanocrystalline grains, which enhances light absorption of the semiconductor layer and solves the problems of poor light sensitivity and slow response speed of semiconductor devices.