Monolithic multi-dimensional integrated circuits and memory architecture are provided. Exemplary integrated circuits comprise an electronic board having a first side and a second side, a multi-dimensional electronic package having multiple planes, and one or more semiconductor wafers mounted on the first side and the second side of the electronic board and on the multiple planes of the electronic package. Exemplary monolithic multi-dimensional memory architecture comprises one or more tiers, one or more monolithic inter-tier vias spanning the one or more tiers, at least one multiplexer disposed in one of the tiers, and control logic determining whether memory cells are active and which memory cells are active and controlling usage of the memory cells based on such determination. Each tier has a memory cell, and the inter-tier vias act as crossbars in multiple directions. The multiplexer is communicatively coupled to the memory cell in the respective tier. In exemplary embodiments, the one or more semiconductor wafers include one or more solar cells. The solar cells may comprise MEMS and/or on-chip solar cells.

Monolithic multi-dimensional integrated circuits and memory architecture are provided. Exemplary integrated circuits comprise an electronic board having a first side and a second side, a multi-dimensional electronic package having multiple planes, and one or more semiconductor wafers mounted on the first side and the second side of the electronic board and on the multiple planes of the electronic package. Exemplary monolithic multi-dimensional memory architecture comprises one or more tiers, one or more monolithic inter-tier vias spanning the one or more tiers, at least one multiplexer disposed in one of the tiers, and control logic determining whether memory cells are active and which memory cells are active and controlling usage of the memory cells based on such determination. Each tier has a memory cell, and the inter-tier vias act as crossbars in multiple directions. The multiplexer is communicatively coupled to the memory cell in the respective tier. In exemplary embodiments, the one or more semiconductor wafers include one or more solar cells. The solar cells may comprise MEMS and/or on-chip solar cells.

A mounting system 110 for a solar panel 11 includes a base plate 114 having an elongated mounting slot 116, a spacer beam 124 with a slot 128, a first T-shaped fastener 131 having a mounting plate 132 with a width slightly smaller than the size of the slot and a length larger than the size of the slot, so that the mounting plate may be passed through the slot and then rotated so that it then cannot pass back through the slot. A second T-shaped fastener 137 having the same configuration couples the solar panel to the spacer. The system optionally has a ballast system 145 which includes a ballast tray 146 and third T-shaped fastener 155 of the same configuration for coupling the tray to the base plate. An anti-creep strip 161 is coupled to the base member through fourth T-shaped fasteners 162 of the same configuration.

A mounting system 110 for a solar panel 11 includes a base plate 114 having an elongated mounting slot 116, a spacer beam 124 with a slot 128, a first T-shaped fastener 131 having a mounting plate 132 with a width slightly smaller than the size of the slot and a length larger than the size of the slot, so that the mounting plate may be passed through the slot and then rotated so that it then cannot pass back through the slot. A second T-shaped fastener 137 having the same configuration couples the solar panel to the spacer. The system optionally has a ballast system 145 which includes a ballast tray 146 and third T-shaped fastener 155 of the same configuration for coupling the tray to the base plate. An anti-creep strip 161 is coupled to the base member through fourth T-shaped fasteners 162 of the same configuration.

A solar panel assembly according to an example of the present disclosure includes a light-permeable panel, an opaque or solid region on the panel that at least partially blocks light from penetration through the panel, at least one solar array adjacent the panel, and at least one mirror situated such that at least some light permeating through the panel reflects off of the at least one mirror and onto the at least one solar array.

A solar cell module includes: a substrate; a back sheet; a plurality of solar cells arranged between the substrate and the back sheet; a transition wire common-connecting tab wires connected to the plurality of solar cells; a concealment sheet covering the transition wire from a substrate side; and a filling member filling at least a space between the transition wire and the concealment sheet, wherein the concealment sheet includes: a first sheet layer in contact with the filling member; and a second sheet layer placed over the first sheet layer, the first sheet layer and the second sheet layer are each made of any of: a material of a same type of color as a material of the back sheet or the filling member; a transparent material; and a semitransparent material, and the first sheet layer has adhesiveness to the filling member.

A solar cell module includes: a substrate; a back sheet; a plurality of solar cells arranged between the substrate and the back sheet; a transition wire common-connecting tab wires connected to the plurality of solar cells; a concealment sheet covering the transition wire from a substrate side; and a filling member filling at least a space between the transition wire and the concealment sheet, wherein the concealment sheet includes: a first sheet layer in contact with the filling member; and a second sheet layer placed over the first sheet layer, the first sheet layer and the second sheet layer are each made of any of: a material of a same type of color as a material of the back sheet or the filling member; a transparent material; and a semitransparent material, and the first sheet layer has adhesiveness to the filling member.

A solar cell unit having a semiconductor body formed as a solar cell and having a front side and a back side, a carrier with a top side enclosed by at least four edges, a bottom side, and a first contact surface, formed on the top side and connected to the first terminal contact, and a second contact surface, connected to the second terminal contact and spaced apart from the first contact surface, and a secondary optical element. A back side of the semiconductor body is non-positively connected to a part of the top side of the carrier. The secondary optical element guides light to the front side of the semiconductor body and at least parts of the bottom side of the secondary optical element are non-positively connected to the front side of the semiconductor body and/or to the top side of the carrier by a polymer adhesive layer.

A solar cell unit having a semiconductor body formed as a solar cell and having a front side and a back side, a carrier with a top side enclosed by at least four edges, a bottom side, and a first contact surface, formed on the top side and connected to the first terminal contact, and a second contact surface, connected to the second terminal contact and spaced apart from the first contact surface, and a secondary optical element. A back side of the semiconductor body is non-positively connected to a part of the top side of the carrier. The secondary optical element guides light to the front side of the semiconductor body and at least parts of the bottom side of the secondary optical element are non-positively connected to the front side of the semiconductor body and/or to the top side of the carrier by a polymer adhesive layer.

A solar cell unit having a semiconductor body formed as a solar cell, whereby the semiconductor body has a front side and a back side, and the solar cell unit has a carrier with a top side and a bottom side, whereby a first contact surface and a second contact surface are formed on the top side, and the first contact surface is spaced apart from the second contact surface and the contact surfaces are metallically conductive and the back side of the semiconductor body is non-positively connected to the top side of the carrier. The solar cell unit has a secondary optical element to guide light to the front side of the semiconductor body, whereby the secondary optical element has a bottom side and the bottom side is non-positively connected to the front side of the semiconductor body.