An integrated laminate structure adapted for application in the context of solar technology, wafer technology, cooling channels, greenhouse illumination, window illumination, street lighting, traffic lighting, traffic reflectors or security films, includes a first carrier element such as a piece of plastic or glass, optionally having optically substantially transparent material enabling light transmission therethrough, a second carrier element provided with at least one surface relief pattern including a number of surface relief forms and having at least one predetermined optical function relative to incident light, the second carrier element optionally including optically substantially transparent material enabling light transmission therethrough, the first and second carrier elements being laminated together such that the at least one surface relief pattern has been embedded within the established laminate structure and a number of related cavities have been formed at the interface of the first and second carrier elements. An applicable method of manufacture is presented.

An integrated laminate structure adapted for application in the context of solar technology, wafer technology, cooling channels, greenhouse illumination, window illumination, street lighting, traffic lighting, traffic reflectors or security films, includes a first carrier element such as a piece of plastic or glass, optionally having optically substantially transparent material enabling light transmission therethrough, a second carrier element provided with at least one surface relief pattern including a number of surface relief forms and having at least one predetermined optical function relative to incident light, the second carrier element optionally including optically substantially transparent material enabling light transmission therethrough, the first and second carrier elements being laminated together such that the at least one surface relief pattern has been embedded within the established laminate structure and a number of related cavities have been formed at the interface of the first and second carrier elements. An applicable method of manufacture is presented.

The present invention relates in part to nucleic acids encoding proteins, nucleic acids containing non-canonical nucleotides, therapeutics comprising nucleic acids, methods, kits, and devices for inducing cells to express proteins, methods, kits, and devices for transfecting, gene editing, and reprogramming cells, and cells, organisms, and therapeutics produced using these methods, kits, and devices. Methods for inducing cells to express proteins and for reprogramming and gene-editing cells using RNA are disclosed. Methods for producing cells from patient samples, cells produced using these methods, and therapeutics comprising cells produced using these methods are also disclosed.

The present invention relates in part to nucleic acids encoding proteins, nucleic acids containing non-canonical nucleotides, therapeutics comprising nucleic acids, methods, kits, and devices for inducing cells to express proteins, methods, kits, and devices for transfecting, gene editing, and reprogramming cells, and cells, organisms, and therapeutics produced using these methods, kits, and devices. Methods for inducing cells to express proteins and for reprogramming and gene-editing cells using RNA are disclosed. Methods for producing cells from patient samples, cells produced using these methods, and therapeutics comprising cells produced using these methods are also disclosed.

Solar devices and methods for producing solar devices are disclosed. In some examples, a solar device includes solar cells arranged in a shingled manner such that adjacent long edges of adjacent ones of the solar cells overlap. The adjacent long edges have a non-linear shape that has protruding portions. The solar device includes contact pads arranged in the protruding portions of the adjacent long edges such that the contact pads of the adjacent ones of the solar cells are electrically connected.

A thermal shield system with wireless control capabilities including a multi-layer shield, a housing containing a power source and processor, and a programmable control mechanism, wherein the control mechanism is in communication with the processor to facilitate direct or remote manual programming of time and temperature of the shield system. The multi-layer shield includes a perimeter having a first layer comprised of reflective material, a second layer comprised of a plurality of conductive pads arranged in a plurality of rows within a structural support sheet, a third layer comprised of thermal material, an electrical wire running through and connecting said conductive pads of the second layer, and a surround spanning the perimeter of the shield. The surround of the shield has flexibility to allow folding or rolling for compact storage of said shield and having rigidity to provide structural integrity of said shield. The electrical wire connects each of the plurality of conductive pads in a series to generate consistent and uniform heat while minimizing depletion of the power source.

A solar cell module is provided. The solar cell module includes a first substrate, a second substrate opposite the first substrate, a cell unit disposed between the first and second substrates, a first thermosetting resin layer disposed between the cell unit and the first substrate, a first thermoplastic resin layer disposed between the cell unit and the first thermosetting resin layer, a second thermosetting resin layer disposed between the cell unit and the second substrate, and a second thermoplastic resin layer disposed between the cell unit and the second thermosetting resin layer.

A chip package structure includes a substrate having a first surface and a second surface being opposite surfaces of the substrate; a housing disposed on the first surface of the substrate and enclosing a chip region; and a chip set disposed in the chip region and electrically connected to the substrate. The chip set includes a first chip and a second chip, and an active surface of the second chip faces the active surface of the first chip.

A chip package structure includes a substrate having a first surface and a second surface being opposite surfaces of the substrate; a housing disposed on the first surface of the substrate and enclosing a chip region; and a chip set disposed in the chip region and electrically connected to the substrate. The chip set includes a first chip and a second chip, and an active surface of the second chip faces the active surface of the first chip.

There is provided a light trapping dynamic photovoltaic module having a module surface configured to be exposed to solar rays, including a plurality of photovoltaic cell stacks configured adjacent to each other throughout the module surface, wherein each photovoltaic cell stack comprises a plurality of photovoltaic cells. Further, a plurality of reflective strips are placed in between each of the photovoltaic cell stacks for continuously reflecting incident solar rays from one reflective strip to another until absorbed by a photovoltaic cell among said plurality of photovoltaic cells, wherein the incident solar rays are continuously reflected through a mirror phenomenon, wherein the incident solar rays are additionally reflected by front and back panels of the dynamic photovoltaic module, thereby trapping incident solar rays within boundaries of the dynamic photovoltaic module for conversion into electrical energy. Also disclosed is a method of manufacturing the light trapping photovoltaic module.