A solar device includes a first string of first solar wafers, wherein a plurality of the first solar wafers each overlap with at least one vertically adjacent solar wafer from the first string. Additionally, the solar device includes a second string of second solar wafers, wherein a plurality of the second solar wafers each overlap with at least one vertically adjacent solar wafer from the second string, wherein a plurality of the first solar wafers overlap with one or more of the plurality of second solar wafers to electrically connect horizontally adjacent solar wafers in parallel.

A solar cell according to an embodiment of the present invention includes a semiconductor substrate; a first conductive type region positioned at or on the semiconductor substrate; and a first electrode electrically connected to the first conductive type region. The first electrode includes a plurality of first finger lines formed in a first direction and parallel to each other; and a plurality of first bus bars including a plurality of first pad portions positioned in a second direction intersecting with the first direction. The plurality of first finger lines include a contact portion which is in direct contact with the first conductive type region. The plurality of first pad portions have a different material, a composition, or a multi-layered structure that is different from that of the plurality of first finger lines, and are spaced apart from the first conductive type region.

Disclosed is interdigitated back contact (IBC) photovoltaic devices and modules that are based on a silicon structured device which includes: a silicon-based substrate, an intrinsic amorphous silicon layer a-Si:H(i) situated on substrate a first patterned silicon layer, and a second patterned nano-crystalline silicon layer on the first patterned silicon layer. The second patterned layer is of the same type of doping than the first patterned silicon layer The first patterned layer and the second patterned layer form photovoltaic structures, of which at least one constitutes a fiducial mark having, in a predetermined wavelength range, a different optical reflectivity, than the reflectivity of the intrinsic amorphous silicon (a-Si:H(i)) layer portions interstices between the photovoltaic structures. Also disclosed are a photovoltaic device, photovoltaic modules and a method of fabrication of the photovoltaic device.

The present disclosure relates to a 3D formable photovoltaic solar panel, in particular to a semi-finished free-formable photovoltaic module for a 3D formed solar panel, and to a method for manufacturing thereof. The semi-finished free-formable photovoltaic module comprising: a plurality of laterally spaced back contactable flexible photovoltaic elements; a plurality of flexible electrically conductive wiring elements forming an electrically conductive interconnection between flexible photovoltaic elements, each wiring element having an overlap with the respective back terminals of adjacent flexible photovoltaic elements; and an encapsulant over layer, wherein the encapsulant cover layer essentially fixates the overlaps of the wiring elements with respect to the respective back terminals.

Provided is a photovoltaic cell and a photovoltaic module. The photovoltaic cell includes a substrate; a passivation layer located on at least one surface of the substrate; at least one busbar and at least one finger intersecting with each other on a surface of the substrate. The busbar is electrically connected to the finger. A quantity of the busbar is 10 to 15, and electrode pads arranged on a surface of the substrate. A quantity of the electrode pads is 4 to 6. The electrode pads include first and second electrode pads. The first electrode pads are located on two ends of the busbar, the second electrode pads are located between the first electrode pads. The first electrode pads each have an area of 0.6 mm.sup.2 to 1.3 mm.sup.2, and the second electrode pad each have an area of 0.2 mm.sup.2 to 0.5 mm.sup.2.

Provided is a photovoltaic cell and a photovoltaic module. The photovoltaic cell includes a substrate; a passivation layer located on at least one surface of the substrate; at least one busbar and at least one finger intersecting with each other on a surface of the substrate. The busbar is electrically connected to the finger. A quantity of the busbar is 10 to 15, and electrode pads arranged on a surface of the substrate. A quantity of the electrode pads is 4 to 6. The electrode pads include first and second electrode pads. The first electrode pads are located on two ends of the busbar, the second electrode pads are located between the first electrode pads. The first electrode pads each have an area of 0.6 mm.sup.2 to 1.3 mm.sup.2, and the second electrode pad each have an area of 0.2 mm.sup.2 to 0.5 mm.sup.2.

Provided is a solder strip. A cross section of the solder strip includes a base portion and a reflective portion arranged above the base portion. The reflective portion includes a top edge, a first side edge and a second side edge. A first angle is formed between the first side edge and an extension line of the top edge. A second angle is formed between the second side edge and the extension line of the top edge. The first angle and the second angle are greater than 42.5° .

A solar module assembly includes a frame having an upper portion encompassing an area and a mid portion disposed below the upper portion. A plurality of solar panels is arranged in a string, sandwiched between two transparent panes forming a single string panel. The solar panels occupy less than the area of the upper portion. Each of the plurality of solar panels has a pair of opposing edges. A reflector is mounted on the mid portion to reflect light selectively.

Thin-film solar cell modules and serial cell-to-cell interconnect structures and methods of fabrication are described. In an embodiment, a solar cell interconnect includes a bypass diode between adjacent solar cells to allow the flow of current around a single solar cell.

A solar cell includes a substrate having a front surface and a back surface; an emitter formed on the front surface of the substrate; a plurality of first electrodes positioned on the emitter and extended in first direction; a plurality of first bus lines positioned on the emitter and extended in second direction crossing to the first direction; a plurality of back surface field regions formed on the back surface of the substrate and extended in the first direction; a plurality of second electrodes positioned on the plurality of back surface field regions and extended in the first direction; and, a plurality of second bus lines extended in the second direction.