An object is to obtain accurate distance image data by denoising. Another object is to realize distance image data acquisition in a short time by reducing the frequency of accumulating. A distance image processing system including a solid-state imaging element that can be used for three-dimensionally recognizing an object is provided for the utilization of autonomous driving of passenger cars, for example. Image processing including distance information obtained by a TOF system solid-state imaging element, a so-called TOF camera, is performed by utilizing deep learning. A high-accurate distance image with noise reduced by deep learning can be obtained.

A semiconductor device includes an insulating member, a light-receiving element, a light-emitting element, a switching element, a metal reflection plate, a first resin member and a second resin member. The light-receiving element, the switching element and the metal reflection plate are provided on and arranged along a front surface of the insulating member. The switching element is electrically connected to the light-receiving element. The light-emitting element provided on the light-receiving element and optically coupled to the light-receiving element. The metal reflection plate is proximate to the light-receiving element. The first resin member covering the light-emitting element on the light-receiving element. The second resin member covering the light-receiving element, the light-emitting element, the first resin member, the switching element, and the metal reflection plate on the front surface of the insulating member.

A semiconductor device includes an insulating member, a light-receiving element, a light-emitting element, a switching element, a metal reflection plate, a first resin member and a second resin member. The light-receiving element, the switching element and the metal reflection plate are provided on and arranged along a front surface of the insulating member. The switching element is electrically connected to the light-receiving element. The light-emitting element provided on the light-receiving element and optically coupled to the light-receiving element. The metal reflection plate is proximate to the light-receiving element. The first resin member covering the light-emitting element on the light-receiving element. The second resin member covering the light-receiving element, the light-emitting element, the first resin member, the switching element, and the metal reflection plate on the front surface of the insulating member.

An optical semiconductor element includes a substrate and a plurality of cells. Each cell includes an optical layer, a first semiconductor layer, and a second semiconductor layer. The plurality of cells include a first cell and a second cell. The second semiconductor layer of the first cell and the first semiconductor layer of the second cell are electrically connected to each other by a first connection portion of a first wiring portion. The first wiring portion has a first extending portion that extends from the first connection portion so as to surround four side portions of the optical layer of the first cell. The optical layer is an active layer that generates light having a central wavelength of 3 μm or more and 10 μm or less or an absorption layer having a maximum sensitivity wavelength of 3 μm or more and 10 μm or less.

An optical semiconductor element includes a substrate and a plurality of cells. Each cell includes an optical layer, a first semiconductor layer, and a second semiconductor layer. The plurality of cells include a first cell and a second cell. The second semiconductor layer of the first cell and the first semiconductor layer of the second cell are electrically connected to each other by a first connection portion of a first wiring portion. The first wiring portion has a first extending portion that extends from the first connection portion so as to surround four side portions of the optical layer of the first cell. The optical layer is an active layer that generates light having a central wavelength of 3 μm or more and 10 μm or less or an absorption layer having a maximum sensitivity wavelength of 3 μm or more and 10 μm or less.

In one aspect, a medical device may be configured to couple to a body, the medical device comprising: a substrate configured to couple to a user's skin; a photodetector comprising an array of quantum dots, wherein the array of quantum dots includes a first quantum dot of a first size and a second quantum dot of a second size, wherein the first size is different from the second size; a first illuminator configured to emit light at a first range of wavelengths; and a second illuminator configured to emit light at a second range of wavelengths. The second range of wavelengths may be different from the first range of wavelengths.

MicroLEDs may be used in providing intra-chip optical communications and/or inter-chip optical communications, for example within a multi-chip module or semiconductor package containing multiple integrated circuit semiconductor chips. In some embodiments the integrated circuit semiconductor chips may be distributed across different shelves in a rack. The optical interconnections may make use of optical couplings, for example in the form of lens(es) and/or mirrors. In some embodiments arrays of microLEDs and arrays of photodetectors are used in providing parallel links, which in some embodiments are duplex links.

MicroLEDs may be used in providing intra-chip optical communications and/or inter-chip optical communications, for example within a multi-chip module or semiconductor package containing multiple integrated circuit semiconductor chips. In some embodiments the integrated circuit semiconductor chips may be distributed across different shelves in a rack. The optical interconnections may make use of optical couplings, for example in the form of lens(es) and/or mirrors. In some embodiments arrays of microLEDs and arrays of photodetectors are used in providing parallel links, which in some embodiments are duplex links.

Provided are a subminiature optical transmission module and a method for manufacturing same. The optical transmission module includes: a mold body having a first surface and a second surface opposite to each other; multiple edge-type light emitting elements, each of which is molded inside the mold body by fitting same to the first surface so as to match with the first surface and generates an optical signal in the edge direction of a chip; and an optical component disposed on one side thereof so as to optically multiplex multiple optical signals incident from the multiple edge-type light emitting elements and to output same, wherein the identical height is configured between the surface of each light emitting element and the optical axis of the optical component, and the edge direction of the chip is parallel to the first surface of the mold body.

The present technology relates to an optical module capable of improving performance of the optical module including a light emitting element and a light receiving element.

An optical module includes: a substrate; a light emitting element that is disposed on the substrate; a light receiving element that is disposed on the substrate at a predetermined interval from the light emitting element; a first casing that is disposed on the substrate and surrounds a periphery of the light emitting element; a second casing that is disposed on the substrate and surrounds a periphery of the light receiving element; a light emitting lens that is housed in the first casing and is disposed on an optical axis of the light emitting element; and a light receiving lens that is housed in the second casing and is disposed on an optical axis of the light receiving element, in which a first diameter of one lens out of the light emitting lens and the light receiving lens in a first direction toward an optical axis of the other lens with reference to an optical axis of the one lens is shorter than a second diameter of the one lens in a second direction that is orthogonal to the first direction. The present technology can be applied to a distance measuring sensor, for example.