Patent classifications
H01L31/1888
PEROVSKITE SILICON TANDEM SOLAR CELL AND METHOD FOR MANUFACTURING THE SAME
Disclosed is a tandem solar cell according to an aspect including: a silicon lower cell; a perovskite upper cell disposed on the silicon lower cell; and a bonding layer for bonding the silicon lower cell and the perovskite upper cell between the silicon lower cell and the perovskite upper cell, wherein the front surface portion of the silicon lower cell being in contact with the bonding layer includes a texture structure, the bonding layer includes a first transparent electrode layer formed on the sidewall of the texture structure, a buried layer filling concave portions of the texture structure on the first transparent electrode layer, and a second transparent electrode layer on top surfaces of the buried layer, the first transparent electrode layer and the texture structure.
METHOD FOR MANUFACTURING SOLAR CELL
A method for manufacturing a solar cell which simplifies the formation of a transparent electrode layer. The method includes forming conductive semiconductor layers on the back surface side of a substrate, forming a transparent conductive film on the conductive semiconductor layers, forming an uncured film of a metal electrode layer on the conductive semiconductor layers, patterning the transparent conductive film to form transparent electrode layers, and forming the metal electrode layers, in this order. In the metal electrode layer uncured film forming, a printing material is printed and dried to form the uncured film of the metal electrode layer; in the transparent electrode layer forming, the uncured film of the metal electrode layer is used as a mask to pattern the transparent conductive film; and in the metal electrode layer forming, the uncured film of the metal electrode layer is fired and cured to form the metal electrode layers.
Oxide sintered body and transparent conductive oxide film
An oxide sintered body containing indium, hafnium, tantalum, and oxygen as constituent elements, in which when indium, hafnium, and tantalum are designated as In, Hf, and Ta, respectively, the atomic ratio of Hf/(In+Hf+Ta) is equal to 0.002 to 0.030, and the atomic ratio of Ta/(In+Hf+Ta) is equal to 0.0002 to 0.013.
Manufacturing method of flexible thin film solar cell module and the flexible thin film solar cell module using the same
Provided is a method of manufacturing a high efficiency flexible thin film solar cell module including a see-thru pattern. The method of manufacturing a flexible thin film solar cell module includes: sequentially forming a light-absorbing layer, a first buffer layer, and a first transparent electrode layer on the release layer; forming a second buffer layer on the exposed bottom surface of the light-absorbing layer; forming a P2 scribing pattern by removing at least one portion of each of the first buffer layer, the light-absorbing layer, and the second buffer layer; forming a second transparent electrode layer on the second buffer layer and the first transparent electrode layer exposed by the P2 scribing pattern; and forming a P4 see-thru pattern by selectively removing at least one portion of the first buffer layer, the light-absorbing layer, the second buffer layer, and the second transparent electrode layer.
Method for preparing a conductive, transparent and flexible membrane
The technique relates to a method for preparing a nanomesh metal membrane 5 transferable on a very wide variety of supports of different types and shapes comprising at least one step of de-alloying 1 a thin layer 6 of a metal alloy deposited on a substrate 7, said method being characterized in that said thin layer 6 has a thickness less than 100 nm, and in that said de-alloying step 1 is carried out by exposing said thin layer 6 to an acid vapor in the gas phase 8, in order to form said nanomesh metal membrane 5.
FRONT ELECTRODE LAYER OF THIN FILM SOLAR CELL AND MANUFACTURING METHOD THEREOF
A manufacturing method of a front electrode layer of a thin film solar cell including steps below is provided. First, a first transparent conductive layer having a plurality of microstructures is formed on a substrate. Then, a second transparent conductive layer is formed on a surface having the plurality of microstructures of the first transparent conductive layer. A front electrode layer of a thin film solar cell is also provided.
Three-dimensional conductive electrode for solar cell
A photovoltaic device and method include forming a plurality of pillar structures in a substrate, forming a first electrode layer on the pillar structures and forming a continuous photovoltaic stack including an N-type layer, a P-type layer and an intrinsic layer on the first electrode. A second electrode layer is deposited over the photovoltaic stack such that gaps or fissures occur in the second electrode layer between the pillar structures. The second electrode layer is wet etched to open up the gaps or fissures and reduce the second electrode layer to form a three-dimensional electrode of substantially uniform thickness over the photovoltaic stack.
Crystalline silicon solar cell and method for producing same
A crystalline silicon-based solar cell includes, in the following order, a crystalline silicon substrate having a first principal surface, a non-single-crystalline silicon-based thin-film, and a transparent electroconductive layer. The non-single-crystalline silicon-based thin-film and the transparent electroconductive layer are disposed on the first principal surface. The non-single-crystalline silicon-based thin-film comprises, in the following order from the first principal surface, an intrinsic silicon-based thin-film and a conductive silicon-based thin-film. The first principal surface has a plurality of pyramidal projections, each having a top portion, a middle portion, and a bottom portion. A thickness of the non-single-crystalline silicon-based thin-film disposed on the top portions is smaller than a thickness of the non-single-crystalline silicon-based thin-film disposed on the middle portions.
Method of manufacturing printed photovoltaic modules
The invention concerns a method of manufacturing a photovoltaic module comprising at least two electrically connected photovoltaic cells, each photovoltaic cell (4.sub.i) being multi-layered structure disposed on a substrate (6) having down-web direction (X) and a cross-web direction (Y). The method comprises providing a plurality of spaced-apart first electrode strips (8.sub.i) over the substrate (6), each first electrode strip extending along the cross-web direction (Y), and providing, over the first electrode strips layer, at least one insulating strip (14a, 14b) of an insulator material extending along the down-web direction (X), each insulating strip defining a connecting area and an active area. A functional stack (20) comprising a full web coated layer of photoactive semiconductor material is formed over the first layer and within the active area. A plurality of spaced-apart second electrode strips (28.sub.i) are provided within the active area, each second electrode strip extending along the cross-web direction (Y), so as to form photovoltaic cells and a photovoltaic module is formed by electrically connecting at least two adjacent photovoltaic cells, by extending over the insulating strips (14a, 14b) electrical connection patterns to electrically connect, within the connecting area(s), the second electrode strip of an photovoltaic cell to the first electrode strip of an adjacent photovoltaic cell.
RESIST COMPOSITION FOR PATTERN PRINTING AND PATTERN FORMING METHOD
A resist composition for pattern printing contains a binder, a filler, a thickener, and a polyfunctional (meth)acrylate. The resist composition does not contain a photoinitiator. The resist composition also contains photocatalytic titanium oxide. A method for forming a pattern includes a resist composition that is pattern-wise printed, and then the resist composition is irradiated with an actinic radiation such that seepage of the resist component from an end of the pattern during the pattern formation using the resist composition is suppressed and the seepage portion is decomposed. As a result, it is possible to drastically reduce the seepage without impairing the rheology of the resist composition and additionally, to remove a slightly seeping portion without requiring, for example, a harmful ozone treatment or the like.