A light-emitting diode (LED) includes a substrate, a semiconductor stacked structure disposed on the substrate, the semiconductor stacked structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, a wavelength converting layer configured to convert a wavelength of light emitted from the semiconductor stacked structure, the wavelength converting layer covering side surfaces of the substrate and the semiconductor stacked structure, and a distributed Bragg reflector (DBR) configured to reflect at least a portion of light wavelength-converted by the wavelength converting layer, in which at least a portion of the DBR is covered with a metal layer configured to reflect light transmitted through the DBR.

A light-emitting diode (LED) includes a substrate, a semiconductor stacked structure disposed on the substrate, the semiconductor stacked structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, a wavelength converting layer configured to convert a wavelength of light emitted from the semiconductor stacked structure, the wavelength converting layer covering side surfaces of the substrate and the semiconductor stacked structure, and a distributed Bragg reflector (DBR) configured to reflect at least a portion of light wavelength-converted by the wavelength converting layer, in which at least a portion of the DBR is covered with a metal layer configured to reflect light transmitted through the DBR.

An optoelectronic semiconductor device comprises a barrier layer, a first semiconductor layer on the barrier layer, the first semiconductor layer comprising a first dopant and a second dopant, and a second semiconductor layer beneath the barrier layer, the second semiconductor comprising the second dopant, wherein, in the first semiconductor layer, a concentration of the first dopant is larger than a concentration of the second dopant, and the concentration of the second dopant in the second semiconductor layer is larger than that in the first semiconductor layer.

An optoelectronic semiconductor device comprises a barrier layer, a first semiconductor layer on the barrier layer, the first semiconductor layer comprising a first dopant and a second dopant, and a second semiconductor layer beneath the barrier layer, the second semiconductor comprising the second dopant, wherein, in the first semiconductor layer, a concentration of the first dopant is larger than a concentration of the second dopant, and the concentration of the second dopant in the second semiconductor layer is larger than that in the first semiconductor layer.

A method is provided for forming Group IIIA-nitride layers, such as GaN, on substrates. The Group IIIA-nitride layers may be deposited on mesa-patterned semiconductor-on-insulator (SOI, e.g., silicon-on-insulator) substrates. The Group IIIA-nitride layers may be deposited by heteroepitaxial deposition on mesa-patterned semiconductor-on-insulator (SOI, e.g., silicon-on-insulator) substrates.

A method for homogenizing the height of a plurality of wires from the plurality of wires erected on a face of a substrate, the method including a first step of coating the face of the substrate including the plurality of wires with a first film, the first film embedding the plurality of wires over a first height; a second step of coating the first film with a second film, the second film embedding at least one part of the plurality of wires over a second height; a step of removing the second film, the part of the wires of the plurality of wires embedded in the second film being removed at the same time as the second film, a mechanical stress between the first film and the second film being exerted during the removal step.

A method for homogenizing the height of a plurality of wires from the plurality of wires erected on a face of a substrate, the method including a first step of coating the face of the substrate including the plurality of wires with a first film, the first film embedding the plurality of wires over a first height; a second step of coating the first film with a second film, the second film embedding at least one part of the plurality of wires over a second height; a step of removing the second film, the part of the wires of the plurality of wires embedded in the second film being removed at the same time as the second film, a mechanical stress between the first film and the second film being exerted during the removal step.

A color conversion panel according to an exemplary embodiment of the present invention includes: a substrate; a first color filter and a second color filter adjacent to the first color filter disposed on the substrate; a first color conversion layer disposed on the first color filter; and a second color conversion layer disposed on the second color filter, wherein each of the first color conversion layer and the second color conversion layer includes at least two quantum dots representing different colors, and wherein the first color filter displays a different color from the second color filter.

A color conversion panel according to an exemplary embodiment of the present invention includes: a substrate; a first color filter and a second color filter adjacent to the first color filter disposed on the substrate; a first color conversion layer disposed on the first color filter; and a second color conversion layer disposed on the second color filter, wherein each of the first color conversion layer and the second color conversion layer includes at least two quantum dots representing different colors, and wherein the first color filter displays a different color from the second color filter.

A semiconductor structure (100) comprising: a substrate (102), a first layer (106) of Al.sub.XGa.sub.YIn.sub.(1−X−Y)N disposed on the substrate, stacks (107, 109) of several second and third layers (108, 110) alternating against each other, between the substrate and the first layer, a fourth layer (112) of Al.sub.XGa.sub.YIn.sub.(1−X−Y)N, between the stacks, a relaxation layer of AlN disposed between the fourth layer and one of the stacks, and, in each of the stacks: the level of Ga of the second layers increases from one layer to the next in a direction from the substrate to the first layer, the level of Ga of the third layers is constant or decreasing from one layer to the next in said direction, the average mesh parameter of each group of adjacent second and third layers increasing from one group to the next in said direction, the thickness of the second and third layers is less than 5 nm.