A multi-band light emitting diode is provided. The multi-band light emitting diode includes a first conductivity type semiconductor layer, a V-pit generation layer disposed on the first conductivity type semiconductor layer and having a first V-pit of a first inlet width, a stress relief layer disposed on the V-pit generation layer and providing a second V-pit of a second inlet width greater than the first inlet width of the V-pit on the first V-pit, an active layer disposed on the stress relief layer and including a first active layer region formed on a flat surface of the stress relief layer and a second active layer region formed in the second V-pit, and a second conductivity type semiconductor layer disposed on the active layer.

A multi-band light emitting diode is provided. The multi-band light emitting diode includes a first conductivity type semiconductor layer, a V-pit generation layer disposed on the first conductivity type semiconductor layer and having a first V-pit of a first inlet width, a stress relief layer disposed on the V-pit generation layer and providing a second V-pit of a second inlet width greater than the first inlet width of the V-pit on the first V-pit, an active layer disposed on the stress relief layer and including a first active layer region formed on a flat surface of the stress relief layer and a second active layer region formed in the second V-pit, and a second conductivity type semiconductor layer disposed on the active layer.

A method for inkjet printing includes setting a target volume and a target concentration of ink discharged to a pixel, measuring a volume and a concentration of a liquid drop for each of nozzles, selecting first nozzle groups for achieving the target volume, from a volume pool of the liquid drop for each of the nozzles, selecting second nozzle groups for achieving the target concentration, from the first nozzle groups, selecting recipes by combining brightness trend lines, from the second nozzle groups, performing a printing simulation for each of the recipes to select a final recipe, and performing inkjet printing by using the final recipe.

A method for inkjet printing includes setting a target volume and a target concentration of ink discharged to a pixel, measuring a volume and a concentration of a liquid drop for each of nozzles, selecting first nozzle groups for achieving the target volume, from a volume pool of the liquid drop for each of the nozzles, selecting second nozzle groups for achieving the target concentration, from the first nozzle groups, selecting recipes by combining brightness trend lines, from the second nozzle groups, performing a printing simulation for each of the recipes to select a final recipe, and performing inkjet printing by using the final recipe.

Disclosed is an organic light emitting display device including a dam structure disposed in a non-display area of a substrate and an alignment mark disposed outside the dam structure. The alignment mark is not covered by, and does not overlap with, the dam structure, because the alignment mark is disposed outside the dame structure. Thus, a scribing process may be performed smoothly.

A light emitting diode includes an n-type nitride semiconductor layer, a V-pit generation layer located over the n-type nitride semiconductor layer and having a V-pit, an active layer located on the V-pit generation layer, and a p-type nitride semiconductor layer located on the active layer. The active layer includes a well layer, which includes a first well layer portion formed along a flat surface of the V-pit generation layer and a second well layer portion formed in the V-pit of the V-pit generation layer. The active layer emits light having at least two peak wavelengths at a single chip level.

A light emitting diode includes an n-type nitride semiconductor layer, a V-pit generation layer located over the n-type nitride semiconductor layer and having a V-pit, an active layer located on the V-pit generation layer, and a p-type nitride semiconductor layer located on the active layer. The active layer includes a well layer, which includes a first well layer portion formed along a flat surface of the V-pit generation layer and a second well layer portion formed in the V-pit of the V-pit generation layer. The active layer emits light having at least two peak wavelengths at a single chip level.

An optoelectronic device having a substrate and a plurality of sets of light-emitting diodes where each set includes a plurality of light-emitting diodes, a first lower electrode, a second upper electrode, an electronic component of an electronic circuit formed in a first portion of the substrate, on the side of the face of the substrate that does not bear the light-emitting diodes, and a first conductive means formed through the first portion and electrically connecting a first terminal of the electronic component to one amongst the first and second electrodes. The first conductive means of a given set is electrically-insulated from the first conductive means of the other sets.

An optoelectronic device having a substrate and a plurality of sets of light-emitting diodes where each set includes a plurality of light-emitting diodes, a first lower electrode, a second upper electrode, an electronic component of an electronic circuit formed in a first portion of the substrate, on the side of the face of the substrate that does not bear the light-emitting diodes, and a first conductive means formed through the first portion and electrically connecting a first terminal of the electronic component to one amongst the first and second electrodes. The first conductive means of a given set is electrically-insulated from the first conductive means of the other sets.

A nanorod light emitting element includes a first semiconductor layer having a rod shape, a first active layer covering a first portion of a side surface of the first semiconductor layer, the first portion extending from an upper surface of the first semiconductor layer, a second semiconductor layer covering the first active layer, a second active layer covering a second portion of the side surface, the second portion extending from a lower surface of the first semiconductor layer, and spaced apart from the first active layer, and a third semiconductor layer covering the second active layer and spaced apart from the second semiconductor layer.