Quantum dots and methods of making quantum dots are provided.

A quantum dot having a core including a first semiconductor nanocrystal including zinc, selenium, and tellurium, and a semiconductor nanocrystal shell disposed on the surface of the core, the shell including zinc, selenium, and sulfur. The quantum dot is configured to emit green light, the quantum dot does not include cadmium, and the quantum dot has a mole ratio Te:Se of tellurium relative to selenium of greater than about 0.05 and less than or equal to about 0.5:1. A method of producing the quantum dot and an electronic device including the same.

A quantum dot having a core including a first semiconductor nanocrystal including zinc, selenium, and tellurium, and a semiconductor nanocrystal shell disposed on the surface of the core, the shell including zinc, selenium, and sulfur. The quantum dot is configured to emit green light, the quantum dot does not include cadmium, and the quantum dot has a mole ratio Te:Se of tellurium relative to selenium of greater than about 0.05 and less than or equal to about 0.5:1. A method of producing the quantum dot and an electronic device including the same.

A light emitting device including a mounting board, one or more light emitting elements, a light transmissive member, and a light reflective member. The light emitting element(s) are mounted on the mounting board, and each include an upper surface. The light transmissive member is bonded to the upper surface of each of the light emitting element(s). The light transmissive member has an upper surface and a lower surface, and allows light from the light emitting element(s) to be incident on the lower surface of the light transmissive member and to be output from the upper surface of the light transmissive member. The light reflective member covers surfaces of the light transmissive member and lateral surfaces of the light emitting element(s) and exposes the upper surface of the light transmissive member. At least a first portion of the mounting board is exposed from the light reflective member in a plan view.

A light emitting device including a mounting board, one or more light emitting elements, a light transmissive member, and a light reflective member. The light emitting element(s) are mounted on the mounting board, and each include an upper surface. The light transmissive member is bonded to the upper surface of each of the light emitting element(s). The light transmissive member has an upper surface and a lower surface, and allows light from the light emitting element(s) to be incident on the lower surface of the light transmissive member and to be output from the upper surface of the light transmissive member. The light reflective member covers surfaces of the light transmissive member and lateral surfaces of the light emitting element(s) and exposes the upper surface of the light transmissive member. At least a first portion of the mounting board is exposed from the light reflective member in a plan view.

An array substrate, a liquid crystal display panel and a display device with a simple structure are provided. The array substrate includes: a substrate; a plurality of sub-pixel units, located on the substrate and arranged in a matrix form; and a plurality of photoluminescent devices, located in the plurality of sub-pixel units, and emitting light with a corresponding color in correspondence with a color of the sub-pixel unit where it is located.

An array substrate, a liquid crystal display panel and a display device with a simple structure are provided. The array substrate includes: a substrate; a plurality of sub-pixel units, located on the substrate and arranged in a matrix form; and a plurality of photoluminescent devices, located in the plurality of sub-pixel units, and emitting light with a corresponding color in correspondence with a color of the sub-pixel unit where it is located.

Systems and methods for forming semiconductor layers, including oxide-based layers, are disclosed in which a material deposition system has a rotation mechanism that rotates a substrate around a center axis of the substrate. The system includes a heater configured to heat the substrate and a positioning mechanism that allows dynamic adjusting of an orthogonal distance, a lateral distance, and a tilt angle of an exit aperture of a material source relative to the substrate. In some embodiments, the dynamic adjusting is based on a desired layer uniformity for a desired layer growth rate. In some embodiments, the orthogonal distance, the lateral distance, or the tilt angle depends on a predetermined material ejection spatial distribution of the material source.

A semiconductor device comprising: a substrate; a first reflector on the substrate; a second reflector on the first reflector; a semiconductor system directly contacting the first reflector and the second reflector and comprising a first side wall; and an insulating layer covering the first side wall and formed between the substrate and the first reflector.

A semiconductor device comprising: a substrate; a first reflector on the substrate; a second reflector on the first reflector; a semiconductor system directly contacting the first reflector and the second reflector and comprising a first side wall; and an insulating layer covering the first side wall and formed between the substrate and the first reflector.