A light-emitting device includes: a substrate; a plurality of light-emitting elements mounted to the substrate; and a phosphor layer provided on the plurality of light-emitting elements, the phosphor layer including: a plurality of phosphor particles, and a glass layer covering surfaces of the phosphor particles, wherein the phosphor particles are bonded to each other by the glass layer, and an air layer is formed between the phosphor particles.

The present invention provides a luminous body, and light emitting film, light emitting diode and light emitting device including the same. The luminous body can include a plurality of emission moieties each including an inorganic emission particle and a coating layer surrounding a surface of the inorganic emission particle, and an encapsulation moiety connected to the coating layer and surrounding the plurality of emission moieties. The present invention further provides a light emitting film, a liquid crystal display device, a light emitting diode package, a light emitting diode and a light emitting display device including the luminous body.

Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly binder materials for light-emitting devices are disclosed. A lumiphoric material for a light-emitting device may include lumiphoric particles embedded within a binder material. The lumiphoric material may be formed according to sol-gel chemistry techniques where a solution of binder precursors and lumiphoric particles is applied to a surface, dried to reduce liquid phase, and fired to form a hardened and dense lumiphoric material. The binder precursors may include metal oxide precursors that result in a metal oxide binder. In this manner, the lumiphoric material may have high thermal conductivity while also being adaptable for liquid-phase processing. In further embodiments, binder materials with or without lumiphoric particles may be utilized in place of conventional encapsulation materials for light-emitting devices.

A wavelength converting layer may have a glass or a silicon porous support structure. The wavelength converting layer may also have a cured portion of wavelength converting particles and a binder laminated onto the porous glass or silicon support structure.

A light emitting diode package is disclosed. The light emitting diode package includes a light emitting diode chip emitting light and a light transmissive member. The light transmissive member covers at least an upper surface of the light emitting diode chip and includes a light transmissive resin and reinforcing fillers. The reinforcing fillers have at least two side surfaces having different lengths and are dispersed in the light transmissive resin.

An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment an optoelectronic component includes a semiconductor chip including a plurality of pixels, each pixel configured to emit electromagnetic primary radiation from a radiation exit surface and conversion layers located on at least a part of the radiation exit surfaces, wherein the conversion layers comprise a crosslinked matrix having a three-dimensional siloxane-based network and at least one phosphor embedded in the matrix, and wherein the conversion layers have a thickness of ≤30 μm.

A display device according to an example embodiment of the present disclosure includes a first substrate including an active area including a plurality of pixels and a non-active area surrounding the active area; a plurality of LEDs disposed in the plurality of pixels on the first substrate; a planarization layer disposed to surround the plurality of LEDs; a bank disposed on the planarization layer and including a black material; a reflection-reducing layer disposed on the bank and having a reflectance varying according to temperature; and a heat dissipation layer disposed on the reflection-reducing layer.

A light emitting device including a bulb having a side surface, a board elongated longer in a first direction than in a second direction perpendicular to the first direction, and a plurality of light emitting elements mounted on the board. Each of the plurality of light emitting elements has an upper surface and a lower surface opposite to the upper surface, where the lower surface is mounted on the board. The device includes a plurality of sets of metal plates and leads electrically connected to the plurality of light emitting elements, and a wavelength conversion member covering the light emitting elements and a portion of each of the metal plates. The board, the light emitting elements, the sets of metal plates and leads, and the wavelength conversion member are disposed in the bulb. The upper surface of each of the light emitting elements faces the side surface of the bulb.

In an embodiment a conversion element includes a first phase and a second phase, wherein the first phase comprises lutetium, aluminum, oxygen and a rare-earth element, wherein the second phase comprises Al.sub.2O.sub.3 single crystals, and wherein the conversion element comprises at least one groove.

A wavelength conversion element includes a substrate, an adhesion layer and a wavelength conversion material. The substrate has a bearing surface having an adhesion zone. The adhesion zone has a central portion and two edge portions respectively on two sides of the central portion. The adhesion layer is disposed on the adhesion zone and includes a first adhesive and a second adhesive. The first adhesive is disposed at the edge portions. The second adhesive is disposed at the central portion. Operating temperature of the first adhesive is lower than operating temperature of the second adhesive. Viscosity of the first adhesive is larger than viscosity of the second adhesive. The wavelength conversion material is fixed on the bearing surface by the first adhesive and the second adhesive. A projection apparatus having the wavelength conversion element is provided, and the durability of the wavelength conversion element and the projection apparatus is improved.