A photoconversion device includes a wavelength converter including a plurality of phosphor areas, a drive, and a controller. The plurality of phosphor areas includes a first phosphor area to emit fluorescence with a first wavelength spectrum in response to excitation light and a second phosphor area to emit fluorescence with a second wavelength spectrum different from the first wavelength spectrum in response to the excitation light. The drive changes an illuminating area to receive the excitation light in the plurality of phosphor areas. The controller drives the drive to change the illuminating area in the plurality of phosphor areas and stop driving the drive to define the illuminating area in the plurality of phosphor areas.

Disclosed herein are a light emitting diode package and a method of manufacturing the same. The light emitting diode package includes: a substrate, a light-emitting layer disposed on a surface of the substrate and including a first type semiconductor layer, an active layer, and a second type semiconductor layer, a first bump disposed on the first type semiconductor layer and a second bump disposed the second type semiconductor layer, a protective layer covering at least the light-emitting layer, and a first bump pad and a second bump pad disposed on the protective layer and connected to the first bump and the second bump, respectively.

A method includes mounting a ceramic phosphor on an acrylic-free and metal-containing catalyst-free tacky layer of a dicing tape, dicing the ceramic phosphor from the dicing tape into ceramic phosphor plates, removing the ceramic phosphor plates from the dicing tape, and attaching the ceramic phosphor plates on light-emitting device (LED) dies.

An inorganic coating may be applied to bond optically scattering particles or components. Optically scattering particles bonded via the inorganic coating may form a three dimensional film which can receive a light emission, convert, and emit the light emission with one or more changed properties. The inorganic coating may be deposited using a low-pressure deposition technique such as an atomic layer deposition (ALD) technique. Two or more components, such as an LED and a ceramic phosphor layer may be bonded together by depositing an inorganic coating using the ALD technique.

A light-emitting device includes: a substrate; a plurality of light-emitting elements mounted to the substrate; and a phosphor layer provided on the plurality of light-emitting elements, the phosphor layer including: a plurality of phosphor particles, and a glass layer covering surfaces of the phosphor particles, wherein the phosphor particles are bonded to each other by the glass layer, and an air layer is formed between the phosphor particles.

A method of manufacturing a light emitting module is provided. A plurality of light-emitting diodes are aligned on an elongated base board. By a dispenser, an uncured paste of sealing material is continuously applied on a plurality of light-emitting diodes aligned on the elongated base board. The applied paste of sealing material is cured.

A white light emitting device may include a substrate, first LEDs disposed on the substrate, a first photoluminescence material disposed over the first LEDs, second LEDs disposed on the substrate, where the first LEDs and the second LEDs emit blue light at substantially the same wavelength, a second photoluminescence material disposed over the second LEDs, the second photoluminescence material having a composition different from the first photoluminescence material, where an emission product of the white light emitting device is a combination of light emitted from (i) a combination of the first LEDs and the first photoluminescence material, and (ii) a combination of the second LEDs and the second photoluminescence material, and a dimming control connected to the first LEDs and to the second LEDs; where the dimming control is actuable to modify the emission product.

In an image display element, a side surface of a nitride semiconductor is covered with a reflection material inclined so as to open in a light emitting direction, wavelength conversion units are surrounded by partition walls, and side surfaces of the partition walls facing the wavelength conversion units are reflection surfaces inclined so as to open in the light emitting direction.

An optical filter includes a substrate, a filter layer on the substrate and including color filters, and a light-converting layer over the filter layer and including light-converting portions respectively corresponding to the color filters. A low refractive index layer is between the filter layer and the light-converting layer and has a refractive index less than a refractive index of the light-converting layer. A first capping layer is between the low refractive index layer and the light-converting layer and has a refractive index ranging between the refractive index of the light-converting layer and the refractive index of the low refractive index layer.

Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly binder materials for light-emitting devices are disclosed. A lumiphoric material for a light-emitting device may include lumiphoric particles embedded within a binder material. The lumiphoric material may be formed according to sol-gel chemistry techniques where a solution of binder precursors and lumiphoric particles is applied to a surface, dried to reduce liquid phase, and fired to form a hardened and dense lumiphoric material. The binder precursors may include metal oxide precursors that result in a metal oxide binder. In this manner, the lumiphoric material may have high thermal conductivity while also being adaptable for liquid-phase processing. In further embodiments, binder materials with or without lumiphoric particles may be utilized in place of conventional encapsulation materials for light-emitting devices.