A dimming agent according to one or more embodiments is disclosed that may include at least one of terbium, praseodymium, manganese, titanium. A diffuse reflection intensity of the dimming agent in a wavelength of from 400 nm to 750 nm may be 80% or less.

A sterilization module including a main body including an ultraviolet outlet, a transparent member disposed on the ultraviolet outlet to transmit ultraviolet light, and a light source unit irradiating ultraviolet light toward the transparent member, and a sealing member, in which the light source unit includes a circuit board and a light emitting diode chip mounted thereon and including an epitaxial substrate, a conductive semiconductor layer electrically connected to the circuit board directly by an electrode, ultraviolet light is c irradiated toward the transparent member by passing through the epitaxial substrate, the sealing member is disposed between the transparent member and the circuit board, and a distance between the transparent member and the circuit board spaced apart from each other by the sealing member is greater than a height of the light emitting diode chip.

A sterilization module including a main body including an ultraviolet outlet, a transparent member disposed on the ultraviolet outlet to transmit ultraviolet light, and a light source unit irradiating ultraviolet light toward the transparent member, and a sealing member, in which the light source unit includes a circuit board and a light emitting diode chip mounted thereon and including an epitaxial substrate, a conductive semiconductor layer electrically connected to the circuit board directly by an electrode, ultraviolet light is c irradiated toward the transparent member by passing through the epitaxial substrate, the sealing member is disposed between the transparent member and the circuit board, and a distance between the transparent member and the circuit board spaced apart from each other by the sealing member is greater than a height of the light emitting diode chip.

A semiconductor structure, a method for producing a semiconductor structure and a light emitting device are disclosed. In an embodiment a semiconductor structure includes a plurality of discrete encapsulated semiconductor nanoparticles and a plurality of discrete semiconductor free nanoparticles, wherein the discrete encapsulated semiconductor nanoparticles and the discrete semiconductor free nanoparticles form an agglomerate.

A semiconductor structure, a method for producing a semiconductor structure and a light emitting device are disclosed. In an embodiment a semiconductor structure includes a plurality of discrete encapsulated semiconductor nanoparticles and a plurality of discrete semiconductor free nanoparticles, wherein the discrete encapsulated semiconductor nanoparticles and the discrete semiconductor free nanoparticles form an agglomerate.

A thermosetting silicone resin composition contains the following components (A-1) to (D): (A-1) an alkenyl group-containing linear organopolysiloxane; (A-2) a branched organopolysiloxane shown by (R.sup.1.sub.3SiO.sub.1/2).sub.a(R.sup.2.sub.3SiO.sub.1/2).sub.b(SiO.sub.4/2).sub.c (1); (B-1) a branched organohydrogenpolysiloxane shown by (HR.sup.2.sub.2SiO.sub.1/2).sub.d(R.sup.2.sub.3SiO.sub.1/2).sub.e(SiO.sub.4/2).sub.f (2); (B-2) a linear organohydrogenpolysiloxane shown by (R.sup.2.sub.3SiO.sub.1/2).sub.2(HR.sup.2SiO.sub.2/2).sub.x(R.sup.2.sub.2SiO.sub.2/2).sub.y (3); (C) an adhesion aid which is an epoxy group-containing branched organopolysiloxane; and (D) a catalyst containing a combination of a zero-valent platinum complex with a divalent platinum complex and/or a tetravalent platinum complex. This provides a thermosetting silicone resin composition which causes little contamination at a gold pad portion and has excellent adhesiveness to a silver lead frame.

An embodiment of the present invention provides an element transferring method that may increase a yield of transferring an element, and an electronic panel manufacturing method using the same. The element transferring method includes: preparing a carrier film in which a first surface of an element on which a terminal is formed is adhered to an adhesive surface; providing a cover adhesive layer on the adhesive surface so that the second surface of the element that is opposite to the first surface and where the terminal is not formed is covered; transferring the element to the target substrate by adhering the cover adhesive layer to the target substrate while the second surface is facing the target substrate; and separating the carrier film from the element, wherein in transferring the element, the carrier film is pressed so that the surface of the cover adhesive layer is flat at the same height as the terminal.

Described are luminescent components with excellent performance and stability. The luminescent components comprise a first element including first luminescent crystals from the class of perovskite crystals, embedded a first polymer P1 and a second element comprising a second solid polymer composition, said second polymer composition optionally comprising second luminescent crystals embedded in a second polymer P2. Polymers P1 and P2 differ and are further specified in the claims. Also described are methods for manufacturing such components and devices comprising such components.

Described are luminescent components with excellent performance and stability. The luminescent components comprise a first element including first luminescent crystals from the class of perovskite crystals, embedded a first polymer P1 and a second element comprising a second solid polymer composition, said second polymer composition optionally comprising second luminescent crystals embedded in a second polymer P2. Polymers P1 and P2 differ and are further specified in the claims. Also described are methods for manufacturing such components and devices comprising such components.

The present invention relates to a light source device having minimized exposure of an LED package formed on the light source device, and a camera inspection device using same such that erroneous detections during camera inspection can be minimized A camera inspection device according to the present invention comprises: a portable terminal cradle on which a portable terminal equipped with a camera is cradled; a light source device installed to be spaced apart from the upper portion of the portable terminal cradle by a predetermined distance and configured to emit light towards the camera; and a controller for controlling the turning on/off of the light source device and imaging operations of the camera so as to perform a light bleeding inspection of the camera mounted on the portable terminal. A light source device according to the present invention comprises: an LED package having multiple LED elements mounted on the upper surface of a printed circuit board; and an LED package cover having multiple coupling holes into which the multiple LED elements mounted on the LED package are inserted, respectively, the LED package cover covering a part of the upper surface of the printed circuit board, which is exposed between the multiple LED elements. The LED package cover having a lusterless surface is used to insert the LED elements mounted on the LED package into the coupling holes and to cover same, thereby preventing light bleeding inspection erroneous detections caused by exposure of elements, wires, or soldering parts on side surfaces of the LED elements. The LED package cover has the same height as that of the LED elements of the LED package, thereby preventing the LED elements from being damaged by exposure to the outside.