A light-emitting device includes a semiconductor diode structure, a quasi-guided-mode (QGM) structure against the back of the diode structure, and a reflector against the back of the QGM structure. The diode structure includes first and second doped semiconductor layers and an active layer between them; the active layer emits output light at a nominal emission vacuum wavelength λ.sub.0 to propagate within the diode structure. The QGM structure includes a waveguide layer, a cladding layer, and scattering elements, and is in near-field proximity to the active layer relative to λ.sub.0. At least a portion of the output light, propagating perpendicularly within the diode structure relative to a device exit surface, exits the diode structure as device output light. The scattering elements redirect output light propagating within the device, including in laterally propagating quasi-guided modes supported by the QGM structure, to propagate perpendicularly toward the device exit surface.

A bottom-emission light-emitting diode (LED) display includes a transparent substrate, a plurality of LEDs bonded on the substrate, a packaging layer formed on the substrate to cover the LEDs, and a reflecting layer formed on the packaging layer to reflect light emitted by the plurality of LEDs. The reflecting layer has a non-smooth shape or the packaging layer has different refractivities.

A bottom-emission light-emitting diode (LED) display includes a transparent substrate, a plurality of LEDs bonded on the substrate, a packaging layer formed on the substrate to cover the LEDs, and a reflecting layer formed on the packaging layer to reflect light emitted by the plurality of LEDs. The reflecting layer has a non-smooth shape or the packaging layer has different refractivities.

A display device includes: a substrate; a partition wall on the substrate; a plurality of light emitting areas on the substrate, the light emitting areas including a first light emitting area, a second light emitting area, and a third light emitting area partitioned by the partition wall; a first light emitting element in the first light emitting area and configured to emit first light; a second light emitting element in the second light emitting area and configured to emit second light; and a third light emitting element in the third light emitting area and configured to emit third light. An area of the first light emitting area is larger than an area of the first light emitting element and is larger than an area of the second light emitting area and an area of the third light emitting area.

A package includes a first lead including a first electrode terminal, a second lead including a second electrode terminal, a first molded body holding the first lead, and a second molded body holding the second lead. The second lead is provided on the first lead in an overlapping direction such that the first electrode terminal of the first lead overlaps with the second electrode terminal of the second lead when viewed in the overlapping direction. The first electrode terminal and the second electrode terminal are electrically connected to each other without adding additional material. A part of the first molded body and a part of the second molded body are in contact with each other.

A package includes a first lead including a first electrode terminal, a second lead including a second electrode terminal, a first molded body holding the first lead, and a second molded body holding the second lead. The second lead is provided on the first lead in an overlapping direction such that the first electrode terminal of the first lead overlaps with the second electrode terminal of the second lead when viewed in the overlapping direction. The first electrode terminal and the second electrode terminal are electrically connected to each other without adding additional material. A part of the first molded body and a part of the second molded body are in contact with each other.

A manufacturing method of a light-emitting device, including the steps of: preparing a substrate including a base, a first wall formed on an upper surface of the base, and a recess defined by a lateral surface of the first wall as an inside lateral surface and the upper surface of the base as a bottom surface; mounting a light-emitting element on the bottom surface of the recess; disposing a sealing member which covers the light-emitting element and the first wall; forming a groove section extending from an upper surface of the sealing member to the first wall by removing the sealing member on the first wall; disposing a second wall inside the groove section; and cutting the second wall and the substrate at a position including the second wall.

A manufacturing method of a light-emitting device, including the steps of: preparing a substrate including a base, a first wall formed on an upper surface of the base, and a recess defined by a lateral surface of the first wall as an inside lateral surface and the upper surface of the base as a bottom surface; mounting a light-emitting element on the bottom surface of the recess; disposing a sealing member which covers the light-emitting element and the first wall; forming a groove section extending from an upper surface of the sealing member to the first wall by removing the sealing member on the first wall; disposing a second wall inside the groove section; and cutting the second wall and the substrate at a position including the second wall.

Provided is a light-emitting device with reduced in-plane luminance variation. The light-emitting device includes a main substrate, a plurality of light sources, a plurality of lenses, and one or more light reflection members. The main substrate includes a central part and a peripheral part that surrounds the central part. The plurality of light sources are each disposed on the central part of the main substrate. The plurality of lenses are disposed to correspond to the plurality of light sources respectively. The plurality of lenses apply optical effects to beams of light from the plurality of light sources respectively. One or more light reflection members are each disposed on the peripheral part. The light reflection members each have reflectance that is higher than the reflectance of the main substrate.

Provided is a light-emitting device with reduced in-plane luminance variation. The light-emitting device includes a main substrate, a plurality of light sources, a plurality of lenses, and one or more light reflection members. The main substrate includes a central part and a peripheral part that surrounds the central part. The plurality of light sources are each disposed on the central part of the main substrate. The plurality of lenses are disposed to correspond to the plurality of light sources respectively. The plurality of lenses apply optical effects to beams of light from the plurality of light sources respectively. One or more light reflection members are each disposed on the peripheral part. The light reflection members each have reflectance that is higher than the reflectance of the main substrate.