A template for growing Group III-nitride semiconductor layers, a Group III-nitride semiconductor light emitting device and methods of manufacturing the same are provided. The template for growing Group III-nitride semiconductor layers includes a growth substrate having a first plane, a second plane opposite to the first plane and a groove extending inwards the growth substrate from the first plane, an insert for heat dissipation placed and secured in the groove, and a nucleation layer formed on a partially removed portion of the first plane.

A chip package structure includes a substrate having a first surface and a second surface being opposite surfaces of the substrate; a housing disposed on the first surface of the substrate and enclosing a chip region; and a chip set disposed in the chip region and electrically connected to the substrate. The chip set includes a first chip and a second chip, and an active surface of the second chip faces the active surface of the first chip.

A light-emitting module includes a first substrate, a heat dissipation member, a second substrate, and a light-emitting element. The heat dissipation member is disposed on the first substrate. The second substrate is disposed on the heat dissipation member. The light-emitting element is disposed on a lower surface of the first substrate or an upper surface of the second substrate. The heat dissipation member includes a graphite member and a metal member. The graphite member has a first surface facing the first substrate and a second surface located opposite to the first surface. The graphite member has a first groove extending in a first direction in the first surface. The metal member includes a first internal metal member disposed in the first groove.

Provided is an upper substrate for a miniature LED component, a miniature LED component, and a miniature LED display device, wherein the upper substrate for the miniature LED component comprises: a bottom substrate; a metal layer formed on the bottom substrate and having a pattern capable of covering a non-opening region of the lower substrate for the miniature LED component; a graphene layer formed on the bottom substrate; a transparent adhesive layer formed on the bottom substrate to cover the metal layer and the graphene layer.

An object of the present invention is to provide a heat dissipation sheet having high thermal conductivity in the thickness direction. The present invention provides a heat dissipation sheet having a structure in which at least two thermally conductive insulation layers are laminated, wherein the lamination direction of the thermally conductive insulation layers is substantially perpendicular to the thickness direction of the heat dissipation sheet, and wherein for the entire cross-section perpendicular to the in-plane direction of the heat dissipation sheet, the thermally conductive insulation layer contains 75 to 97% by area of insulating particles, 3 to 25% by area of a binder resin, and 10% by area or less of voids.

A wavelength conversion member includes: a phosphor; a metal joining layer provided on a bottom surface and a side surface of the phosphor; a metal heat-dissipating holding unit including a recess that covers the bottom surface and at least a portion of the side surface of the phosphor and that accommodates the phosphor so that the phosphor is embedded in the recess; and a metal porous joining material provided between the metal joining layer and the metal heat-dissipating holding unit.

A mother panel for a display panel includes: a mother substrate including a display panel area and a dummy area surrounding the display panel area, the mother substrate having a cutting line defined thereon, wherein the cutting line is configured to be irradiated by a laser along a boundary between the display panel area and the dummy area; and a first heat dissipation pattern on the mother substrate, extending from the display panel area to the dummy area to overlap the cutting line, and including a first rod portion including a plurality of lower rods spaced apart from each other and a first body portion in the dummy area and contacting the first rod portion.

Provided is a display apparatus including a transparent substrate, display modules on the transparent substrate, an interconnect, a cover layer and a control device. The display module includes a first circuit board, LED devices and a molding layer. The first circuit board has first and second surfaces opposite to each other, and is disposed on the transparent substrate with the first surface facing the transparent substrate. The LED devices are disposed on the first surface and electrically connected to the first circuit board. The molding layer is disposed on the first surface to cover the LED devices. The interconnect is disposed in the first circuit board and on the second surface to electrically connect the display modules to each other. The cover layer covers the display modules and the interconnect. The control device is electrically connected to a portion of the interconnect adjacent to the edge of the transparent substrate.

An optoelectronic component includes a radiation side, a contact side opposite the radiation side having at least two electrically conductive contact elements, and a semiconductor layer sequence having an active layer that emits or absorbs the electromagnetic radiation, wherein the at least two electrically conductive contact elements have different polarities, are spaced apart from each other and are completely or partially exposed at the contact side in an unmounted state of the optoelectronic component, a region of the contact side is partially or completely covered with an electrically insulating, contiguously formed cooling element, the cooling element is in direct contact with the contact side and has a thermal conductivity of at least 30 W/(m.Math.K), and in a plan view of the contact side, the cooling element partially covers one or both of the at least two electrically conductive contact elements.

A nitride-based ceramics resin composite body having thermal conductivity, electrical insulation, and adhesion to adherends equal to conventional products, and having improved heat resistance reliability during the reflow process, and a thermal conductive insulating adhesive sheet using the same are provided. A nitride-based ceramics resin composite body in which a thermosetting resin composition is impregnated in a porous nitride-based ceramics sintered body is provided. The thermosetting resin composition includes a specific epoxy resin and a bismaleimide triazine resin, and a water absorption of the thermosetting resin composition in a completely cured state measured in accordance with method A in JIS K7209 (2000) is 1% by mass or less.