In an embodiment an optoelectronic semiconductor component includes a heat dissipating structure having a plurality of protrusions and a radiation emitting semiconductor chip, wherein the semiconductor chip is arranged at the heat dissipating structure, wherein at least some of the protrusions are arranged at a radiation exit side of the component, and wherein a height of at least some of the protrusions corresponds at least to a height of the semiconductor chip.

A light emitting assembly comprising a solid state device, when and if coupleable with a power supply constructed and arranged to power the solid state device to emit from the solid state device a first wavelength radiation (i.e., primary radiation), and a set of nesting enclosures enhancing the luminescence of the solid-state device and providing a mechanism for arranging luminophoric medium in receiving relationship to said first radiation, and which in exposure to said first radiation, is excited to responsively emit a second wavelength radiation (i.e., secondary radiation) or to otherwise transfer its energy without radiation to a third radiative component (i.e., tertiary radiation). In a specific embodiment, monochromatic blue or UV light output from a light-emitting diode is converted to achromatic light with fluorescers and phosphors under an inert gas. In a specific embodiment, heat is dissipated to the external surroundings without employing a heat sink.

A semiconductor package includes a substrate body made of an insulating material and having a frame shape with a through hole; and a heat-dissipating member made of a metallic material and having a top face serving as an element-mounting surface, the element-mounting surface being positioned in the through hole. A back face of the substrate body and a front face of the heat-dissipating member are joined to each other with a joining agent, the back face being oriented downward, the front face being oriented upward. The substrate body includes a first riser portion extending downward from the back face. The heat-dissipating member includes a second riser portion extending upward from the front face. The joining agent is placed in a space enclosed by the back face, the first riser portion, the front face, and the second riser portion.

A circuit part is provided that provides both high heat dissipation and high adhesion of its circuit wiring. A circuit part includes: a metal member; an insulating resin layer located on the metal member; circuit wiring including a plating film located on the insulating resin layer; and a mounted component mounted on the circuit wiring and electrically connected to the circuit wiring, wherein a plurality of non-penetrating holes are provided in a wiring region, the non-penetrating holes being filled with the plating film, the wiring region being a portion of the resin-layer surface on which the circuit wiring is located, and the ratio of the depth d of the non-penetrating holes to the width D of the non-penetrating holes, d/D, is 0.5 to 5.

A light emitting apparatus includes: an electrically insulating base member having, in a top plan view, a first edge, a second edge opposite the first edge, a third edge, and a fourth edge opposite the third edge, wherein the first and second edges of the base member extend in a first direction, and the third and fourth edges of the base member extend in a second direction; first and second electrically conductive pattern portions formed on an upper surface of the base member; at least one light emitting device that is electrically connected to the first and second electrically conductive pattern portions; a transparent member disposed on the at least one light emitting device; and a resin portion that surrounds the transparent member in the top plan view, and that partially covers the first and second electrically conductive pattern portions.

A light emitting device is provided that includes an integral heat dissipation element. This heat dissipation element is included in the leadframe that is used to facilitate fabrication of the light emitting device, to provide a single common substrate that forms both the heat dissipation element and the conductive elements for coupling the light emitting device to external sources of power. The heat dissipation element may extend beyond the protective structure that surrounds the light emitting element to facilitate heat dissipation to the surrounding medium.

Provided are a nano-structure assembly including an insulating substrate; and a nano-structure formed on the insulating substrate, and a nano-device including the same.

Solid state lighting devices and associated methods of thermal sinking are described below. In one embodiment, a light emitting diode (LED) device includes a heat sink, an LED die thermally coupled to the heat sink, and a phosphor spaced apart from the LED die. The LED device also includes a heat conduction path in direct contact with both the phosphor and the heat sink. The heat conduction path is configured to conduct heat from the phosphor to the heat sink.

An LED package is described that acts as a sub-mount between a printed circuit board and a diode. The sub-mount includes a laminate to thermally isolate the diode, for example an LED, from the PCB while providing a thermal heat dissipative sink for the diode.

A light emitting device includes: a substrate; one or more LED (light emitting diode) elements mounted on a substrate; and a radiator unit made of metal paste and arranged on a rear surface opposite to a principal surface on which the one or more LED elements are mounted. The height Ta of the radiator unit from a rear surface is less than thickness Tb of substrate.