A method of cooling an optical sub-assembly includes operating a diode mounted to a diode submount structure and cooling the diode with a thermoelectric cooler (TEC) in thermal contact with the diode, wherein the diode is positioned between the diode submount structure and the TEC.

A light-emitting device with an electric power generation function includes a thermal conductive LED board that includes a thermal conductive base having a mounting surface and an open surface, and a board wiring provided on the mounting surface. An LED element is connected with the board wiring. A thermoelectric element is electrically insulated from the thermal conductive base, and thermally coupled with the thermal conductive base. The thermoelectric element includes a casing unit having a housing unit, and includes, in the housing unit, a first electrode unit, a second electrode unit having a work function different from a work function of the first electrode unit, and a middle unit including nanoparticles having a work function between the work function of the first electrode unit and the work function of the second electrode unit. The casing unit is provided on the open surface of the thermal conductive base.

An optical sub-assembly includes a diode submount structure, a diode mounted to the diode submount, and a thermoelectric cooler (TEC). The TEC is in thermal contact with the diode, and the diode is positioned between the diode submount structure and the TEC.

A heat dissipation device including two insulation layers, two metal layers, a semiconductor layer, and a phosphor layer is provided. The semiconductor layer is disposed between the two metal layers, and the whole of the semiconductor and the two metal layers is disposed between the two insulation layers. The phosphor layer is disposed on one of the insulation layers. A projector is also provided.

A cooling system includes a controller, a plurality of sensor sub-units, a plurality of solid-state cooling sub-units and a heat exchanger. The sensor sub-units are configured to be thermally connected to a heat source. The heat source has a plurality of sub-regions that correspond with each of the sensor sub-units. Each solid-state cooling sub-unit corresponds with and thermally connects to one of the sensor sub-units and is configured to dissipate heat from the sub-regions of the heat source. The heat exchanger is configured to dissipate heat from the sub-regions of the heat source and waste heat. The controller, based on temperatures sampled from the plurality of sensor sub-units and predictions made by an optimizer, is configured to determine the one or more sub-regions of the heat source to cool.

An optoelectronic device is specified, with a radiation-emitting semiconductor chip configured to generate electromagnetic radiation, and an active element configured to change a physical state, wherein the active element is embedded in a component of the component, and the physical change of state comprises the following: temperature change, sound generation, mechanical motion.

An insulated heat transfer substrate includes a heat transfer layer formed of aluminum or an aluminum alloy, a conductive layer provided on one surface side of the heat transfer layer, and a glass layer formed between the conductive layer and the heat transfer layer, in which the conductive layer is formed of a sintered body of silver, and a thickness of the glass layer is in a range of 5 μm or larger and 50 μm or smaller.

A semiconductor-based light emitting platform (LEP) comprising a heated blackbody radiator wherein the light emitting platform is thermally isolated by nanowires having ultra-low thermal conductivity. In embodiments, the pixel is structured for broadband emission with a platform comprising an infrared surface structured for high emissivity within a broadband wavelength range. In other embodiments radiation is confined to a limited bandwidth by metamaterial and other resonant filters. In embodiments, the internal efficiency of the LEP configured for broadband operation can be higher compared with an LED.

A header for a semiconductor package includes: an eyelet having an upper surface and a lower surface; a first metal block molded integrally with the eyelet, protruding at the upper surface, and having a substantially U shape; a first lead sealed in a first through hole penetrating the eyelet; a first substrate having a front surface formed with a first signal pattern electrically connected to the first lead and having a back surface fixed to a first end surface of the first metal block; a second lead sealed in a second through hole penetrating the eyelet; and a second substrate having a front surface formed with a second signal pattern electrically connected to the second lead and having a back surface fixed to a second end surface of the first metal block.

A header for a semiconductor package, includes an eyelet having an upper surface, and a lower surface on an opposite side from the upper surface, a metal block having a side surface, and configured to protrude from the upper surface of the eyelet, a lead sealed in a through hole which penetrates the eyelet from the upper surface to the lower surface of the eyelet, and a substrate having a front surface formed with a signal pattern electrically connected to the lead, and a back surface on an opposite side from the front surface. The back surface of the substrate is fixed to the side surface of the metal block. A portion of the back surface of the substrate is exposed from the metal block, and this portion of the substrate is formed with a ground pattern.