A light-emitting device includes: a resin package including: a lead part including a first lead and a second lead, each including a main body portion and a raised portion connected to the main body portion, wherein an upper surface of each of the first lead and the second lead includes a first primary surface portion in the main body portion and a curved portion in the raised portion in a cross-sectional view taken in a direction perpendicular to an upper surface of the lead part, and wherein the curved portion is continuous with and curved upward from an end portion of the first primary surface portion, a resin portion, and a recess defined by a portion of the upper surface of the lead part and the resin portion; and a light-emitting element mounted in the resin package. The curved portion is buried in the resin portion.

An optical power transfer device with an embedded active cooling chip is disclosed. The device includes a cooling chip made of a semiconductor material, and a first subassembly and a second subassembly mounted on the cooling chip. The cooling chip comprises at least one metallization layer on a portion of a first surface of the cooling chip, at least one inlet through a second surface of the cooling chip, wherein the second surface is opposite to the first surface, at least one outlet through the second surface and one or more micro-channels extending between and fluidly coupled to the at least one inlet and the at least one outlet. A cooling fluid flows through the one or more micro-channels. The first subassembly is mounted on the at least one metallization layer and comprises a laser. The second subassembly comprises a phototransducer configured to receive a laser beam from the laser.

A cooling system includes a controller, a plurality of sensor sub-units, a plurality of solid-state cooling sub-units and a heat exchanger. The sensor sub-units are configured to be thermally connected to a heat source. The heat source has a plurality of sub-regions that correspond with each of the sensor sub-units. Each solid-state cooling sub-unit corresponds with and thermally connects to one of the sensor sub-units and is configured to dissipate heat from the sub-regions of the heat source. The heat exchanger is configured to dissipate heat from the sub-regions of the heat source and waste heat. The controller, based on temperatures sampled from the plurality of sensor sub-units and predictions made by an optimizer, is configured to determine the one or more sub-regions of the heat source to cool.

A light-emitting package and a method for forming a light-emitting package are provided. The light-emitting package includes a substrate, an interconnection structure and a thermoelectric element. The interconnection structure is disposed over the substrate. The interconnection structure comprises a light-emitting element. The thermoelectric element penetrates through the substrate, extends into the interconnection structure and stops at the light-emitting element. The thermoelectric element is configured for local cooling of the light-emitting element.

The present application discloses a display module and a display device. The display module comprises a substrate, a light emitting device, a radiation component and a detection unit. The light emitting device is on one side of the substrate, and the radiation component is on one side of the light-emitting device close to the substrate. An orthographic projection of the radiation component on the substrate overlapping at least in part with an orthographic projection of the light-emitting device on the substrate.

Example superlattice structures and methods for thermoelectric devices are provided. An example structure may include a plurality of superlattice periods. Each superlattice period may include a first material layer disposed adjacent to a second material layer. For each superlattice period, the first material layer may be formed of a first material and the second material layer may be formed of a second material. The plurality of superlattice periods may include a first superlattice period and a second superlattice period. A thickness of a first material layer of the first superlattice period may be different than a thickness of a first material layer of the second superlattice period.

An optical semiconductor component package includes a base, a frame, a lid, and a light absorbing member located on an inner surface of the lid. The base is plate-like and has a first surface including a mount area in which an optical semiconductor component is mountable. The frame is located on the first surface and surrounds the mount area. The lid is plate-like and is bonded to the frame and covers the mount area. The light absorbing member is located on a second surface of the lid facing the mount area, and has a plurality of recesses on its surface.

A header for a semiconductor package includes: an eyelet having an upper surface and a lower surface; a first metal block molded integrally with the eyelet, protruding at the upper surface, and having a substantially U shape; a first lead sealed in a first through hole penetrating the eyelet; a first substrate having a front surface formed with a first signal pattern electrically connected to the first lead and having a back surface fixed to a first end surface of the first metal block; a second lead sealed in a second through hole penetrating the eyelet; and a second substrate having a front surface formed with a second signal pattern electrically connected to the second lead and having a back surface fixed to a second end surface of the first metal block.

A video- wall module is disclosed. In an embodiment a video-wall module includes a printed-circuit board, a plurality of light-emitting diode chips arranged at the printed-circuit board, a circuit chip fixed to the printed-circuit board, wherein the circuit chip is connected with electrical connections of the light-emitting diode chips in order to electrically actuate the light-emitting diode chips and a housing for the circuit chip at least partially formed by the printed circuit board, wherein the light-emitting diode chips are divided into a first area and a first edge area surrounding the first area, and wherein the light-emitting diode chips in the first area comprise a smaller radiation wavelength than the light-emitting diode chips in the first edge area on average at the same temperature.

Apparatus for providing electrical energy, in particular for providing electrical energy from a heat flow originating from an electric motor, including a first component part, a second component part, wherein a Peltier element is arranged between the first component part and the second component part, said Peltier element being at least partially surrounded by a layer of insulation provided between the first component part and the second component part, with the result that the Peltier element forms a thermal bridge between the first and the second component parts, and wherein the first and the second component parts are selected from the following group: gear mechanism, motor and adapter plate.