An optical component package includes a main substrate including a plurality of metal bodies, and a vertical insulation part provided between the metal bodies; a cavity provided in an upper surface of the main substrate; a sub-substrate provided in the cavity of the main substrate, the sub-substrate including an insulating body, a plurality of via holes vertically passing through the insulating body and filled with a metal material being electrically connected to each of the metal bodies, and a plurality of metal pads mounted on the insulating body and electrically connected to the plurality of via holes; a plurality of optical components mounted on the plurality of metal pads and electrically connected to the plurality of metal pads; and a light transmitting member provided above the main substrate.

A header for a semiconductor package, includes an eyelet having a through hole penetrating the eyelet from an upper surface to a lower surface of the eyelet, a first lead inserted inside the through hole, and an insulating substrate disposed on the upper surface of the eyelet, and provided with a first through hole at a position overlapping one end of the first lead in a plan view. The insulating substrate has a thermal conductivity lower than a thermal conductivity of the first lead. A first conductive layer is formed on an inner wall defining the first through hole, and the first conductive layer extends to an upper surface of the insulating substrate. The one end of the first lead is electrically connected to the first conductive layer, and a space is provided above the one end of the first lead inside the first through hole.

The invention describes a lighting assembly and a lighting device with improved thermal behavior and a method to manufacture such a lighting assembly comprising at least one point-like light source having a first and a second electrical contact, a lead frame having metal areas to electrically connect at least the first electrical contact and to spread heat from the point-like light sources via the metal areas, and a plastic layer arranged at least on top of the lead frame. One or more conductive traces are applied on a first surface of the plastic layer facing away from the lead frame to electrically insulate the conductive traces on the plastic layer from the metal areas of the lead frame. Additional components or the second electrical contact might be connected to the conductive traces.

Disclosed is a method for manufacturing a supporting substrate for a semiconductor light emitting device, the method including: preparing a substrate having a groove; introducing a material into the groove of the substrate, the material serving to form a thermal and/or electrical pass; and compressing the material inwards from both ends of the groove, using a compressing means.

A display device is provided. The display device comprises a first substrate including a display area, and a non-display area surrounding the display area, light emitting elements in the display area on the first substrate, pads in the non-display area, and a circuit board including circuit board pads connected to the pads, and including a first cover layer facing the first substrate, and defining first opening holes formed to correspond to the circuit board pads, a metal layer on the first cover layer and having the circuit board pads therebelow, and a second cover layer on the metal layer, and defining second opening holes exposing a portion of the metal layer.

Panels of LED arrays and LED lighting systems are described. A panel includes a substrate having a top and a bottom surface. Multiple backplanes are embedded in the substrate, each having a top and a bottom surface. Multiple first electrically conductive structures extend at least from the top surface of each of the backplanes to the top surface of the substrate. Each of multiple LED arrays is electrically coupled to at least some of the first conductive structures. Multiple second conductive structures extend from each of the backplanes to at least the bottom surface of the substrate. At least some of the second electrically conductive structures are coupled to at least some of the first electrically conductive structures via the backplane. A thermal conductive structure is in contact with the bottom surface of each of the backplanes and extends to at least the bottom surface of the substrate.

An optoelectronic component (1) is specified having: an optoelectronic semiconductor chip (2) which generates electromagnetic radiation during operation, and a metallic layer (3) which is arranged on the semiconductor chip (2), wherein an outer surface of the metallic layer (4) has a structuring (5), identification of the component (1) is made possible by means of the structuring (5), and the metallic layer (3) is formed continuously.

Furthermore, a method for producing an optoelectronic component (1) is specified.

A printed circuit board, on which at least one light emitting diode including at least two electrodes is mounted, includes a base member, an insulating layer disposed on the base member, a plurality of conductive pads disposed on the insulating layer and electrically connected to the light emitting diode, a plurality of via holes formed through at least one conductive pad of the plurality of conductive pads and at least a portion of each insulating layer, and filling members disposed in the plurality of via holes to electrically connect the base member to the at least one conductive pad, A distance between the plurality of via holes is ‘n’ times greater than a depth of at least one via hole of the plurality of via holes, in which ‘n’ is a positive integer greater than ‘1’ and less than ‘10’.

A semiconductor device according to an embodiment may include a plurality of light emitting structures, a first electrode disposed around the plurality of light emitting structures, a second electrode disposed on an upper surface of the plurality of light emitting structures, a first bonding pad electrically connected to the first electrode, and a second bonding pad electrically connected to the second electrode. The plurality of light emitting structures may include a first light emitting structure that includes a first DBR layer of a first conductivity type, a first active layer disposed on the first DBR layer, and a second DBR layer of a second conductivity type disposed on the first active layer; and a second light emitting structure that includes a third DBR layer of the first conductivity type, a second active layer disposed on the third DBR layer, and a fourth DBR layer of the second conductivity type disposed on the second active layer. The first electrode may be electrically connected to the first DBR layer and the third DBR layer, and disposed between the first light emitting structure and the second light emitting structure. The second electrode may be electrically connected to the second DBR layer and the fourth DBR layer, and disposed on an upper surface of the second DBR layer and an upper surface of the fourth DBR layer.

LED packages are disclosed capable of emitting a range of colors including white light, while still emitting that can have a high color rendering index (CRI). The LED packages can have a simplified reflective cup arrangement and improved lead frame design. The LED packages according to the present invention comprise one or more LED WITH PHOSPHORs for high CRI lighting applications, along with multiple narrowband emitters (e.g. RGB LEDs), but do not have a dam or partition to segregate the LED WITH PHOSPHOR from the multiple emitters. This results in a LED package that is less complex and easier to manufacture, while still providing the desired flexibility in LED package emissions.