A light emitting device includes a first light emitting element including a rectangular first light extraction surface, a second light emitting element including a rectangular second light extraction surface and emitting light having an emission peak wavelength different from an emission peak wavelength of the first light emitting element, and a light-transmissive member covering the first light extraction surface and the second light extraction surface. The light-transmissive member includes a first light-transmissive layer facing the first light extraction surface and the second light extraction surface, a wavelength conversion layer located on the first light-transmissive layer, and a second light-transmissive layer located on the wavelength conversion layer. The first light-transmissive layer contains a first matrix and first diffusive particles. The wavelength conversion layer contains a second matrix and wavelength conversion particles. The second light-transmissive layer contains a third matrix and second diffusive particles.

A method of manufacturing a light source device includes: disposing bumps containing a first metal on a first substrate which is thermally conductive; disposing a bonding member on the bumps, the bonding member containing Au—Sn alloy; disposing a light emitting element on the bumps and the bonding member; and heating the first substrate equipped with the bumps, the bonding member, and the light emitting element.

A light-emitting device includes: a resin package including: a first lead, a second lead, and a resin portion, wherein each of the first lead and the second lead has a top surface and a bottom surface and comprises a metal layer formed at least at the top surfaces; a light-emitting element electrically connected to the first lead and the second lead; and a protection element located on a first surface portion of the top surface of the first lead. The first lead includes: a first lateral portion and at least one second lateral portion. A second surface portion is formed at the top surface of the first lead between the protection element and at least one of the first lateral portion and the at least one second lateral portion, the second surface portion being embedded in the resin portion and extending in a height direction.

A light emitting diode (LED) module includes a base that is conductive and is selectively covered with an insulative layer. The base can include a connecting flange and a light emitting region. Traces are provided on the insulative coating and can be used to connect LEDs positioned on the light emitting region to pads on the connecting flange. The connecting flange can be offset in angle and/or position from the base and can be configured to provide a contact shape suitable to mate with a connector in a polarized manner. The base can be shaped so as to provide the desired functionality.

This utility model provides a type of heat-sink surface-mounted LED luminescent tube, comprising a first electrode pin used as a heat sink, and an LED chip, wherein the first electrode pin is composed of a first horizontal section electrode, a second horizontal section electrode and a protrusion heat sink, which are connected sequentially; the LED chip is mounted on the first horizontal section of the first electrode pin, a first electrode of the LED chip is connected with the first horizontal section, and a second electrode of the LED chip is connected with the third horizontal section through a conducting wire. When the actual patch is welded to this new utility model, the heat sink formed by the protrusion will penetrate a reserved copper hole in the circuit board to be connected with external metal elements, which radiates heat.

An optoelectronic semiconductor component includes a carrier having a carrier top side and an opposing carrier underside, wherein the carrier top sides each have a larger area than the associated carrier undersides, the carrier parts fixedly connect to one another via at least one potting body and the potting body together with the carrier parts represents a bearing component of the semiconductor component so that all carrier undersides end flush with the potting body, the light-emitting semiconductor chips electrically connect in series, the metal layer on the carrier top side is structured into conductor tracks and into electrical connection surfaces, and the electrical connection surfaces on the carrier top side are electrically insulated from the associated carrier underside so that the carrier underside of the carrier part the semiconductor chips are arranged on is potential-free and is completely covered with the metal layer.

An housing for electronic components, such as LEDs and/or FETs, is provided. The housing has a base body having an upper surface that at least partially defines a mounting area for an electronic functional element, such that the base body provides a heat sink for the electronic functional element. The base body has a lower surface and a lateral surface and includes a connecting body for the electronic functional element, which is joined to the base body a glass layer formed by an alkali titanium silicate glass.

A light emitting element mounting base member for mounting a light emitting element is provided that includes electrical conductor cores, light-reflecting insulating members, and light blocking resin. The insulating members each cover a lateral surface of each of the electrical conductor cores. The insulating members have a reflectivity of 70% or more to light emission wavelength of the light emitting element in a range of 440 nm to 630 nm. The light blocking resin joins at least two insulating members, and is capable of blocking light from the light emitting element by reflecting or absorbing the light. At least one upper surface of the electrical conductor cores, at least one lower surface of the electrical conductor cores are exposed from the insulating members and the light blocking resin respectively.

A method of manufacturing a wiring board includes: providing an insulating member that includes a plurality of regions partitioned by partitions provided with openings at each of which adjacent ones of the regions are joined to each other; disposing conductive members respectively in the plurality of regions; and joining adjacent ones of the conductive members through one of the partitions to each other at the opening of the partition.

A light emitting device including a mounting board, one or more light emitting elements, a light transmissive member, and a light reflective member. The light emitting element(s) are mounted on the mounting board, and each include an upper surface. The light transmissive member is bonded to the upper surface of each of the light emitting element(s). The light transmissive member has an upper surface and a lower surface, and allows light from the light emitting element(s) to be incident on the lower surface of the light transmissive member and to be output from the upper surface of the light transmissive member. The light reflective member covers surfaces of the light transmissive member and lateral surfaces of the light emitting element(s) and exposes the upper surface of the light transmissive member. At least a first portion of the mounting board is exposed from the light reflective member in a plan view.