A light source cooling body (100), a light source assembly, a luminaire and a method to manufacture a light source cooling body or a light source assembly are provided. The light source cooling body comprises a homogeneous body (104) made of a thermally conductive material. The homogenous body comprises an open space that comprises a wick structure, a condenser (112) and an evaporator (116). Near the evaporator the light source cooling body has an interface area (102) to thermally couple with a light source and to receive heat from the light source. The condenser is arranged away from the interface area. A portion 114 of the open space is tubular shaped. The open space may hold a cooling liquid partially in the gaseous phase and partially in the liquid phase and the wick structure is configured to transport the cooling material in the liquid phase towards the evaporator.

A light emitting semiconductor (LES) device having desirable thermal performance characteristics is disclosed. The LES device includes an insulating substrate layer having a plurality of vias formed therein and at least one LES chip mounted on the insulating substrate layer, with each of the LES chips(s) including an active surface including a light emitting area configured to emit light therefrom and a back surface positioned on a top surface of the insulating substrate layer and including connection pads thereon. A conductor layer is positioned on a bottom surface of the insulating substrate layer and in the vias, the conductor layer in direct contact with the connection pads of the LES chip(s) so as to be electrically and thermally connected thereto. An encapsulant is positioned adjacent the top surface of the insulating substrate layer and surrounding at least part of the LES chip(s), the encapsulant comprising a light transmitting material.

Provided is a lamp with an LED that can prevent snow from sticking or snow melted thereon from freezing. A lamp (10) includes: an LED module (11) serving as a light source; a heatsink (12); a heat transfer unit (13); a light distribution unit (14); a housing (15) with an opening; and a light-transmissive cover (16). The LED module (11) includes a plurality of LEDs, and an LED substrate having a mounting surface on which the plurality of LEDs are mounted. The heatsink (12) is arranged on the side of the LED substrate opposite to the mounting surface. The light distribution unit (14) is arranged on the light emitting side of the LED module (11). The LED module (11), the heatsink (12), and the light distribution unit (14) are arranged in the housing (15). The light-transmissive cover (16) is arranged in the opening of the housing (15). The heat transfer unit (13) includes a heat conduction section (13a) and a heat discharge section (13b), the heat conduction section (13a) being arranged so as to conduct heat from the heatsink (12), and the heat discharge section (13b) being arranged so as to be able to discharge the heat to the light-transmissive cover (16).

The present invention belongs to the technical field of high-power LED lamps, and relates to a high-power LED lamp with a heat dissipation effect, including a shell body. The shell body includes a heat sink main body and a heat sink cover board covering on a back surface of the heat sink main body. A plurality of heat pipes are embedded between the heat sink main body and the heat sink cover board, and an LED chip is placed on a front surface of the heat sink main body. The position of the heat sink main body where the LED chip is placed is the chip heat collecting area, all the heat pipes pass under the chip heat collecting area, and are in close contact with the chip heat collecting area.

An LED illumination module is described, where a row of LED elements (1) is arranged via a substrate (16) on a secondary cooling element (2). The secondary cooling element (2) can consist of a first material layer (16, 17) of copper and a second material layer (18) of aluminium. In such material combinations, phononic refraction leads to a good lateral heat distribution, which improves the heat flow and reduces temperature gradients. Alternatively or in addition thereto, the secondary cooling element (2) can be equipped with heat pipes. The LED elements (1) are electrically contacted by means of a current supply member (21) arranged at a distance from the substrate (16).

A light source cooling body (100), a light source assembly, a luminaire and a method to manufacture a light source cooling body or a light source assembly are provided. The light source cooling body comprises a homogeneous body (104) made of a thermally conductive material. The homogenous body comprises an open space that comprises a wick structure, a condenser (112) and an evaporator (116). Near the evaporator the light source cooling body has an interface area (102) to thermally couple with a light source and to receive heat from the light source. The condenser is arranged away from the interface area. A portion 114 of the open space is tubular shaped. The open space may hold a cooling liquid partially in the gaseous phase and partially in the liquid phase and the wick structure is configured to transport the cooling material in the liquid phase towards the evaporator.

An optoelectronic module includes a spacer with an optical component mounting surface, a fluid permeable channel, and a module mounting surface. The fluid permeable channel and module mounting surface allow the channels to be sealed to foreign matter during certain manufacturing steps and to remain free from blockages, such as solidified flux, during certain manufacturing steps. Further, the channels can permit heat to escape from the optoelectronic module during operation.

The invention relates to the production of an optical or optoelectronic assembly (1, 2) comprising an active component (5) and a cooler (3). The cooler (3) is produced by means of a 3D printing method on a composite plate (6).

A wavelength converting member is provided. The wavelength converting member includes a quantum dot layer and an outer layer. The quantum dot layer includes quantum dots. The outer layer is on an outer side of the quantum dot layer. A moisture vapor transmission rate of the outer layer is at least 0.006 (g/m2.Math.day) and less than 9 (g/m2.Math.day).

A method of producing a wavelength converting member is provided. The method includes forming a quantum dot layer on a bottom organic layer, and forming a top organic layer on the quantum dot layer. The quantum dot layer includes quantum dots. A moisture vapor transmission rate of the top organic layer and the bottom organic layer is at least 0.006 (g/m2.Math.day) and less than 9 (g/m2.Math.day).