OPTICAL AND OPTOELECTRONIC ASSEMBLY AND METHOD FOR THE PRODUCTION THEREOF

Abstract

The invention relates to the production of an optical or optoelectronic assembly (1, 2) comprising an active component (5) and a cooler (3). The cooler (3) is produced by means of a 3D printing method on a composite plate (6).

Claims

1. A method for producing an optical or optoelectronic assembly, comprising a) providing a composite plate, wherein the composite plate comprises at least one first nonmetallic layer and a first metallic layer and a second metallic layer, b) subdividing the second metallic layer into a plurality of second regions, c) providing a start surface on the first metallic layer, d) producing a cooler structure on the start surface by selectively melting and/or by selectively sintering at least one first material, e) providing an optical or optoelectronic component, wherein the component comprises at least one optically pumped laser disk or at least one diode laser bar or at least one light emitting diode, f) securing the component on a mounting surface arranged on the second metallic layer, wherein securing the component is carried out after producing the cooler structure and the component covers a plurality of second regions of the second metallic layer.

2. The method as claimed in claim 1, wherein producing the cooler structure involves supplying the first material in powder form and carrying out the selective melting and/or the selective sintering layer by layer in a growth direction.

3. The method as claimed in claim 1, wherein the first material is Ag, Cu, Al, Ni, Cr, Mo, W or some other metal or comprises one of these metals and/or the first metallic layer consists of Cu, Ag, Ni, Au or Al or comprises one of the substances mentioned.

4. The method as claimed in claim 1, wherein the first metallic layer is at least 50 m thick.

5. The method as claimed in claim 1, wherein the first nonmetallic layer consists of Al.sub.2O.sub.3, SiC, BeO or MN or some other ceramic material or diamond or in that the first nonmetallic layer comprises one of the materials mentioned.

6. The method as claimed in claim 1, additionally comprising g) subdividing the first metallic layer into first regions, wherein the cooler structure is produced on the first regions of the first metallic layer.

7. The method as claimed in claim 1, additionally comprising h) superficially coating the first and/or the second metallic layer with gold, wherein step h is carried out before step d.

8. An optical or optoelectronic assembly comprising a cooler and an optical or optoelectronic component, wherein the cooler comprises a) a composite plate, wherein the composite plate comprises at least one first nonmetallic layer and a first metallic layer and a second metallic layer, wherein the second metallic layer is subdivided into a plurality of second regions, b) wherein the composite plate comprises a start surface on the first metallic layer, c) a cooler structure produced on the start surface by a 3D printing method and composed of a first material comprising a metal, d) a mounting surface for the component, said mounting surface being arranged on the second metallic layer, e) wherein the component is secured on the mounting surface and the component covers a plurality of second regions of the second metallic layer.

9. The optical or optoelectronic assembly as claimed in claim 8, wherein the optical or optoelectronic component is an optically pumped laser disk, or a diode laser component or a light emitting diode (LED) component.

10. The optical or optoelectronic assembly as claimed in claim 9, wherein the diode laser component comprises a single diode laser bar or comprises a stack of diode laser bars and heat-conducting bodies, wherein at least one heat-conducting body is arranged respectively between two laser bars, and each heat-conducting body is secured to at least one second region.

11. The optical or optoelectronic assembly as claimed in claim 10, wherein a plurality of the second regions of the second metallic layer are separated from one another by trenches, wherein a plurality of adjacent trenches are at a distance from one another which is less than a thickness of the diode laser bars.

12. The optical or optoelectronic assembly as claimed in claim 8, wherein the cooler structure is closed off from the surroundings at the opposite side relative to the composite plate.

13. The optical or optoelectronic assembly as claimed in claim 8, wherein in that the cooler structure comprises an inner cooler structure configured as a columnar structure.

14. The optical or optoelectronic assembly as claimed in claim 8, wherein the cooler structure comprises an inner cooler structure, over which a hood is slipped, which outwardly delimits the cooler.

15. The optical or optoelectronic assembly as claimed in claim 8, wherein the cooler structure comprises an outer cooler structure configured as an undulatory wall.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0067] The present invention will become more fully understood from the detailed description given hereinbelow and the accompanying drawings which are given by way of illustration only, and thus, are not limitive of the present invention, and wherein:

[0068] FIG. 1 shows an optical assembly according to the invention of a second exemplary embodiment in a yz section.

[0069] FIG. 2 shows an optoelectronic assembly according to the invention of a third exemplary embodiment in a yz section.

[0070] FIG. 3 shows the assembly according to the invention of the third exemplary embodiment in an xz section along a sectional plane AA through the cooling structure.

[0071] FIG. 4 shows a step of a first exemplary embodiment of the method according to the invention.

[0072] FIG. 5 shows a further step of the first exemplary embodiment of the method according to the invention.

[0073] FIG. 6 shows two completed coolers of the first exemplary embodiment of the method according to the invention.

[0074] FIG. 7 shows an assembly according to the invention of a fourth exemplary embodiment in an xz section along a sectional plane through the cooling structure.

[0075] FIG. 8 shows an optoelectronic assembly according to the invention of a fifth exemplary embodiment in a yz section.

DETAILED DESCRIPTION

[0076] FIG. 1 shows a second exemplary embodiment of an optical assembly 1 in a yz section. The assembly comprises a cooler 3 and an optical component 5, which is present as a laser disk 26. During operation, a laser radiation 30 is emitted in the y direction. In order to dissipate the waste heat from the laser disk 26, a coolant flow 24 is used. Water, for example, is considered as coolant. The cooler 3 comprises a composite plate 6, a cooler structure 18, which is present here as an inner cooler structure 18a, and also a hood 25, which delimits the coolant flow from the surroundings. A coolant inlet 22 and a coolant outlet 23 are incorporated into the hood 25. The composite plate 6 comprises a first nonmetallic layer 11, a first metallic layer 12 and a second metallic layer 14, which is subdivided into a plurality of second regions 15. The second metallic layer 14 has a mounting surface 9, to which the laser disk 26 is secured. In this case, the laser disk 26 covers a plurality of second regions 15.

[0077] FIG. 2 shows a third exemplary embodiment of an optoelectronic assembly 2 in a yz section. The assembly comprises a cooler 3 and an optoelectronic component 5, which is present as a diode laser component. The diode laser component comprises a stack of laser bars 27 and heat-conducting bodies 28, which stack is closed off at both ends by a respective contact body 29. During operation, the laser bars 27 emit laser radiation 30 in the y direction. In order to dissipate the waste heat, a coolant flow 24 is used. Water, for example, is considered as coolant. The cooler 3 comprises a composite plate 6, a cooler structure 18, which is present here as inner cooler structure 18a and outer cooler structure 18b. The outer cooler structure 18b delimits the coolant flow from the surroundings. A coolant inlet 22 and a coolant outlet 23 are incorporated into the outer cooler structure 18b. The composite plate 6 comprises a first nonmetallic layer 11, a first metallic layer 12 and a second metallic layer 14, which is subdivided into a plurality of second regions 15. The second regions 15 are separated from one another by trenches 16. The trenches 16 prevent adjacent heat-conducting bodies 28 and/or contact bodies 29 from being electrically short-circuited via the second metallic layer 14. The optoelectronic component 5 covers a plurality of second regions 15. The position of a sectional plane AA through the cooler 3 is furthermore indicated.

[0078] FIG. 3 shows the assembly according to the invention of the third exemplary embodiment in an xz section along the sectional plane AA through the cooler 3. The inner cooler structure 18a is configured as a columnar structure 20. The columns are configured in the shape of truncated circular cones. The outer cooler structure 18b is likewise illustrated, said outer cooler structure being configured as an undulatory wall 21.

[0079] FIG. 4 shows a step of a first exemplary embodiment of the method according to the invention. The composite plate 6 is secured on the carrier 10 by the mounting surface 9 during the production of the cooler structure. The second metallic layer 14 has already been subdivided into second regions 15 beforehand. The exemplary embodiment shows that a plurality of coolers can be produced simultaneously. A first material as powder 17a is applied on the start surface 7 situated at the top of the first metallic layer 12. The applying is carried out in a known manner as a layer having a predetermined thickness.

[0080] FIG. 5 shows a further step of the first exemplary embodiment of the method according to the invention. The first material 17 is sintered or melted at predetermined locations by means of a laser beam. In this case, during solidification, the powder particles bond together and with the underlying first metallic layer 12. Afterward, first material in consolidated form 17b is present at the laser-processed locations, while first material as powder 17a remains at the locations that have not been subjected to laser treatment. It is then possible progressively for further layers of the first material in powder form to be applied and consolidated in places. As a result, the cooler structure can be produced layer by layer in a growth direction 8.

[0081] FIG. 6 shows two completed coolers of the first exemplary embodiment of the method according to the invention. Alongside the cooler 3, a further cooler 4 has been produced in the same work process. It is possible to provide a composite plate 6 (may also be referred to as panel) of appropriate size in order to produce a large number of coolers simultaneously. The latter are then singulated by the first nonmetallic layer 11 being severed at predetermined locations between the individual coolers. Moreover, it is possible to produce not just the coolers but the entire assembly in the panel and to singulate the assemblies only after the components have been secured. The separation of the second regions 15 by trenches 16 can also be discerned in FIG. 6. As a result, the mounting surface 9 is also divided into partial surfaces. In the mathematical sense, the mounting surface is not a contiguous surface.

[0082] FIG. 7 shows an assembly according to the invention of a fourth exemplary embodiment in an xz section along a sectional plane through the cooling structure. Here the inner cooler structure 18a comprises a plurality of cooling channels 19 delimited by undulatory walls.

[0083] FIG. 8 shows an optoelectronic assembly according to the invention of a fifth exemplary embodiment in a yz section. The first metallic layer 12 is subdivided into first regions 13. As a result, the coolant can flow along the first nonmetallic layer 11 in places.

[0084] For the sake of completeness, it should be pointed out that the figures are not drawn to scale.

[0085] The invention being thus described, it will be obvious that the same may be varied in many ways. Such variations are not to be regarded as a departure from the spirit and scope of the invention, and all such modifications as would be obvious to one skilled in the art are to be included within the scope of the following claims