An electronic module includes: a first board; a chip disposed on the first board and having a main electrode and a control electrode on a surface thereof on a side opposite to a surface thereof on a first board side; a power chip connection terminal disposed on the main electrode and being electrically connected to the main electrode; and a signal chip connection terminal having a columnar shape disposed on the control electrode and being electrically connected with the control electrode.

A device for trapping one or more ions includes a substrate and an application board. The substrate includes: a metal layer structure having a first electrode and a second electrode of an ion trap; a first terminal electrically connected to the first electrode; and a second terminal electrically connected to the second electrode. The application board includes circuitry and the substrate is mounted on the application board, such that the first terminal and the second terminal of the substrate are electrically connected to the circuitry of the application board.

A semiconductor device assembly includes a semiconductor die, a substrate, and a spacer directly coupled to the substrate. The spacer includes a flexible main body and a support structure embedded in the flexible main body, wherein the support structure has a higher stiffness than the flexible main body. The spacer carries the semiconductor die. The flexible main body of the spacer mitigates the effects of thermomechanical stress, for example caused by a mismatch between the coefficient of thermal expansion of the semiconductor die and the substrate. The embedded support structure provides strength needed to support the semiconductor die during assembly.