An apparatus includes: a transistor including an input terminal for an input signal and an output terminal for an output signal; a matching circuit configured to match a load impedance regarding a fundamental harmonic of at least one of the input signal and the output signal to an impedance of the transistor and include a first conductive film being laminated over the transistor and coupled to at least one of the input terminal and the output terminal; and a processing circuit configured to adjust an impedance regarding a harmonic of at least one of the input signal and the output signal and include a second conductive film being laminated over the first conductive film and coupled to at least one of the input terminal and the output terminal through a via which penetrates through a dielectric layer sandwiched between the first conductive film and the second conductive film.

An apparatus includes: a transistor including an input terminal for an input signal and an output terminal for an output signal; a matching circuit configured to match a load impedance regarding a fundamental harmonic of at least one of the input signal and the output signal to an impedance of the transistor and include a first conductive film being laminated over the transistor and coupled to at least one of the input terminal and the output terminal; and a processing circuit configured to adjust an impedance regarding a harmonic of at least one of the input signal and the output signal and include a second conductive film being laminated over the first conductive film and coupled to at least one of the input terminal and the output terminal through a via which penetrates through a dielectric layer sandwiched between the first conductive film and the second conductive film.

Structures and methods of fabricating semiconductor wafer assemblies that encapsulate one or die in a cavity etched into an oxide bonded semiconductor wafer stack. The methods generally include the steps of positioning the die in the cavity, mechanically and electrically mounting the die to the wafer stack, and encapsulating the die within the cavity by bonding a lid wafer to the wafer stack in one of multiple ways. Semiconductor processing steps are applied to construct the assemblies (e.g., deposition, annealing, chemical and mechanical polishing, etching, etc.) and connecting the die (e.g., bump bonding, wire interconnecting, ultrasonic bonding, oxide bonding, etc.) according to the embodiments described above.

Structures and methods of fabricating semiconductor wafer assemblies that encapsulate one or die in a cavity etched into an oxide bonded semiconductor wafer stack. The methods generally include the steps of positioning the die in the cavity, mechanically and electrically mounting the die to the wafer stack, and encapsulating the die within the cavity by bonding a lid wafer to the wafer stack in one of multiple ways. Semiconductor processing steps are applied to construct the assemblies (e.g., deposition, annealing, chemical and mechanical polishing, etching, etc.) and connecting the die (e.g., bump bonding, wire interconnecting, ultrasonic bonding, oxide bonding, etc.) according to the embodiments described above.

In an embodiment, a method includes: stacking a plurality of first dies to form a device stack; revealing testing pads of a topmost die of the device stack; testing the device stack using the testing pads of the topmost die; and after testing the device stack, forming bonding pads in the topmost die, the bonding pads being different from the testing pads.

In an embodiment, a method includes: stacking a plurality of first dies to form a device stack; revealing testing pads of a topmost die of the device stack; testing the device stack using the testing pads of the topmost die; and after testing the device stack, forming bonding pads in the topmost die, the bonding pads being different from the testing pads.

In one embodiment, a semiconductor device includes a first chip that includes a first interconnect layer, a first insulator provided on the first interconnect layer, a first metal portion provided on the first interconnect layer and provided in the first insulator and including at least one of palladium, platinum and gold, and a second interconnect layer provided on the first metal portion and provided in the first insulator. The device further includes a second chip that includes a second insulator provided on the first insulator, and a third interconnect layer provided in the second insulator and provided on the second interconnect layer.

In one embodiment, a semiconductor device includes a first chip that includes a first interconnect layer, a first insulator provided on the first interconnect layer, a first metal portion provided on the first interconnect layer and provided in the first insulator and including at least one of palladium, platinum and gold, and a second interconnect layer provided on the first metal portion and provided in the first insulator. The device further includes a second chip that includes a second insulator provided on the first insulator, and a third interconnect layer provided in the second insulator and provided on the second interconnect layer.

A semiconductor memory device includes a circuit chip including a first substrate, peripheral circuit elements which are defined on the first substrate and a first dielectric layer which covers the peripheral circuit elements, and having first pads which are coupled to the peripheral circuit elements, on one surface thereof; a memory chip including a second substrate which is disposed on a base dielectric layer, a memory cell array which is defined on the second substrate and a second dielectric layer which covers the memory cell array, and having second pads which are coupled with the first pads, on one surface thereof which is bonded with the one surface of the circuit chip; a contact passing through the base dielectric layer and the second dielectric layer; and one or more dummy contacts passing through the base dielectric layer and the second dielectric layer, and disposed around the contact.

A semiconductor memory device includes a circuit chip including a first substrate, peripheral circuit elements which are defined on the first substrate and a first dielectric layer which covers the peripheral circuit elements, and having first pads which are coupled to the peripheral circuit elements, on one surface thereof; a memory chip including a second substrate which is disposed on a base dielectric layer, a memory cell array which is defined on the second substrate and a second dielectric layer which covers the memory cell array, and having second pads which are coupled with the first pads, on one surface thereof which is bonded with the one surface of the circuit chip; a contact passing through the base dielectric layer and the second dielectric layer; and one or more dummy contacts passing through the base dielectric layer and the second dielectric layer, and disposed around the contact.