A 3D semiconductor device, the device including: a first single crystal layer including a plurality of first transistors; at least one first metal layer interconnecting the plurality of first transistors, where the interconnecting includes forming memory peripheral circuits; a plurality of second transistors underlying the first single crystal layer; a second metal layer overlaying the plurality of second transistors; a first memory cell underlying the memory peripheral circuits; a second memory cell underlying the first memory cell, and a non-volatile NAND memory, where the first memory cell includes at least one of the second transistors, where at least one of the second transistors includes a source, channel and drain, where the source, the channel and the drain have the same dopant type, here the non-volatile NAND memory includes the first memory cell, and where at least one of the second transistors includes a polysilicon channel.

A semiconductor structure is disclosed. The semiconductor structure includes: a semiconductor substrate including a front surface and a back surface; a backside metallization layer formed over the semiconductor substrate, the backside metallization layer being closer to the back surface than to the front surface of the semiconductor substrate, at least a portion of the backside metallization layer forming an inductor structure; and an electrically non-conductive material formed in the semiconductor substrate, the electrically non-conductive material at least partially overlapping the inductor structure from a top view, and the electrically non-conductive material including a top surface, a bottom surface, and sidewalls, the top surface being adjacent to the back surface of the semiconductor substrate. A method for manufacturing a semiconductor structure is also disclosed.

A semiconductor structure is disclosed. The semiconductor structure includes: a semiconductor substrate including a front surface and a back surface; a backside metallization layer formed over the semiconductor substrate, the backside metallization layer being closer to the back surface than to the front surface of the semiconductor substrate, at least a portion of the backside metallization layer forming an inductor structure; and an electrically non-conductive material formed in the semiconductor substrate, the electrically non-conductive material at least partially overlapping the inductor structure from a top view, and the electrically non-conductive material including a top surface, a bottom surface, and sidewalls, the top surface being adjacent to the back surface of the semiconductor substrate. A method for manufacturing a semiconductor structure is also disclosed.

Semiconductor device packages may include a first semiconductor device over a substrate and a second semiconductor device over the first semiconductor device. An active surface of the second semiconductor device may face away from the substrate. Conductors may extend from bond pads of the second semiconductor device, along surfaces of the second semiconductor device, first semiconductor device, and substrate to pads of routing members of the substrate. The conductors may be in contact with the bond pads and the routing members and a dielectric material interposed between the conductors and the first semiconductor device and between the conductors and the second semiconductor device. An encapsulant distinct from the dielectric material may cover the conductors, the first semiconductor device, the second semiconductor device, and an upper surface of the substrate. Methods of fabrication are also disclosed.

Semiconductor device packages may include a first semiconductor device over a substrate and a second semiconductor device over the first semiconductor device. An active surface of the second semiconductor device may face away from the substrate. Conductors may extend from bond pads of the second semiconductor device, along surfaces of the second semiconductor device, first semiconductor device, and substrate to pads of routing members of the substrate. The conductors may be in contact with the bond pads and the routing members and a dielectric material interposed between the conductors and the first semiconductor device and between the conductors and the second semiconductor device. An encapsulant distinct from the dielectric material may cover the conductors, the first semiconductor device, the second semiconductor device, and an upper surface of the substrate. Methods of fabrication are also disclosed.

Semiconductor device package assemblies and associated methods are disclosed herein. The semiconductor device package assembly includes (1) a base component having a front side and a back side, the base component having a first metallization structure at the front side; (2) a semiconductor device package having a first side, a second side with a recess, and a second metallization structure at the first side and a contacting region exposed in the recess at the second side; (3) an interconnect structure at least partially positioned in the recess at the second side of the semiconductor device package; and (4) a thermoset material or structure between the front side of the base component and the second side of the semiconductor device package. The interconnect structure is in the thermoset material and includes discrete conductive particles electrically coupled to one another.

Semiconductor device package assemblies and associated methods are disclosed herein. The semiconductor device package assembly includes (1) a base component having a front side and a back side, the base component having a first metallization structure at the front side; (2) a semiconductor device package having a first side, a second side with a recess, and a second metallization structure at the first side and a contacting region exposed in the recess at the second side; (3) an interconnect structure at least partially positioned in the recess at the second side of the semiconductor device package; and (4) a thermoset material or structure between the front side of the base component and the second side of the semiconductor device package. The interconnect structure is in the thermoset material and includes discrete conductive particles electrically coupled to one another.

A 3D semiconductor, the device including: a first level including a plurality of first transistors; a first metal layer including interconnects between the plurality of first transistors, where the interconnects between the plurality of first transistors includes forming a plurality of logic gates; a plurality of second transistors overlaying the first metal layer, where at least six of the plurality of first transistors are connected in series forming at least a portion of a NAND logic structure, where the plurality of second transistors are vertically oriented transistors, and where the plurality of second transistors are at least partially directly overlaying the NAND logic structure; a memory cell; and a second metal layer overlaying the plurality of second transistors, where the second metal layer is aligned to the first metal layer with less than 40 nm misalignment, where the second transistors include a p type source and a p type drain.

A 3D semiconductor, the device including: a first level including a plurality of first transistors; a first metal layer including interconnects between the plurality of first transistors, where the interconnects between the plurality of first transistors includes forming a plurality of logic gates; a plurality of second transistors overlaying the first metal layer, where at least six of the plurality of first transistors are connected in series forming at least a portion of a NAND logic structure, where the plurality of second transistors are vertically oriented transistors, and where the plurality of second transistors are at least partially directly overlaying the NAND logic structure; a memory cell; and a second metal layer overlaying the plurality of second transistors, where the second metal layer is aligned to the first metal layer with less than 40 nm misalignment, where the second transistors include a p type source and a p type drain.

A 3D semiconductor device, the device including: a first single crystal layer including a plurality of first transistors; at least one metal layer interconnecting the first transistors and forming a plurality of logic gates; a first intermediate metal layer overlaying the at least one metal layer; a second intermediate metal layer overlaying the first intermediate metal layer; where the first intermediate metal layer has a first current carrying capacity, where the second intermediate metal layer has a second current carrying capacity, and where the first current carrying capacity is significantly greater than the second current carrying capacity; a plurality of second transistors overlaying the second intermediate metal layer; and a top metal layer overlaying the second transistors; and a memory cell, where at least one of the second transistors includes a polysilicon transistor channel, where the second transistors are precisely aligned to the first transistors.