A method of operating a bonding machine is provided. The method includes the steps of: (a) carrying a semiconductor element with a transfer tool; and (b) transferring the semiconductor element from the transfer tool to a bonding tool of the bonding machine without the transfer tool and the bonding tool contacting the semiconductor element at the same time.

A sintering press to sinter electronic components on a substrate comprises a pressing unit comprising a multi-rod cylinder having a front head and a rear head which jointly delimit a compression chamber. In the front head, presser rods parallel and independent of each other are slidingly supported. Each presser rod is coaxial and barycentric to a respective electronic component to be sintered and has a thrust section proportional to the force to be applied to the respective electronic component. In the compression chamber a sealing membrane extends, which is deformed so as to abut against the presser rods for transferring the sintering pressure on each presser rod.

A sintering press to sinter electronic components on a substrate comprises a pressing unit comprising a multi-rod cylinder having a front head and a rear head which jointly delimit a compression chamber. In the front head, presser rods parallel and independent of each other are slidingly supported. Each presser rod is coaxial and barycentric to a respective electronic component to be sintered and has a thrust section proportional to the force to be applied to the respective electronic component. In the compression chamber a sealing membrane extends, which is deformed so as to abut against the presser rods for transferring the sintering pressure on each presser rod.

In a method of manufacturing an electronic device, a solder paste is coated on a substrate pad of a substrate. An electronic product is disposed on the substrate such that a solder on an input/output pad of the electronic product makes contact with the solder paste. A first microwave is generated toward the solder paste during a reflow stage to heat the solder paste. A phase of the first microwave is changed during the reflow stage. Heating of the solder paste causes the solder to reflow, thereby forming a solder bump between the substrate pad and the input/output pad.

A method for forming a package structure is provided. The method includes transporting a first package component into a processing chamber. The method includes positioning the first package component on a chuck table. The method includes using the chuck table to heat the first package component. The method includes holding a second package component with a bonding head. The bonding head communicates with a plurality of vacuum devices via a plurality of vacuum tubes, and the vacuum devices each operate independently. The method also includes bonding the first package component and the second package component in the processing chamber to form the package structure.

A fluxing system for a bonding machine is provided. The fluxing system includes a flux holder defining a cavity for holding flux, and a fluid source for providing a cooling fluid to cool the flux holder.

An apparatus for heating a substrate during die bonding is disclosed. The apparatus comprises: a substrate carrier configured to hold the substrate; a heating device configured to heat the substrate; a first actuator for effecting relative motion between the substrate carrier and the heating device such that the substrate is relatively indexed with respect to the heating device; a second actuator for effecting relative motion between the substrate carrier and the heating device such that the heating device contacts the substrate to heat different portions of the substrate. In particular, the second actuator is operative to separate the heating device from the substrate in order for the first actuator to relatively index the substrate across the heating device. A method of heating a substrate during die bonding is also disclosed.

A method for bonding a matrix of light-emitting elements onto a substrate includes forming conductive material on bond pads of the substrate in a matrix arrangement. Separately, a plurality of light-emitting elements is also picked up and placed onto a temporary carrier in the said matrix arrangement. The temporary carrier containing the plurality of light-emitting elements is then held with a bond head, and is moved by the bond head to establish contact between electrodes on the plurality of light-emitting elements and the conductive material on the substrate. When heat is applied to the light-emitting elements while exerting a compressive force with the bond head against the conductive material, conductive joints are formed between the light-emitting elements and the substrate.

Provided is an electronic component mounting method including the steps of: placing an electronic component having a primary surface on which a first electrode is formed, on a circuit member having a primary surface on which a second electrode corresponding to the first electrode is formed, with solder and a bonding material including a thermosetting resin interposed between the first and second electrodes; subjecting the thermosetting resin to a first heating at a temperature lower than the melting point of the solder and thus causing the resin to cure, while pressing the electronic component against the circuit member, and then releasing pressure applied for the pressing; and subjecting the solder interposed between the first and second electrodes to a second heating with the pressure released, and thus melting the solder to electrically connect the first and second electrodes.

A method of operating a bonding machine is provided. The method includes the steps of: (a) carrying a semiconductor element with a transfer tool; and (b) transferring the semiconductor element from the transfer tool to a bonding tool of the bonding machine without the transfer tool and the bonding tool contacting the semiconductor element at the same time.