A semiconductor device comprises a semiconductor element including a first electrode located on one side in a first direction, a first terminal electrically connected to the first electrode and a first wire conductively bonded to the first electrode and the first terminal. The first wire includes a main part, a first bond part connected to one end of the main part, and a second bond part connected to another end of the main part. The first bond part is conductively bonded to the first electrode. The second bond part is conductively bonded to the first terminal. As viewed in the first direction, a direction in which the second bond part extends differs from a direction in which the main part extends.