Patent classifications
H01L2224/7865
WIRE BONDING APPARATUS
A wire bonding apparatus may include a bonder and a common loader/unloader. The bonder may bond a conductive wire to a plurality of package substrates. The common loader/unloader may load the package substrates into the bonder. The common loader/unloader may unload the package substrates from the bonder. Thus, an occupying area of the wire bonding apparatus in semiconductor fabrication equipment may be reduced to improve a productivity of the semiconductor fabrication equipment.
Conveyor Apparatus And Method For Transporting Leadframe
A conveyor apparatus for a leadframe includes a track defining a longitudinally extending passage through which the leadframe travels. A magnetic clamping system and a plurality of first guide magnets are provided on the track. A gripping device is provided for securing to the leadframe. At least one clamping magnet and a plurality of second guide magnets are secured to the gripping device. The first and second guide magnets cooperate to move the gripping device in a first direction along the length of the passage. The magnetic clamping system and the at least one clamping magnet cooperate to selectively move the gripping device in a second direction perpendicular to the first direction between a first condition spaced from the track to a second condition magnetically fixed to the track.
Conveyor apparatus and method for transporting leadframe
A conveyor apparatus for a leadframe includes a track defining a longitudinally extending passage through which the leadframe travels. A magnetic clamping system and a plurality of first guide magnets are provided on the track. A gripping device is provided for securing to the leadframe. At least one clamping magnet and a plurality of second guide magnets are secured to the gripping device. The first and second guide magnets cooperate to move the gripping device in a first direction along the length of the passage. The magnetic clamping system and the at least one clamping magnet cooperate to selectively move the gripping device in a second direction perpendicular to the first direction between a first condition spaced from the track to a second condition magnetically fixed to the track.