A semiconductor device manufacturing method which enhances the reliability of a semiconductor device. The method includes a step in which a source wire is connected with a semiconductor chip while jigs are pressed against a die pad. The jigs each have a first support portion with a first projection and a second support portion with a second projection. Using the jigs thus structured, the first projection is made to contact with a first point on the front surface of the die pad and then the second projection is made to contact with a second point on the front surface of the die pad located closer to a suspension lead than the first point.

A semiconductor device manufacturing method which enhances the reliability of a semiconductor device. The method includes a step in which a source wire is connected with a semiconductor chip while jigs are pressed against a die pad. The jigs each have a first support portion with a first projection and a second support portion with a second projection. Using the jigs thus structured, the first projection is made to contact with a first point on the front surface of the die pad and then the second projection is made to contact with a second point on the front surface of the die pad located closer to a suspension lead than the first point.

A method for producing a bondable coating on a metallic carrier strip made of a brass alloy with at least 15 wt. % zinc or an excretion-hardening copper-based alloy containing at least 0.03 wt. % titanium, chromium, zirconium and/or cobalt is provided. According to the method, in a single working step, a bondable metallic functional layer made of aluminum or an aluminum based alloy and a metallic intermediate layer are placed onto the metallic carrier strip and bonded thereto using a roll cladding method. The intermediate layer is arranged fully between the functional layer and the metallic carrier strip, so that no contact between the functional layer and the metallic carrier strip is created. A coated carrier strip produced using such a method. The intermediate layer is arranged and affixed on the carrier strip and the functional layer is arranged and affixed on the intermediate layer.

A ribbon bonding tool is provided. The ribbon bonding tool includes a body portion including a tip portion, the tip portion defining a working surface. The ribbon bonding tool includes a group of four protrusions extending from the working surface, wherein the working surface defines four quadrants in a horizontal plane by extending an imaginary line at a midpoint along each of a length and a width of the working surface. Each of the four protrusions is arranged in one of four quadrants.