Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/80
Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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H01L2224/80001
by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
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H01L2224/80909
Post-treatment of the bonding area
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H01L2224/80909

System on integrated chips and methods of forming the same
10332841 · 2019-06-25 · ·

A semiconductor device and methods of forming are provided. The method includes bonding a second die to a surface of a first die. The method includes encapsulating the second die in an isolation material, and forming a through via extending through the isolation material. The method also includes forming a first passive device in the isolation material.

SYSTEM ON INTEGRATED CHIPS AND METHODS OF FORMING THE SAME
20190189562 · 2019-06-20 ·

A semiconductor device and methods of forming are provided. The method includes bonding a second die to a surface of a first die. The method includes encapsulating the second die in an isolation material, and forming a through via extending through the isolation material. The method also includes forming a first passive device in the isolation material.

SYSTEM ON INTEGRATED CHIPS AND METHODS OF FORMING THE SAME
20190189562 · 2019-06-20 ·

A semiconductor device and methods of forming are provided. The method includes bonding a second die to a surface of a first die. The method includes encapsulating the second die in an isolation material, and forming a through via extending through the isolation material. The method also includes forming a first passive device in the isolation material.

SYSTEM ON INTEGRATED CHIPS AND METHODS OF FORMING THE SAME
20190019756 · 2019-01-17 ·

A semiconductor device and methods of forming are provided. The method includes bonding a second die to a surface of a first die. The method includes encapsulating the second die in an isolation material, and forming a through via extending through the isolation material. The method also includes forming a first passive device in the isolation material.

SYSTEM ON INTEGRATED CHIPS AND METHODS OF FORMING THE SAME
20190019756 · 2019-01-17 ·

A semiconductor device and methods of forming are provided. The method includes bonding a second die to a surface of a first die. The method includes encapsulating the second die in an isolation material, and forming a through via extending through the isolation material. The method also includes forming a first passive device in the isolation material.