A display device includes a bank including an opening defining pixels, light emitting elements disposed in the pixels, a color conversion layer disposed on the light emitting elements in the opening, a capping layer overlapping the color conversion layer, and a color filter layer disposed on the capping layer. The color filter layer includes a low refractive material.

A method includes depositing a first metal layer on a package component, wherein the package component comprises a first device die, forming a dielectric layer on the package component, and plating a metal thermal interface material on the first metal layer. The dielectric layer includes portions on opposing sides of the metal thermal interface material. A heat sink is bonded on the metal thermal interface material. The heat sink includes a second metal layer physically joined to the metal thermal interface material.

A display device comprises a substrate divided into emission and non-emission areas, a storage capacitor, a first insulating layer, a first light emitting element and a second light emitting element, a bank in the non-emission area, and defining an opening corresponding to the emission area, a first pixel electrode electrically connected to a first end of the first light emitting element, a second pixel electrode electrically connected to a second end of the second light emitting element, an intermediate electrode between the first pixel electrode and the second pixel electrode, surrounding at least a portion of the first pixel electrode, and electrically connected to a second end of the first light emitting element and to a first end of the second light emitting element, and a sub-electrode electrically connected to a lower electrode of the storage capacitor through a contact hole, and overlapping the first pixel electrode.

A device package provides for thermal considerations of a semiconductor die(s) through providing a thermal module. A substrate including an IC die disposed on the substrate is positioned between an upper plate and a lower plate of the thermal module. Heat pipes connect the upper plate and the lower plate. The thermal module allows for heat dissipation paths from the lower as well as upper plate. In some implementations, a liquid cooling plate is positioned between the substrate and the upper plate of the thermal module.