Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2924/00
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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H01L2924/15
Details of package parts other than the semiconductor or other solid state devices to be connected
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H01L2924/162

Semiconductor device
10211116 · 2019-02-19 · ·

A semiconductor device according to the present invention includes a mounting section provided with a chip mounting region for mounting a semiconductor chip, a frame provided in the mounting section so as to surround the chip mounting region, a cap disposed in contact with the frame so as to cover a space surrounded by the chip mounting region and the frame and a joint that joins the frame and the cap outside a contact surface between the frame and the cap.

SEMICONDUCTOR DEVICE
20170125316 · 2017-05-04 · ·

A semiconductor device according to the present invention includes a mounting section provided with a chip mounting region for mounting a semiconductor chip, a frame provided in the mounting section so as to surround the chip mounting region, a cap disposed in contact with the frame so as to cover a space surrounded by the chip mounting region and the frame and a joint that joins the frame and the cap outside a contact surface between the frame and the cap.