A semiconductor device includes a first plurality of dies encapsulated by an encapsulant, an interposer over the first plurality of dies, an interconnect structure over and electrically connected to the interposer, and a plurality of conductive pads on a surface of the interconnect structure opposite the interposer. The interposer includes a plurality of embedded passive components. Each die of the first plurality of dies is electrically connected to the interposer. The interconnect structure includes a solenoid inductor in a metallization layer of the interconnect structure.

A semiconductor package includes a package substrate, an integrated interconnect structure, an optical engine module, and an integrated circuit package. The integrated interconnect structure is bonded over the package substrate and includes an insulation body, a plurality of through vias extending through the insulation body. The optical engine module includes an electronic die, a photonic die, and a waveguide. A portion of the optical engine module is embedded in the integrated interconnect structure. The integrated circuit package is bonded over the integrated interconnect structure and electrically coupled to the optical engine module.

A package includes a redistribution structure that includes conductive features and first waveguides; first dies and second dies attached to the redistribution structure, wherein the first dies are different than the second dies, wherein the first dies are electrically connected to respectively corresponding second dies through the redistribution structure; and optical bridge structures attached to the redistribution structure, wherein the optical bridge structures are optically coupled to the first waveguides, wherein the optical bridge structures are electrically connected to respectively corresponding first dies and respectively corresponding second dies through the redistribution structure.

A method for forming a chip package structure is provided. The method includes providing an electrical substrate and a photonic substrate over and bonded to the electrical substrate. The method includes partially removing the dielectric structure to form a first through hole and a second through hole in the dielectric structure. The first through hole passes through the dielectric structure and exposes the first wiring layer. The method includes forming a first conductive via structure and a second conductive via structure in the first through hole and the second through hole respectively. The first conductive via structure is in direct contact with the first wiring layer, and the second conductive via structure is spaced apart from the first wiring layer.

The present disclosure relates to a printed circuit board including: a substrate having a cavity; and a via structure at least partially disposed in the cavity, and the via structure includes a glass layer, a first optical waveguide pattern disposed on the glass layer, and a dielectric layer disposed on the glass layer and covering at least a portion of the first optical waveguide pattern.

An electronic package and a manufacturing method thereof are provided. The electronic package includes a photonic component, an electronic component and an optical component. The photonic component has a first surface and a second surface opposite thereto, and the first surface is defined with an electrical bonding region and an optical coupling region that are non-overlapping with each other. The electronic component is disposed on the electrical bonding region and is electrically connected to the photonic component. The optical component is disposed on the optical coupling region and is optically connected to the photonic component. The above-mentioned electronic package and manufacturing method thereof employ a 2.5-dimensional stack structure for coupling the optical component without forming a cantilever structure. Therefore, the present disclosure achieves the advantages of high heat dissipation efficiency, simplified manufacturing process, higher yield and shorter process cycle.

An electronic device has a plurality of integrated circuits fixed to a support between transmitting and receiving antennas. An integrated circuit generates a synchronization signal supplied to the other integrated circuits. Each integrated circuit is formed in a die integrating electronic components and overlaid by a connection region according to the Flip-Chip Ball-Grid-array or embedded Wafer Level BGA. A plurality of solder balls for each integrated circuit is electrically coupled to the electronic components and bonded between the respective integrated circuit and the support. The solder balls are arranged in an array, aligned along a plurality of lines parallel to a direction, wherein the plurality of lines comprises an empty line along which no solder balls are present. A conductive synchronization path is formed on the support and extends along the empty line of at least one integrated circuit, between the solder balls of the latter.

An optoelectronic package structure and a method of manufacturing an optoelectronic package structure are provided. The optoelectronic package structure includes a photonic component. The photonic component has an electrical connection region, a blocking region and a region for accommodating a device. The blocking region is located between the electrical connection region and the region for accommodating a device.

A method includes bonding a module over a package component. The module includes a substrate and through-vias penetrating through the substrate. The method further includes molding the module in a molding compound, bonding an electronic die on the module, and bonding a photonic die over the electronic die.

A package includes a redistribution structure that includes conductive features and first waveguides; first dies and second dies attached to the redistribution structure, wherein the first dies are different than the second dies, wherein the first dies are electrically connected to respectively corresponding second dies through the redistribution structure; and optical bridge structures attached to the redistribution structure, wherein the optical bridge structures are optically coupled to the first waveguides, wherein the optical bridge structures are electrically connected to respectively corresponding first dies and respectively corresponding second dies through the redistribution structure.