An exemplary semiconductor technology implemented microwave filter includes a dielectric substrate with metal traces on one surface that function as frequency selective circuits and reference ground. A top enclosure encloses the substrate have respective interior recesses with deposited continuous metal coatings. A plurality of metal bonding bumps or bonding wall extends outwardly from the projecting walls of the bottom and top enclosures. The bonding bumps on the top enclosure engage reference ground metal traces on respective surface of the substrate. As a result of applied pressure, the bonding bumps and respective reference ground metal traces together with the through-substrate vias form a metal-to-metal singly-connected ground reference structure for the entire circuitry.

A multi-layer waveguide including at least three physical layers assembled into a multi-layer waveguide. The layers are a top layer, one or more intermediate layer, and a bottom layer. The multi-layer waveguide further includes a waveguide channel being an elongated aperture in at least one intermediate layer. At least one layer has a metasurface on a first surface facing a first adjoining layer, wherein the metasurface surrounds the elongated aperture and comprise thick and thin sections.

The present invention relates to an RF filter assembly for an antenna and, particularly, comprises: a plurality of band pass filters (BPFs); a filter board which is arranged to be stacked on the front surface of a main board and which mediate the coupling of the band pass filters for the front surface of the main board; low pass filters (LPFs) intaglio- or embossed-printed on front surface of the filter board; and an air layer formation pad arranged between the filter board and the band pass filters to form a predetermined air layer between the front surface of the filter board and rear surfaces of the band pass filters, and thus the overall performance of a filter product can be improved by minimizing insertion loss of a filter.

The present invention relates to an RF filter assembly for an antenna and, particularly, comprises: a plurality of band pass filters (BPFs); a filter board which is arranged to be stacked on the front surface of a main board and which mediate the coupling of the band pass filters for the front surface of the main board; low pass filters (LPFs) intaglio- or embossed-printed on front surface of the filter board; and an air layer formation pad arranged between the filter board and the band pass filters to form a predetermined air layer between the front surface of the filter board and rear surfaces of the band pass filters, and thus the overall performance of a filter product can be improved by minimizing insertion loss of a filter.

An object of this invention is to reduce the size of a filter device. Provided is a filter device (1) including: a substrate (11) including a first main surface and a second main surface (111, 112); strip-shaped conductors (12a1 to 12a5) provided to the first main surface (111); and a ground conductor layer (13) provided at least to the second main surface (112), the second main surface (112) having a recessed portion (11ai) provided for each strip-shaped conductor (12ai), the recessed portion (11ai) overlapping the strip-shaped conductor (12ai) in plan view and having a surface covered with the ground conductor layer (13).

An architecture for, and techniques for fabricating, a thermal decoupling device are provided. In some embodiments, thermal decoupling device can be included in a thermally decoupled cryogenic microwave filter. In some embodiments, the thermal decoupling device can comprise a dielectric material and a conductive line. The dielectric material can comprise a first channel that is separated from a second channel by a wall of the dielectric material. The conductive line can comprise a first segment and a second segment that are separated by the wall. The wall can facilitate propagation of a microwave signal between the first segment and the second segment and can reduce heat flow between the first segment and the second segment of the conductive line.

An architecture for, and techniques for fabricating, a thermal decoupling device are provided. In some embodiments, thermal decoupling device can be included in a thermally decoupled cryogenic microwave filter. In some embodiments, the thermal decoupling device can comprise a dielectric material and a conductive line. The dielectric material can comprise a first channel that is separated from a second channel by a wall of the dielectric material. The conductive line can comprise a first segment and a second segment that are separated by the wall. The wall can facilitate propagation of a microwave signal between the first segment and the second segment and can reduce heat flow between the first segment and the second segment of the conductive line.

Disclosed are apparatuses and methods of tuning a radio frequency circuit using stub tuners and photoconductive switches. In one aspect an electromagnetic stub tuner apparatus is disclosed. the apparatus includes a transmission line, and a photoconductive switch positioned along the length of the transmission line. The photoconductive switch is configured to turn on or turn off, wherein an impedance of the transmission line is changed when the photoconductive switch is turned on compared to when the photoconductive switch is turned off. In another aspect, a method of tuning a radio frequency circuit is disclosed. In yet another aspect, a method of producing a radio frequency tuning circuit is disclosed.

The disclosure relates to an electrical component, for example, a surface-mount resonator, including a distributed-element circuit disposed on a dielectric base and separated from an electromagnetic field modification member by a gaseous gap, wherein a frequency characteristic of the electrical component can be tuned by positioning the electromagnetic field modification member relative to the distributed-element circuit using an actuator.

A radio frequency power amplifier with harmonic control circuit as well as method for manufacturing the same are disclosed. According to an embodiment, a radio frequency power amplifier includes: a planar dielectric substrate, a first conductive layer and a second conducting layer. The first conductive layer is disposed on a first side of the planar dielectric substrate. The second conducting layer is disposed on a second side of the planar dielectric substrate. The first conductive layer has a pattern comprising one or more harmonic control circuits. The second conductive layer acts as a ground plane. The second side of the planar dielectric substrate is opposite to the first side of the planar dielectric substrate.