A radio frequency (RF) waveguide comprising a channel, a filter, and a support bridge. The channel can comprise an outer wall defining an inner cavity configured to propagate electromagnetic waves. The filter can be disposed in the inner cavity of the channel and can comprise a perimeter edge and an aperture. The support bridge can comprise a first interface connected to an inner surface of the outer wall at a first location, and a second interface connected to the filter at a position between the perimeter edge and the aperture of the filter to support the filter within the channel. The support bridge can remain in place as connected to the filter, and the filter and waveguide can operate without interference from the support bridge, meaning that the waveguide meets all performance specifications and functions as intended for a particular application even with the support bridge left in place.

A radio frequency (RF) waveguide comprising a channel, a filter, and a support bridge. The channel can comprise an outer wall defining an inner cavity configured to propagate electromagnetic waves. The filter can be disposed in the inner cavity of the channel and can comprise a perimeter edge and an aperture. The support bridge can comprise a first interface connected to an inner surface of the outer wall at a first location, and a second interface connected to the filter at a position between the perimeter edge and the aperture of the filter to support the filter within the channel. The support bridge can remain in place as connected to the filter, and the filter and waveguide can operate without interference from the support bridge, meaning that the waveguide meets all performance specifications and functions as intended for a particular application even with the support bridge left in place.

An electrosurgical apparatus having a feed structure comprising a radiofrequency (RF) channel for conveying RF electromagnetic (EM) radiation from an RF signal generator to a probe and a microwave channel for conveying microwave EM radiation from a microwave signal generator to the probe, wherein the RF channel and microwave channel comprise physically separate signal pathways, wherein the feed structure includes a combining circuit having an input connected to the signal pathway on the RF channel, another input connected to the signal pathway on the microwave channel, and an output connected to a common signal pathway for conveying the RE EM radiation and EM radiation separately or simultaneously to the probe, and wherein the microwave channel includes a waveguide isolator connected to isolate the signal pathway on the microwave channel from the RF EM radiation.

An electrosurgical apparatus having a feed structure comprising a radiofrequency (RF) channel for conveying RF electromagnetic (EM) radiation from an RF signal generator to a probe and a microwave channel for conveying microwave EM radiation from a microwave signal generator to the probe, wherein the RF channel and microwave channel comprise physically separate signal pathways, wherein the feed structure includes a combining circuit having an input connected to the signal pathway on the RF channel, another input connected to the signal pathway on the microwave channel, and an output connected to a common signal pathway for conveying the RE EM radiation and EM radiation separately or simultaneously to the probe, and wherein the microwave channel includes a waveguide isolator connected to isolate the signal pathway on the microwave channel from the RF EM radiation.

Provided is a band-pass filter that includes a plurality of resonators that are electromagnetically coupled to each other. At least one of the plurality of resonators is a specific resonator to which a signal is input from outside or that outputs a signal to the outside. The specific resonator includes a conductor pin, a first surrounding conductor that surrounds the conductor pin in a radial direction, a dielectric that is positioned between the conductor pin and the surrounding conductor, a second surrounding conductor that surrounds the dielectric in an axial direction of the conductor pin, and an intermediate conductor that extends in a direction crossing the axial direction of the conductor pin and that electrically connects the conductor pin to the first surrounding conductor or the second surrounding conductor.

Waveguide interconnects for semiconductor packages are disclosed. An example semiconductor package includes a first semiconductor die, a second semiconductor die, and a substrate positioned between the first and second dies. The substrate includes a waveguide interconnect to provide a communication channel to carry an electromagnetic signal. The waveguide interconnect is defined by a plurality of through substrate vias (TSVs). The TSVs in a pattern around the at least the portion of the substrate to define a boundary of the communication channel.

The present invention relates to a cavity filter and a method of manufacturing the same, and particularly, to a cavity filter including one side cavity and the other side cavity required to have capacitive cross-coupling design, resonant bars respectively provided at centers of one side cavity and the other side cavity, and a vertical post for a notch extending from any one of the resonant bars and extending in a vertical direction in an inner wall that is a boundary between one side cavity and the other side cavity, in which the resonant bar, which is connected to the vertical post for a notch among the resonant bars, is integrated with the vertical post for a notch, thereby providing an advantage of easily manufacturing the cavity filter and easily performing capacitive cross-coupling design.

The present invention relates to a cavity filter and a method of manufacturing the same, and particularly, to a cavity filter including one side cavity and the other side cavity required to have capacitive cross-coupling design, resonant bars respectively provided at centers of one side cavity and the other side cavity, and a vertical post for a notch extending from any one of the resonant bars and extending in a vertical direction in an inner wall that is a boundary between one side cavity and the other side cavity, in which the resonant bar, which is connected to the vertical post for a notch among the resonant bars, is integrated with the vertical post for a notch, thereby providing an advantage of easily manufacturing the cavity filter and easily performing capacitive cross-coupling design.

The present disclosure relates to a transition system, which includes a monolithic microwave integrated circuit (MMIC) package and a printed-circuit-board (PCB) with a number of PCB vias. The MMIC package has a laminate-based body, which includes a substrate integrated waveguide (SIW) structure with a number of SIW vias, and a MMIC die over the laminate-based body. Herein, the SIW structure faces the PCB and is separate from the PCB with a gap in between. The SIW structure is configured to radiate radio frequency (RF) signals received from the MMIC die to the PCB. An arrangement of the PCB vias is scaling-mirrored to an arrangement of the SIW vias, such that each PCB via and a corresponding SIW via have a same relative position. The arrangement of PCB vias is about aligned with the arrangement of the SIW vias.

This application provides an example dielectric filter and an example communications device. The dielectric filter includes a dielectric block. At least two resonant through holes that are parallel to each other are provided in the dielectric block. The resonant through hole is a stepped hole. The stepped hole includes a large stepped hole and a small stepped hole that are arranged coaxially and that are in communication. The small stepped hole passes through a first surface of the dielectric block. The large stepped hole passes through a second surface of the dielectric block. A stepped surface is formed between the large stepped hole and the small stepped hole. The surfaces of the dielectric block are covered with conductor layers. The conductor layers cover the surfaces of the dielectric block and inner walls of the large stepped hole and the small stepped hole. A conductor layer of the inner wall of the large stepped hole is short-circuited with a conductor layer of the second surface. A conductor layer of the inner wall of the small stepped hole is short-circuited with a conductor layer of the first surface. A loop gap that does not cover the conductor layers is provided on the stepped surface. The loop gap is arranged around the small stepped hole.