A multipaction-proof waveguide filter includes a main cavity and a number of corrugations extending from the main cavity. The main cavity includes corrugation interconnect regions between the plurality of corrugations. The corrugation interconnect regions include sloped surfaces, and the corrugations include flared nonparallel sidewalk. Due to the introduced sloped surfaces and flares, an increased Q is achieved, improved roll off is observed and multipaction risks are mitigated.

A multipaction-proof waveguide filter includes a main cavity and a number of corrugations extending from the main cavity. The main cavity includes corrugation interconnect regions between the plurality of corrugations. The corrugation interconnect regions include sloped surfaces, and the corrugations include flared nonparallel sidewalk. Due to the introduced sloped surfaces and flares, an increased Q is achieved, improved roll off is observed and multipaction risks are mitigated.

A filter arrangement for high frequency signals, HF signals, is described. The filter arrangement includes a housing in which there is a cavity that extends in the longitudinal direction of the housing. The waffle-iron arrangement is arranged in the cavity and includes a carrier plate having a plurality of recesses, wherein there is an electrically conductive material arranged in at least some of the recesses, wherein the electrically conductive material in each case forms a pin in the at least some recesses. This structure makes it possible to provide a filter arrangement for very high frequencies, because the structure allows the carrier plate and the pins arranged therein to be provided with very small geometrical dimensions.

A filter arrangement for high frequency signals, HF signals, is described. The filter arrangement includes a housing in which there is a cavity that extends in the longitudinal direction of the housing. The waffle-iron arrangement is arranged in the cavity and includes a carrier plate having a plurality of recesses, wherein there is an electrically conductive material arranged in at least some of the recesses, wherein the electrically conductive material in each case forms a pin in the at least some recesses. This structure makes it possible to provide a filter arrangement for very high frequencies, because the structure allows the carrier plate and the pins arranged therein to be provided with very small geometrical dimensions.

A phased array is disclosed, including: a base layer including a substrate with a plurality of protruding posts, for stopping wave propagation along the base layer, and a printed circuit board (PCB) arranged on the base layer, and including at least one phased array radio frequency (RF) integrated circuit (IC) on a first side of the PCB facing the base layer and the protruding posts. The PCB further includes feeds for transferring of RF signals from the phased array RF IC(s) to an opposite second side of the PCB. A radiating layer, including a plurality of radiating elements for transmitting and/or receiving RF signals from the phased array antenna is also provided, together with a feeding layer for transfer of RF signals, arranged between the feeds of the PCB on the second side and the radiating elements of the radiating layer.

Millimeter wave communications system include an RF printed circuit board structure that includes a phased array antenna that has a plurality of radiating elements and a channel block that includes a plurality of active antenna channels that each feed a respective one of a plurality of sub-groups of the radiating elements. A first sub-set of the active antenna channels are completely positioned on a first side of the phased array antenna and a second sub-set of the active antenna channels each include a first portion that is on a second side of the phased array antenna, the second side being adjacent the first side.

Millimeter wave communications system include an RF printed circuit board structure that includes a phased array antenna that has a plurality of radiating elements and a channel block that includes a plurality of active antenna channels that each feed a respective one of a plurality of sub-groups of the radiating elements. A first sub-set of the active antenna channels are completely positioned on a first side of the phased array antenna and a second sub-set of the active antenna channels each include a first portion that is on a second side of the phased array antenna, the second side being adjacent the first side.

A tunable microwave system includes at least two elements, each element being chosen from a propagating guide, an evanescent guide, a resonator, and at least one coupling device arranged between the two elements and configured to couple the two elements to each other, the coupling device having a holder having an aperture and having at least one elongate element the shape of which is elongate in a polarization direction contained in a plane of the aperture, the elongate element being securely fastened to the perimeter of the aperture at at least one end, the coupling device being configured to be rotatable about an axis substantially perpendicular to the plane of the aperture so as to modify a value of the polarization direction and so that the coupling between the two elements is dependent on the value of the polarization direction.

A bandpass filter has a plurality of resonant cavities. The plurality of resonant cavities are arranged into a sequence of adjacent resonant cavities. Each resonant cavity is configured to define the same fundamental resonant frequency. The filter includes a plurality of coupling irises, with one of the coupling irises positioned between each pair of adjacent resonant cavities. Each resonant cavity includes a plurality of cavity sections. Each resonant cavity includes a capacitive iris positioned coupling the cavity sections to one another. The frequency of secondary resonance modes varies amongst the resonant cavities in the plurality of resonant cavities.

Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a heat source on the substrate, and a heat pipe. The heat pipe includes a plurality of bumps that extend from the heat pipe towards the substrate but do not come into contact with the substrate. The bumps are configured to help mitigate radio frequency interference in the electronic device. More specifically, the bumps can be configured to provide a resonant frequency in a specific radio frequency band and act as a radio frequency filter.