A high-frequency module (100) includes a multilayer board (110) including a plurality of insulator layers and at least one ground conductor layer (113); in the multilayer board (110), a transmission circuit (120) that is a first circuit provided in a first region and an antenna circuit (130) that is a second circuit provided in a second region different from the first region; and shielding conductor films (151 to 156) provided on sides of the multilayer board (110) and being partially in contact with the ground conductor layer (113). The ground conductor layer (113) is not in contact with the shielding conductor films (151 to 156) in, of a side of the multilayer board (110), a portion that is closest both to the first region and to the second region.

The present disclosure relates to the field of antenna technologies and discloses a feeding matching apparatus of a multiband antenna, a multiband antenna, and a radio communication device to improve a bandwidth and efficiency of a lower frequency band. The feeding matching apparatus of a multiband antenna includes: a grounding portion; a feeding portion connected to a signal source, where a signal of the signal source is input into the feeding portion; and two or more ground cable branches with different lengths, where one end of each ground cable branch is electrically connected to the feeding portion, the other end is electrically connected to the grounding portion, at least one ground cable branch is connected in series to a signal filtering component, and the signal filtering component is capable of preventing a signal lower than a frequency point corresponding to the signal filtering component from passing through it.

The present invention includes a method of creating electrical air gap low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. Where a ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

A ring resonator based T-shaped duplexer for use in communication systems, the T-shaped duplexer comprising a T-shaped microstrip duplexer body having a first rectangular-shaped body section and a second rectangular-shaped body section that extends from the first-rectangular shaped section in a perpendicular position relative to the first rectangular-shaped section, three connection ports including a first connection port disposed at an open end of the second rectangular-shaped body section, a second connection port disposed at one end of the first rectangular-shaped body section, and a third connection port disposed at another end of the first rectangular-shaped body section, and two bandpass filters, each bandpass filter comprising a ring resonator structure having a circular shape, an outer edge of the ring resonator structure being connected to the first rectangular-shaped body section of the T-shaped microstrip duplexer body, wherein each of the two bandpass filters creates an Electromagnetically Induced Transparency (EIT) window within a frequency absorption region of the bandpass filter to allow a signal to pass at a pre-tuned frequency band.

A ring resonator based T-shaped duplexer for use in communication systems, the T-shaped duplexer comprising a T-shaped microstrip duplexer body having a first rectangular-shaped body section and a second rectangular-shaped body section that extends from the first-rectangular shaped section in a perpendicular position relative to the first rectangular-shaped section, three connection ports including a first connection port disposed at an open end of the second rectangular-shaped body section, a second connection port disposed at one end of the first rectangular-shaped body section, and a third connection port disposed at another end of the first rectangular-shaped body section, and two bandpass filters, each bandpass filter comprising a ring resonator structure having a circular shape, an outer edge of the ring resonator structure being connected to the first rectangular-shaped body section of the T-shaped microstrip duplexer body, wherein each of the two bandpass filters creates an Electromagnetically Induced Transparency (EIT) window within a frequency absorption region of the bandpass filter to allow a signal to pass at a pre-tuned frequency band.

The present disclosure relates to an interposer (120), which is a circuit board that has a multilayer structure and that establishes a connection between layers using a via conductor. The interposer (120) includes first and second transmission lines that are connected in series and a first stub and a second stub that are respectively connected to the first transmission line and the second transmission line. The first and second stubs are formed by wiring lines provided in respective different layers, and a second transmission line (123), which connects the first stub to the second stub, includes a via conductor and a wiring line provided in the layer where the second stub (124) is formed.

A diplexer is proposed. The diplexer is configured to transmit a first signal having a first frequency and a second signal having a second frequency. The diplexer includes a first transmitting port, a second transmitting port, a third transmitting port, a first frequency band unit and a second frequency band unit. The first transmitting port is configured to transmit the first signal. The second transmitting port is configured to transmit the second signal. The third transmitting port is configured to transmit the first signal and the second signal. The first frequency band unit includes a first filter and a resonant circuit. The first filter is configured to filter the second signal. The resonant circuit is electrically connected to the first filter. The second frequency band unit includes at least one second filter. The at least one second filter is configured to filter the first signal.

A diplexer is proposed. The diplexer is configured to transmit a first signal having a first frequency and a second signal having a second frequency. The diplexer includes a first transmitting port, a second transmitting port, a third transmitting port, a first frequency band unit and a second frequency band unit. The first transmitting port is configured to transmit the first signal. The second transmitting port is configured to transmit the second signal. The third transmitting port is configured to transmit the first signal and the second signal. The first frequency band unit includes a first filter and a resonant circuit. The first filter is configured to filter the second signal. The resonant circuit is electrically connected to the first filter. The second frequency band unit includes at least one second filter. The at least one second filter is configured to filter the first signal.

An exemplary semiconductor technology implemented microwave filter includes a dielectric substrate with metal traces on one surface that function as frequency selective circuits and reference ground. A top enclosure encloses the substrate have respective interior recesses with deposited continuous metal coatings. A plurality of metal bonding bumps or bonding wall extends outwardly from the projecting walls of the bottom and top enclosures. The bonding bumps on the top enclosure engage reference ground metal traces on respective surface of the substrate. As a result of applied pressure, the bonding bumps and respective reference ground metal traces together with the through-substrate vias form a metal-to-metal singly-connected ground reference structure for the entire circuitry.

The present invention includes a method of creating electrical air gap low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. Where a ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.