Patent classifications
H01P1/2135
MULTIPLEXER
A multiplexer includes a first filter, a second filter, a combining wiring line that provides a combination point at which an input or an output of each of the first filter and the second filter is connected to each other, an antenna terminal to connect the multiplexer to an antenna, an antenna wiring line connected at one end to the antenna terminal and connected at the other end to the combining wiring line, a matching terminal to which a matching inductor to provide matching between the antenna and the multiplexer is to be connected, and a matching wiring line to be connected at one end to the matching terminal and connected at the other end to the combining wiring line.
MATCHING MODULE
A matching module includes an inductor pattern including a first inductor pattern and a second inductor pattern, each respectively provided in a spiral shape, and a connection pattern connecting the first inductor pattern and the second inductor pattern and provided in a central region of a dielectric sheet, and a capacitor pattern provided in an edge region of the dielectric sheet and configured to form mutual capacitance with the inductor pattern, wherein rotational directions of the first inductor pattern and the second inductor pattern that are provided in the spiral shape are the same.
Double-sided circuit
The present disclosure provides circuits and methods for fabricating circuits. A circuit may include an insulator having a first surface, a second surface, a periphery, a first subset of circuit elements disposed on the first surface, a second subset of circuit elements disposed on the second surface, and at least one conductive sidewall disposed on the periphery, wherein the conductive sidewall electrically couples the first subset of circuit elements to the second subset of circuit elements.
Feeding matching apparatus of multiband antenna, multiband antenna, and radio communication device
The present disclosure relates to the field of antenna technologies and discloses a feeding matching apparatus of a multiband antenna, a multiband antenna, and a radio communication device to improve a bandwidth and efficiency of a lower frequency band. The feeding matching apparatus of a multiband antenna includes: a grounding portion; a feeding portion connected to a signal source, where a signal of the signal source is input into the feeding portion; and two or more ground cable branches with different lengths, where one end of each ground cable branch is electrically connected to the feeding portion, the other end is electrically connected to the grounding portion, at least one ground cable branch is connected in series to a signal filtering component, and the signal filtering component is capable of preventing a signal lower than a frequency point corresponding to the signal filtering component from passing through it.
High-frequency filter and communication device module
A signal transmission cable including a high-Q value band-elimination filter includes a first signal line conductor pattern including a first capacitor conductor portion and an inductor conductor portion on a first base layer. The first capacitor conductor portion includes a flat conductor, and the inductor conductor portion has a spiral shape. A second signal line conductor pattern including a second capacitor conductor portion is provided on a second base layer. The inductor conductor portion constitutes an inductor, and the first and second capacitor conductor portions and the first base layer constitute a capacitor. The inductor and the capacitor are connected in parallel by transmission conductor portions on the first and second base layers and an interlayer-connector conductor on the first base layer.
Tuning element for radio frequency resonator
A filter apparatus includes a first conductive signal line configured to form a first radio frequency resonator; a second conductive signal line configured to form a second radio frequency resonator; a cross-coupling element comprising a first electrode arranged to couple capacitively to the first conductive signal line, a second electrode arranged to couple capacitively to the second conductive signal line, and an electrically conductive signal line coupling the first electrode to the second electrode. The cross-coupling element is bendable with respect to the first conductive signal line and the second conductive signal line to adjust the capacitive coupling.
Filter assemblies, tuning elements and method of tuning a filter
The present invention provides filter assemblies, tuning elements and a method of tuning a filter. A filter assembly includes a housing having a top cover, a bottom cover and at least one sidewall, the top cover, the bottom cover and the at least one sidewall defining an internal cavity, the housing configured to receive first through third radio frequency (RF) transmission lines; a top metal sheet mounted within the internal cavity that has a plurality of openings that form a first hole pattern; and a bottom metal sheet mounted within the internal cavity that has a plurality of openings that form a second hole pattern. The top and bottom metal sheets are vertically spaced-apart from each other in a vertically stacked relationship within the internal cavity. The top metal sheet and the bottom metal sheet each include at least one resonator.
RF modules with an enclosure having a micromachined interior using semiconductor fabrication
An exemplary RF module includes a dielectric substrate with metal traces on one surface that connect high frequency components and provide reference ground. Other metal traces on the other surface of the substrate also provide high frequency transmission lines and reference ground. An enclosure made using semiconductor manufacturing technology is mounted to the substrate and has conductive interior recesses defined by extending walls that are connected to the reference ground. The recesses surround the respective components and provide electromagnetic shielding. The dimensional precision in the location and smoothness of the walls and recesses due to the semiconductor manufacturing technology provides repeatable unit-to-unit RF characteristics of the RF module. One way of mounting the enclosure to the substrate uses a plurality of metal bonding bumps extending outwardly from the walls to engage reference ground metal traces on the substrate. Applied pressure deforms the bonding bumps to form a metal-to-metal bond.
Irreversible circuit element and module
An irreversible circuit element includes first and second high pass isolators each including first and second center electrodes intersecting with and being insulated from each other on a ferrite to which a direct-current magnetic field is applied with a permanent magnet. One end of the first center electrode is an output port and the other end thereof is an input port, and one end of the second center electrode is another output port and the other end thereof is a ground port. A pass frequency band of the first isolator is higher than a pass frequency band of the second isolator. Respective output portions of the first and second isolators are electrically connected and defined as one output terminal, and a low pass filter LPF is inserted between the output terminal and the output port of the second isolator.
HIGH-FREQUENCY FILTER AND COMMUNICATION DEVICE MODULE
A signal transmission cable including a high-Q value band-elimination filter includes a first signal line conductor pattern including a first capacitor conductor portion and an inductor conductor portion on a first base layer. The first capacitor conductor portion includes a flat conductor, and the inductor conductor portion has a spiral shape. A second signal line conductor pattern including a second capacitor conductor portion is provided on a second base layer. The inductor conductor portion constitutes an inductor, and the first and second capacitor conductor portions and the first base layer constitute a capacitor. The inductor and the capacitor are connected in parallel by transmission conductor portions on the first and second base layers and an interlayer-connector conductor on the first base layer.