A high frequency termination device includes a printed circuit board. A ground pad having a first predetermined inductive reactance at a resonant frequency can be mounted on the printed circuit board. A resistor landing pad having a second predetermined inductive reactance at the resonant frequency can be mounted on the printed circuit board. The resistor landing pad can be selectively positioned adjacent to the ground pad to create a desired capacitive reactance at the resonant frequency to cancel at least part of the first predetermined inductive reactance and the second predetermined inductive reactance. A terminating resistor can be coupled with the resistor landing pad. An impedance of the termination device is dominated by a resistance value of the terminating resistor at the resonant frequency due to cancellation of at least part of the first predetermined inductive reactance and the second predetermined inductive reactance at the resonant frequency.

The present invention is directed to an RF termination device that includes a substrate having a first meandered transmission line disposed on a first surface thereof. The meandered first transmission line has a predetermined first transmission line length and a characteristic impedance substantially equal to twice the predetermined system impedance. One end of the first meandered transmission line is configured as an open circuit. A second meandered transmission line is disposed on the first major surface adjacent the first meandered transmission line. The meandered second transmission line has a predetermined second transmission line length and a characteristic impedance substantially equal to twice the predetermined system impedance. One end of the second meandered transmission line is coupled to the other end of the first transmission line and the other end is coupled to ground.

Embodiments of the present disclosure are directed toward techniques and configurations for electrical signal absorption in an interconnect disposed in a printed circuit board (PCB) assembly. In one instance, a PCB assembly may comprise a substrate, and an interconnect formed in the substrate to route an electrical signal within the PCB. The interconnect may be coupled with a connecting component that is disposed on a surface of the PCB. An absorbing material may be disposed on the PCB to be in direct contact with at least a portion of the connecting component to at least partially absorb a portion of the electrical signal. Other embodiments may be described and/or claimed.

A downhole energy transmission system is described. The system can include a casing string having a number of casing pipe disposed within a wellbore, where the casing string has at least one wall forming a cavity. The system can also include a remote electrical device disposed within the cavity of the casing string at a first location. The system can further include a first stripline cable disposed on an outer surface of the casing string, where the first stripline cable transmits a first energy received from an energy source. The system can also include a second stripline cable disposed adjacent to the first stripline cable at the first location, where the second stripline cable is electrically coupled to the remote electrical device.

A high frequency termination device includes a printed circuit board. A ground pad having a first predetermined inductive reactance at a resonant frequency can be mounted on the printed circuit board. A resistor landing pad having a second predetermined inductive reactance at the resonant frequency can be mounted on the printed circuit board. The resistor landing pad can be selectively positioned adjacent to the ground pad to create a desired capacitive reactance at the resonant frequency to cancel at least part of the first predetermined inductive reactance and the second predetermined inductive reactance. A terminating resistor can be coupled with the resistor landing pad. An impedance of the termination device is dominated by a resistance value of the terminating resistor at the resonant frequency due to cancellation of at least part of the first predetermined inductive reactance and the second predetermined inductive reactance at the resonant frequency.

A terminator has an upper dielectric layer provided on an upper broad wall of a post-wall waveguide, and a microstrip line (MSL) provided on the upper dielectric layer. A blind via has one end thereof connected with one end of the MSL and is inserted inside the post-wall waveguide. A chip resistor has one end thereof connected with the other end of the MSL and has the other end thereof connected with the upper broad wall.

The disclosure relates to a radar system for registering the environment for a motor vehicle, with a circuit board includes a wave termination with a termination line, a signal line connected to it for the transmission of a high frequency signal, and a first substrate layer which is produced from a material with a first loss factor. The radar system also includes a first tier attached onto the first substrate layer, which includes the signal line, a second substrate layer which is produced from a second material with a second loss factor, which is greater than the first loss factor, and a second tier applied to the second substrate layer, which includes the termination line. Additionally, the disclosure relates to a circuit board for such a radar system.

A high-frequency high-power terminator is disclosed. Specifically, the high-frequency high-power terminator has a new structure which uses a resistive element in a distributed element form to achieve broadband matching and to have improved rated power.

An attenuator module having a substrate; a attenuator disposed on one surface of the substrate, the attenuator having an input terminal at one end of the attenuator and an output terminal at an opposite end of the attenuator; an electrical conductor disposed on an opposite surface of the substrate; and an electrically conductive via passing from the output terminal through the substrate to the electrical conductor disposed on the opposite surface of the substrate.

A downhole energy transmission system is described. The system can include a casing string having a number of casing pipe disposed within a wellbore, where the casing string has at least one wall forming a cavity. The system can also include a remote electrical device disposed within the cavity of the casing string at a first location. The system can further include a first stripline cable disposed on an outer surface of the casing string, where the first stripline cable transmits a first energy received from an energy source. The system can also include a second stripline cable disposed adjacent to the first stripline cable at the first location, where the second stripline cable is electrically coupled to the remote electrical device.