H01P3/081

FILTER DEVICE
20230216165 · 2023-07-06 · ·

An object of this invention is to reduce the size of a filter device. Provided is a filter device (1) including: a substrate (11) including a first main surface and a second main surface (111, 112); strip-shaped conductors (12a1 to 12a5) provided to the first main surface (111); and a ground conductor layer (13) provided at least to the second main surface (112), the second main surface (112) having a recessed portion (11ai) provided for each strip-shaped conductor (12ai), the recessed portion (11ai) overlapping the strip-shaped conductor (12ai) in plan view and having a surface covered with the ground conductor layer (13).

REMOVABLE CONTACTLESS PROBE
20220413012 · 2022-12-29 ·

A system may include a printed circuit board with a microstrip and a conductive structure surrounding the microstrip. The system may include a probe lead in communication with the conductive structure. The system may include a first contact pad electrically connected to the conductive structure and a second contact pad electrically connected to the conductive structure.

Signal transmission circuit and printed circuit board
11540383 · 2022-12-27 · ·

A signal transmission circuit includes a printed circuit board including a surface layer including a signal transmission path that transmits a signal, a signal line through hole that connects the signal transmission path with a signal layer arranged in an inner layer of the printed circuit board, a ground layer of the inner layer of the printed circuit board that forms a return current transmission path for the signal transmission path, and a ground through hole that is connected to the ground layer adjacent to the signal line through hole. A ground pattern including ground areas disposed with a certain distance therebetween and a side ground area connected with at least one end side of the ground areas is disposed at positions of both sides of the signal transmission path. The ground through hole is disposed to connect the ground pattern with the ground layer.

Radio frequency device
20220407208 · 2022-12-22 · ·

A transition unit providing a radio frequency signal transition between a radio frequency hollow waveguide system and a planar transmission line comprises two or more transition sections of transmission line arranged adjacent to each other at a first surface of the first substrate layer of a substrate layer arrangement. The hollow waveguide system comprises a distribution section. One input waveguide is separated into one dedicated output waveguide for each of the transition sections. For each of the transition sections of the transmission lines a corresponding end section of a respective output waveguide is directed perpendicular to the first surface of the first substrate layer. For each end section an open end of the end section of the waveguide system superposes the corresponding transition section. The two or more end sections are arranged adjacent to each other in order to provide for favorable boundary conditions for electromagnetic wave propagation.

Radio frequency power amplifier with harmonic control circuit as well as method for manufacturing the same

A radio frequency power amplifier with harmonic control circuit as well as method for manufacturing the same are disclosed. According to an embodiment, a radio frequency power amplifier includes: a planar dielectric substrate, a first conductive layer and a second conducting layer. The first conductive layer is disposed on a first side of the planar dielectric substrate. The second conducting layer is disposed on a second side of the planar dielectric substrate. The first conductive layer has a pattern comprising one or more harmonic control circuits. The second conductive layer acts as a ground plane. The second side of the planar dielectric substrate is opposite to the first side of the planar dielectric substrate.

PACKAGED TRANSISTOR AMPLIFIERS THAT INCLUDE INTEGRATED PASSIVE DEVICE MATCHING STRUCTURES HAVING DISTRIBUTED SHUNT INDUCTANCES
20220392857 · 2022-12-08 ·

A packaged RF transistor amplifier includes an RF transistor amplifier die having a first terminal, a first lead, an integrated passive device that includes a first series microstrip transmission line, a first bond wire coupled between the first terminal and the first series microstrip transmission line, and a second bond wire coupled between the first series microstrip transmission line and the first lead.

Multi-mode transmission line and storage device including the same

A multi-mode transmission line includes a first and second conductive layers, first and second waveguide walls, a strip line, and a blind conductor. The second conductive layer that is formed over the first conductive layer. The first waveguide wall is elongated in a first direction and is in contact with the first conductive layer and the second conductive layer in a vertical direction. The second waveguide wall is elongated in the first direction parallel to the first waveguide wall and is in contact with the first conductive layer and the second conductive layer in the vertical direction. The strip line is formed between the first and second conductive layers and between the first and second waveguide walls. The blind conductor is connected to one of the first conductive layer, the second conductive layer, the first waveguide wall, or the second waveguide wall.

High-Frequency Line Connecting Structure
20220384928 · 2022-12-01 ·

A high-frequency line substrate is mounted on a printed circuit board. The printed circuit board includes a first high-frequency line. The high-frequency line substrate includes a second high-frequency line and lead pins that connect the first high-frequency line and the second high-frequency line. At the contact portions between the signal lead pins and the second high-frequency line of the high-frequency line substrate, and at the contact portions between the ground lead pins and the second high-frequency line of the high-frequency line substrate, the height of the ground lead pins from an upper surface of the printed circuit board is greater than the height of the signal lead pins.

Laminated body having a substrate with an electrical conductor thereon that associated with a functional layer

The present invention relates to a laminated body with electric conductor including a substrate; a functional layer having at least an adhesive layer; an electric conductor; and a protective material, wherein the substrate, the functional layer having at least the adhesive layer, the electric conductor, and the protective material are sequentially laminated in a thickness direction, and wherein a thickness of the functional layer is less than or equal to 0.300 mm.

DISPLAY PANEL AND DISPLAY APPARATUS
20220373837 · 2022-11-24 ·

The disclosure provides a display panel and a display apparatus, and belongs to the field of display technology. The display panel includes a display backplane and an antenna structure; the display panel further includes a frequency selective surface on a side of the antenna structure close to a light exit surface of the display panel; the frequency selective surface is configured to transmit an electromagnetic wave with a specific frequency, so as to enhance a radiation gain of the antenna structure.