A multilayer board includes a layered body including insulating base material layers that are laminated, and first and second signal lines, a first ground conductor including a first opening, a second ground conductor, a third ground conductor, and an interlayer connecting conductor. The first signal line overlaps the first opening when seen in a layering direction. The second signal line is provided on a layer different from a layer including the first signal line and includes a portion extending side by side with the first signal line when seen in the Z-axis direction. The first, second, and third ground conductors are connected by the interlayer connecting conductor. The third ground conductor is disposed on a layer including the first signal line or a layer positioned between the first signal line and the second signal line.

A transmission line device includes a first multilayer substrate with a transmission line including laminated insulating base materials and a conductor pattern on the insulating base materials, and a second multilayer substrate defining a connected member to which the transmission line of the first multilayer substrate is connected. The conductor pattern includes a signal conductor pattern and a signal electrode pad electrically connected to the signal conductor pattern. The first multilayer substrate includes a resist film provided on a surface of a laminate of the insulating base materials, and the resist film includes an opening that is separated from an outer edge of the signal electrode pad in a surface direction of the laminate of the insulating base material and exposes the signal electrode pad.

Structures for a microstrip transmission line and methods of forming a microstrip transmission line. The microstrip transmission line includes a signal line, a shield, and multiple wiring structures connected to the signal line. Each wiring structure extends from a portion of the signal line toward the shield, and each wiring structure includes a metal feature that is positioned adjacent to the shield.

Electronic structures including a dual-stripline with crosstalk cancellation are described. In an example, a printed circuit board (PCB), a package substrate or a semiconductor die includes a dual-stripline structure. The dual-stripline structure includes a first region including a first top line vertically over a first bottom line, and a second top line vertically over a second bottom line. The dual-stripline structure also includes a second region including the first top line vertically over the second bottom line, and the second top line vertically over the first bottom line. The dual-stripline structure also includes a transition region between the first region and the second region. The first bottom line and the second bottom line cross in the transition region.

A signal transmission line includes a laminate, a signal conductor, a hollow portion, and a reinforcing conductor. The laminate includes a flexible laminate including resin layers each of which has flexibility. The signal conductor extends in a signal transmission direction of the laminate and is disposed in an intermediate position in a laminating direction of the resin layers. The hollow portion is in the laminate and defined by an opening provided at a portion of the plurality of resin layers. The reinforcing conductor is in the laminate. The hollow portion is disposed at a position overlapping with the signal conductor, in a plan view of the laminate from a surface perpendicular or substantially perpendicular to the laminating direction. The reinforcing conductor is disposed at a position different from the position of the hollow portion in a plan view.

A system and method for vertically integrating heterogeneous devices into a 3D tile architecture are disclosed. The system uses high precision microelectronics fabrication techniques and known-good-die to achieve high yield to integrate devices to process radio frequency signals at microwave frequencies of approximately 300 MHz to 300 GHz and above. The inventive architecture is based on a high density of small diameter vias to manage the integrity of electrical interconnects and simplify electrical routing.

A transmission line includes first, second, and third signal lines defining a parallel portion. No conductor connecting the first ground conductor and the second ground conductor is between the first signal line and the second signal line, and the first signal line is closer to the ground connection conductor than the second signal line. A closest frequency difference between a fundamental wave of one of the first signal and the second signal and a fundamental wave or a higher harmonic wave of the other of the first signal and the second signal is equal to or larger than a closest frequency difference between a fundamental wave of one of the first signal and the third signal and a fundamental wave or a higher harmonic wave of the other of the first signal and the third signal.

Provided is a rapid over-the-air (OTA) production line test platform, including a device under test (DUT), an antenna array and two reflecting plates. The DUT has a beamforming function. The antenna array is arranged opposite to the DUT, and emits beams with beamforming. Two reflecting plates are disposed opposite to each other, and are arranged between the DUT and the antenna array. The beam OTA test of the DUT is carried out by propagation of the beams between the antenna array, the DUT and the two reflecting plates. Accordingly, the test time can be greatly shortened and the cost of test can be effectively reduced. In addition to the above-mentioned rapid OTA production line test platform, platforms for performing the OTA production line test by using horn antenna arrays together with bending waveguides and using a 3D elliptic curve are also provided.

A transmission line includes a first interlayer connection conductor connecting a first signal conductor and a first mounting electrode, a second interlayer connection conductor connecting a second signal conductor and a second mounting electrode, a third and fourth interlayer connection conductors respectively including third and fourth interlayer connection conductors, and each connecting first and second ground conductors between the first and second signal conductors. The third interlayer connection conductor is closer to the first and second interlayer connection conductors than the fourth interlayer connection conductor is, an adjacent distance between two of the fourth interlayer connection conductors is greater than an adjacent distance between two of the third interlayer connection conductors, and the adjacent distance between the two fourth interlayer connection conductors is less than about ½ of a minimum wavelength of signals transmitted by the first signal conductor and the second signal conductor.

A multilayer transmission line includes a multilayer substrate. The multilayer substrate includes a plurality of conductor layers stacked in a predetermined direction with dielectric layers interposed therebetween. The conductor layers in an inner layer part include ground planes, respectively. The inner layer part includes a conductor hole part. The conductor hole part is provided penetrating the respective ground planes in the inner layer part in the predetermined direction. The conductor hole part includes a conductor part to electrically connect the ground planes together. The conductor layer in an outer layer part includes a transmission line and a conversion part. The outer layer part includes the conductor layer as the outermost layer and an inner conductor layer.