The present disclosure relates to an interposer (120), which is a circuit board that has a multilayer structure and that establishes a connection between layers using a via conductor. The interposer (120) includes first and second transmission lines that are connected in series and a first stub and a second stub that are respectively connected to the first transmission line and the second transmission line. The first and second stubs are formed by wiring lines provided in respective different layers, and a second transmission line (123), which connects the first stub to the second stub, includes a via conductor and a wiring line provided in the layer where the second stub (124) is formed.

A transmission line device includes a first multilayer substrate with a transmission line including laminated insulating base materials and a conductor pattern on the insulating base materials, and a second multilayer substrate defining a connected member to which the transmission line of the first multilayer substrate is connected. The conductor pattern includes a signal conductor pattern and a signal electrode pad electrically connected to the signal conductor pattern. The first multilayer substrate includes a resist film provided on a surface of a laminate of the insulating base materials, and the resist film includes an opening that is separated from an outer edge of the signal electrode pad in a surface direction of the laminate of the insulating base material and exposes the signal electrode pad.

A transmission line includes a laminated insulating body including insulating base material layers that are laminated, signal conductors provided inside the laminated insulating body and extending in a transmission direction along the insulating base material layer, and ground conductors sandwiching the signal conductors in a lamination direction via the insulating base material layers. The transmission line includes at least one curved portion that is bent along a plane orthogonal to the lamination direction. The signal conductors are separated from each other in a direction orthogonal to the transmission direction when viewed in the lamination direction and include a first signal conductor on an inner side and a second signal conductor on an outer side in the curved portion. An interval between the ground conductors sandwiching the first signal conductor is narrower than an interval between the ground conductors sandwiching the second signal conductor.

A signal via has a via diameter that causes a high-frequency signal to be propagated through a high-frequency transmission line using multi mode transmission (multi-mode interference transmission). At least one of the inter-via distance between the signal via and respective ground vias, the via diameter, and the thickness of the multilayer substrate is determined to introduce the high-frequency signal from the interlayer transmission line to the signal lines in the high-intensity region of the multi mode transmission.

Embodiments of the invention include a packaged device with transmission lines that have an extended thickness, and methods of making such device. According to an embodiment, the packaged device may include a first dielectric layer and a first transmission line formed over the first dielectric layer. Embodiments may then include a second dielectric layer formed over the transmission line and the first dielectric layer. According to an embodiment, a first line via may be formed through the second dielectric layer and electrically coupled to the first transmission line. In some embodiments, the first line via extends substantially along the length of the first transmission line.

In a transmission line, a first ground conductor pattern and a second ground conductor pattern are connected through a first interlayer connecting conductor, and the first ground conductor pattern and a third ground conductor pattern are connected through a second interlayer connecting conductor. A first signal conductor pattern includes a first bypassing pattern portion that bypasses the first interlayer connecting conductor, and a second signal conductor pattern includes a second bypassing pattern portion that bypasses the second interlayer connecting conductor. Bypassing directions of the first bypassing pattern portion and the second bypassing pattern portion are opposite to each other.

A signal transmission line includes a laminate, a signal conductor, a hollow portion, and a reinforcing conductor. The laminate includes a flexible laminate including resin layers each of which has flexibility. The signal conductor extends in a signal transmission direction of the laminate and is disposed in an intermediate position in a laminating direction of the resin layers. The hollow portion is in the laminate and defined by an opening provided at a portion of the plurality of resin layers. The reinforcing conductor is in the laminate. The hollow portion is disposed at a position overlapping with the signal conductor, in a plan view of the laminate from a surface perpendicular or substantially perpendicular to the laminating direction. The reinforcing conductor is disposed at a position different from the position of the hollow portion in a plan view.

A transmission line device includes: a plurality of electrically conductive members stacked with interspaces therebetween, the plurality of electrically conductive members including three or more electrically conductive members; and a plurality of artificial magnetic conductors each located between two adjacent electrically conductive members among the plurality of electrically conductive members. Among the plurality of electrically conductive members, at least one electrically conductive member located between two endmost electrically conductive members is shaped as a plate having at least one slit. At least a portion of the plurality of artificial magnetic conductors is located around the at least one slit to suppress leakage of an electromagnetic wave propagating along the at least one slit.

A multi-mode transmission line includes a first and second conductive layers, first and second waveguide walls, a strip line, and a blind conductor. The second conductive layer that is formed over the first conductive layer. The first waveguide wall is elongated in a first direction and is in contact with the first conductive layer and the second conductive layer in a vertical direction. The second waveguide wall is elongated in the first direction parallel to the first waveguide wall and is in contact with the first conductive layer and the second conductive layer in the vertical direction. The strip line is formed between the first and second conductive layers and between the first and second waveguide walls. The blind conductor is connected to one of the first conductive layer, the second conductive layer, the first waveguide wall, or the second waveguide wall.

Disclosed are a phase scanning array antenna and a mobile terminal. The phase scanning array antenna includes an antenna layer, a first ground layer, a first transmission layer, a second ground layer, a second transmission layer and a third ground layer arranged in stacks, wherein the antenna layer includes a plurality of antenna elements, the first ground layer, the first transmission layer, the second ground layer, the second transmission layer and the third ground layer form a non-planar Butler feed network feeding power to the antenna layer, the non-planar Butler feed network includes a plurality of input terminals arranged on the second transmission layer and a plurality of output terminals arranged on the first transmission layer, each of the input terminals is electrically connected with each of the output terminals.